The XC2S200-6FGG1317C is a member of the Xilinx Spartan-2 family, designed to offer a cost-effective alternative to ASICs while providing the flexibility of a field-programmable gate array (FPGA). This specific device is engineered for high-volume, cost-sensitive applications that require reliable performance and low power consumption.
Key Features and Technical Specifications
The XC2S200-6FGG1317C utilizes a 0.15-micron process technology to deliver high density and speed. Below is a breakdown of the core technical parameters for this FPGA:
Device Performance Summary
| Feature |
Specification |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| Block RAM Bits |
57,344 |
| Maximum User I/O |
284 |
| Package Type |
FBGA-456 (Fine-Pitch Ball Grid Array) |
| Speed Grade |
-6 |
Advanced Architecture of the Spartan-2 Series
The Spartan-2 architecture is based on the proven Virtex series, ensuring a robust development environment. It features a flexible hierarchy of routing resources, allowing for efficient signal distribution and high-speed clocking.
Configuration and I/O Versatility
The XC2S200-6FGG1317C supports multiple I/O standards, making it compatible with various system interfaces including LVTTL, LVCMOS, and PCI. Its segmented routing architecture minimizes delays, which is critical for timing-sensitive digital signal processing.
Power Management and Efficiency
With a core voltage of 2.5V, the Spartan-2 family is optimized for low power consumption. This makes the XC2S200-6FGG1317C an ideal choice for consumer electronics and industrial automation where thermal management is a priority.
Comparison of Spartan-2 Device Variants
To better understand where the XC2S200 fits within the product line, refer to the table below:
| Device |
System Gates |
Logic Cells |
Block RAM (bits) |
| XC2S50 |
50,000 |
1,728 |
32,768 |
| XC2S100 |
100,000 |
2,700 |
40,960 |
| XC2S200 |
200,000 |
5,292 |
57,344 |
| XC2S300E |
300,000 |
6,912 |
65,536 |
Why Choose the XC2S200-6FGG1317C for Your Project?
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Cost-Efficiency: Offers a programmable logic solution at a price point competitive with fixed-logic chips.
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Reprogrammability: Allows for field updates and bug fixes without replacing hardware.
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Extensive Ecosystem: Supported by standard Xilinx design tools, reducing time-to-market.
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Reliability: Long-term availability makes it suitable for industrial lifecycles.
For those looking for high-quality components and integration support, visit the Xilinx FPGA LINK to explore compatible hardware and design services.
Frequently Asked Questions (FAQ)
What is the operating temperature for the XC2S200-6FGG1317C?
The “C” suffix denotes the commercial temperature range, typically spanning from 0°C to +85°C.
Is the XC2S200-6FGG1317C RoHS compliant?
Yes, the “G” in the part number indicates a lead-free (Pb-free) FBGA package that meets RoHS standards.
Which software is used to program this FPGA?
This device is compatible with Xilinx ISE Design Suite, providing a comprehensive environment for synthesis, simulation, and implementation.
