Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1326C: High-Performance Xilinx Spartan-II FPGA Overview

Product Details

The XC2S200-6FGG1326C is a prominent member of the Xilinx Spartan-II family, designed to provide a cost-effective yet powerful solution for high-volume consumer electronics and industrial applications. This Field Programmable Gate Array (FPGA) leverages advanced 0.18-micron process technology to deliver a balance of high logic density and versatile I/O capabilities.

By utilizing the XC2S200-6FGG1326C, engineers can implement complex digital circuits with the flexibility of programmable logic, ensuring rapid time-to-market for innovative hardware designs.

Key Specifications of the XC2S200-6FGG1326C

Understanding the technical boundaries of the Spartan-II series is essential for optimal system integration. The following table summarizes the core hardware specifications for this specific device.

Feature Specification
System Gates 200,000
Logic Cells 5,292
Block RAM Bits 57,344
Maximum User I/O 284
Speed Grade -6 (High Performance)
Operating Temperature 0°C to 85°C (Commercial)
Voltage Supply 2.5V (Internal Core)

Advanced Features of Xilinx Spartan-II FPGA Technology

The Spartan-II architecture is built upon the proven Virtex-E framework, offering a robust set of features that simplify complex board-level challenges.

Flexible Architecture and I/O Standards

The XC2S200-6FGG1326C supports a wide array of signaling standards, making it compatible with various peripheral components. It features SelectI/O technology, which allows for independent signaling on each bank.

  • Support for LVTTL, LVCMOS2, PCI, and GTL.

  • Full compatibility with 3.3V, 2.5V, and 1.8V logic levels.

  • High-speed memory interfaces for efficient data processing.

Performance and Speed Grade

With a speed grade of -6, this FPGA is optimized for high-frequency operations. It includes four dedicated Delay-Locked Loops (DLLs) for clock mirroring and deskewing, which are critical for maintaining signal integrity in high-speed digital systems.

Technical Data and Electrical Characteristics

For hardware designers, precise electrical data is necessary to ensure stable power delivery and thermal management.

Parameter Symbol Value
Core Supply Voltage VCCINT 2.375V to 2.625V
I/O Supply Voltage VCCO 1.14V to 3.465V
Input Threshold Low VIL Max 0.8V (LVTTL)
Input Threshold High VIH Min 2.0V (LVTTL)
Package Type FGG1326 Fine-pitch Ball Grid Array

Applications and Use Cases for XC2S200-6FGG1326C

The versatility of the XC2S200-6FGG1326C makes it suitable for a broad range of sectors. Because it provides a high gate count at a low cost-per-gate, it is frequently used in:

  1. Industrial Automation: Handling sensor fusion and motor control logic.

  2. Telecommunications: Implementing bridge logic between different protocol standards.

  3. Consumer Electronics: Powering high-definition displays and digital signal processing.

  4. Legacy System Support: Serving as a reliable replacement in established hardware infrastructures.

Why Choose Spartan-II for Your Design?

Choosing the right FPGA involves balancing performance, power, and price. The Spartan-II series remains a popular choice because it provides a predictable path from prototype to mass production. Its non-volatile configuration options and extensive library of intellectual property (IP) cores reduce development overhead.

If you are looking for comprehensive resources on Xilinx solutions, including technical datasheets and procurement options, visit the Xilinx FPGA resource page for more information.

Conclusion

The XC2S200-6FGG1326C stands out as a reliable, high-density programmable logic device. Whether you are developing a new industrial controller or maintaining a sophisticated communication hub, the Spartan-II architecture provides the stability and performance required for modern electronics. By leveraging its 200k system gates and flexible I/O, developers can achieve complex functionality without the high costs associated with high-end FPGA families.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.