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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1321C Xilinx Spartan-II FPGA: Features, Specs, and Applications

Product Details

XC2S200-6FGG1321C Xilinx Spartan-II FPGA: Features, Specs, and Applications

The XC2S200-6FGG1321C is a prominent member of the Xilinx Spartan-II Field Programmable Gate Array (FPGA) family. Designed to bridge the gap between high-performance system requirements and low-cost consumer expectations, this device offers a robust 200,000 system gates. Whether you are maintaining legacy systems or designing cost-sensitive industrial applications, the XC2S200-6FGG1321C provides a versatile platform for digital logic integration.

Key Features of the XC2S200-6FGG1321C FPGA

The Spartan-II family, particularly the XC2S200-6FGG1321C, is engineered using a high-volume 0.22µm process. This ensures both cost-efficiency and reliable performance. Below are the standout features:

  • High Logic Capacity: Offers 200,000 system gates and 5,292 logic cells.

  • Versatile I/O Standards: Supports 16 high-performance I/O standards, including LVTTL, LVCMOS2, PCI, and GTL.

  • Internal Block RAM: Features 56K bits of fast block RAM for data buffering and storage.

  • Low Power Consumption: Operates on a 2.5V core voltage with 3.3V I/O tolerance.

  • Flexible Packaging: The FGG1321 package provides an optimized footprint for complex routing and high-density PCB designs.

XC2S200-6FGG1321C Technical Specifications Table

To help engineers and procurement specialists, the following table outlines the core technical parameters of the XC2S200-6FGG1321C.

Parameter Specification
Part Number XC2S200-6FGG1321C
Series Spartan-II
Number of Logic Cells 5,292
System Gates 200,000
Total RAM Bits 57,344
Number of I/Os Flexible (Based on package configuration)
Operating Supply Voltage 2.5 V (Core)
Speed Grade -6
Operating Temperature 0°C ~ 85°C (Commercial)
Package / Case FGG1321 (Fine-pitch BGA)

Advanced Architecture and Performance

The XC2S200-6FGG1321C utilizes an architecture derived from the Virtex series, which means it inherits advanced features like four dedicated Delay-Locked Loops (DLLs) for clock management. This allows for precise clock distribution and minimal skew, which is critical for high-speed synchronous designs.

Optimized Logic and Memory

The logic is organized in Configurable Logic Blocks (CLBs), which are highly efficient for implementing complex arithmetic functions and state machines. With the inclusion of dedicated carry logic, the XC2S200-6FGG1321C excels in digital signal processing (DSP) tasks that require high-speed addition and multiplication.

Flexible I/O System

One of the primary reasons designers choose the XC2S200-6FGG1321C is its SelectI/O™ technology. This allows the FPGA to interface directly with various signal standards without the need for external level shifters, significantly reducing the Bill of Materials (BOM) cost and PCB complexity.

Common Applications for the XC2S200-6FGG1321C

Given its balance of cost and performance, this Spartan-II FPGA is widely used across several industries:

  1. Industrial Control: High-reliability automation and motor control systems.

  2. Consumer Electronics: Legacy support for digital imaging and set-top boxes.

  3. Telecommunications: Network interface cards and protocol conversion.

  4. Prototyping: Ideal for low-cost verification of digital logic before moving to ASIC production.

If you are sourcing components for a new project or looking for a reliable Xilinx FPGA, understanding the specific speed grade and thermal requirements of the XC2S200 series is essential for optimal performance.

Why Choose the XC2S200-6FGG1321C?

Choosing the XC2S200-6FGG1321C ensures that you are using a time-tested architecture from Xilinx. Its “-6” speed grade offers a competitive edge in timing-critical paths, while the “C” suffix denotes a commercial temperature range, making it perfect for indoor electronic environments.

Package and Ordering Information

The FGG1321 package is a lead-free (RoHS compliant) variant, ensuring your product meets global environmental regulations. When ordering, always verify the full part number to ensure the correct speed grade and package type are selected for your PCB assembly.

Order Code Temperature Range Lead Content
XC2S200-6FGG1321C 0°C to +85°C Pb-Free (RoHS)
XC2S200-6FG1321C 0°C to +85°C Leaded

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.