Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1325C: High-Performance Xilinx Spartan-2 FPGA Overview

Product Details

The XC2S200-6FGG1325C is a core member of the Xilinx Spartan-2 family, designed to provide a cost-effective yet powerful solution for high-volume electronic applications. As digital systems become more complex, the need for flexible, field-programmable gate arrays (FPGAs) has increased. Consequently, the XC2S200 series remains a reliable choice for engineers looking for a balance between performance and power efficiency.

The XC2S200-6FGG1325C offers a significant logic density that allows for the integration of multiple system functions into a single chip. By utilizing an advanced 0.22µm process, Xilinx has ensured that this FPGA delivers high speed and low power consumption, making it ideal for consumer electronics and industrial control systems.

Key Features of the XC2S200-6FGG1325C FPGA

When evaluating the XC2S200-6FGG1325C, several features stand out that distinguish it from standard microcontrollers. First and foremost, its architecture is optimized for high-speed logic operations. Furthermore, the device supports multiple I/O standards, which enhances its versatility in diverse hardware environments.

  • High Logic Capacity: Offers up to 200,000 system gates.

  • Flexible I/O: Supports a wide range of signaling standards including LVTTL, LVCMOS, and PCI.

  • Internal Memory: Features dedicated block RAM for efficient data storage and buffering.

  • Low Power Consumption: Optimized for 2.5V core voltage operation.

XC2S200-6FGG1325C Technical Specifications

Understanding the technical data is crucial for hardware design. The following tables provide a detailed breakdown of the XC2S200-6FGG1325C parameters.

Table 1: Core Performance Metrics

Parameter Specification
Logic Cells 5,292
System Gates 200,000
CLB Array 28 x 42
Maximum User I/O 284
Differential I/O Pairs 120

Table 2: Electrical and Thermal Characteristics

Feature Details
Core Voltage (Vccint) 2.5V
I/O Voltage (Vcco) 1.5V to 3.3V
Speed Grade -6 (High Speed)
Operating Temperature 0°C to 85°C (Commercial)
Package Type FBGA-1325 (Fine-Pitch Ball Grid Array)

Applications of the Xilinx Spartan-2 Series

Because of its robust architecture, the XC2S200-6FGG1325C is frequently utilized in various high-demand sectors. For instance, it is a popular choice for telecommunications infrastructure where data throughput is critical. Additionally, it serves as an excellent platform for digital signal processing (DSP) tasks.

Common application areas include:

  1. Industrial Automation: Handling complex motor control and sensor fusion.

  2. Consumer Electronics: Providing logic for display controllers and digital interfaces.

  3. Data Communications: Implementing custom protocols and high-speed bridges.

  4. Legacy System Support: Ideal for maintaining older industrial hardware that requires specific logic configurations.

Why Choose Xilinx Spartan-2 Technology?

Choosing the right FPGA involves balancing cost and capability. The Spartan-2 series, specifically the XC2S200-6FGG1325C, provides an entry point into high-gate-count designs without the premium price of high-end Virtex chips. Moreover, the availability of comprehensive design tools from Xilinx simplifies the development cycle, allowing for faster time-to-market.

If you are looking for high-quality components and technical support for your next project, you can find more information about the Xilinx FPGA to ensure you select the correct part for your specific requirements.

Conclusion

In summary, the XC2S200-6FGG1325C is a versatile and efficient FPGA that continues to meet the needs of modern digital design. Its combination of high gate density, flexible I/O options, and proven reliability makes it a staple in the semiconductor industry. Whether you are developing a new prototype or maintaining an existing system, this Spartan-2 device offers the performance necessary for success.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.