The XC2S200-6FGG1310C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device combines 200,000 system gates, 5,292 logic cells, and a robust 1310-pin Fine-Pitch Ball Grid Array (FBGA) package — making it one of the most capable and versatile FPGAs in the Spartan-II lineup. Whether you’re designing communication systems, industrial control units, or digital signal processing hardware, the XC2S200-6FGG1310C delivers the logic density, I/O flexibility, and programmability your project demands.

What Is the XC2S200-6FGG1310C?

The XC2S200-6FGG1310C is a member of the Xilinx Spartan-II FPGA family, a series built on 0.18-micron process technology and optimized for low-cost, high-volume production environments. The part number encodes everything you need to know about the device at a glance:

This device belongs to the same silicon family as the XC2S200, sharing its core architecture while offering significantly more I/O pins through the large 1310-ball package — making it ideal for designs that require maximum connectivity without sacrificing logic performance.

XC2S200-6FGG1310C Key Specifications

Core Logic Resources

Electrical & Timing Characteristics

Package & Physical Information

Note: The -6 speed grade is exclusively available in the Commercial temperature range (suffix “C”). Industrial temperature range variants use slower speed grades.

XC2S200-6FGG1310C Architecture Overview

## Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1310C is its array of 1,176 Configurable Logic Blocks arranged in a 28-column by 42-row grid. Each CLB contains:

• Two Slices, each with two 4-input Look-Up Tables (LUTs) and two flip-flops
• Dedicated carry logic for fast arithmetic operations
• Wide function multiplexers for implementing large combinational functions
• Support for both edge-triggered D flip-flops and level-sensitive latches

This flexible CLB structure allows designers to implement virtually any digital logic function — from simple gates to complex state machines and arithmetic units.

## Block RAM

The XC2S200-6FGG1310C includes 56K bits of dedicated block RAM, organized in two columns positioned symmetrically on the die. Each block RAM can be configured as:

• Single-port or dual-port memory
• Various width/depth combinations (e.g., 4K × 1, 2K × 2, 1K × 4, 512 × 8, 256 × 16)
• Synchronous or with asynchronous read

Block RAM is ideal for FIFOs, lookup tables, embedded memories, and buffering between clock domains.

## Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) — one at each corner of the die — provide:

• Clock deskewing and distribution
• Frequency synthesis (multiply and divide)
• Phase shifting for source-synchronous interfaces
• Duty cycle correction

The DLLs are critical for high-speed designs that need clean, synchronized clocks across the entire device.

## Input/Output Blocks (IOBs)

The XC2S200-6FGG1310C’s IOBs support a wide range of I/O standards, enabling seamless interfacing with external devices:

Each IOB includes programmable input delays, output slew-rate control, and optional pull-up/pull-down resistors — giving designers fine-grained control over signal integrity.

Spartan-II Family Comparison: Where Does the XC2S200 Stand?

The table below shows how the XC2S200 compares across the full Spartan-II product family, helping you select the right device for your design’s logic and memory requirements.

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest gate count, the most logic cells, and the most distributed and block RAM.

Why Choose the XC2S200-6FGG1310C?

### Superior Alternative to ASICs

The XC2S200-6FGG1310C is a proven alternative to mask-programmed ASICs. Unlike ASICs, this FPGA eliminates non-recurring engineering (NRE) costs, shortens design cycles, and removes the inherent risk of committing to fixed silicon. Most importantly, its in-field reprogrammability allows you to push logic updates or bug fixes without replacing hardware — something ASICs simply cannot do.

### Fastest Commercial Speed Grade (-6)

With the -6 speed grade, this device delivers the highest performance available in the commercial Spartan-II lineup, with system clock speeds reaching up to 263 MHz. This makes the XC2S200-6FGG1310C suitable for timing-critical designs in communications, signal processing, and high-speed data interfacing.

### Maximum I/O with the 1310-Pin Package

The FGG1310 package provides access to a large number of user I/O pins, making this variant the preferred choice for designs that must interface with many external buses, memory devices, or peripheral components simultaneously. The large pin count supports parallel data buses, multi-bank designs, and complex board-level interconnects.

### Lead-Free (Pb-Free) Packaging

The “G” in FGG indicates a Pb-free (lead-free) package, meeting RoHS environmental compliance requirements for global markets — particularly important for consumer electronics, medical devices, and products exported to the EU.

Typical Applications for the XC2S200-6FGG1310C

The XC2S200-6FGG1310C is deployed across a wide range of industries and application domains:

Configuration & Programming the XC2S200-6FGG1310C

### Configuration Modes

The XC2S200-6FGG1310C supports multiple configuration modes, allowing flexibility in system design:

• Master Serial – Drives a serial PROM (e.g., Xilinx XCF PROM)
• Slave Serial – Accepts serial bitstream from an external controller
• Master Parallel (SelectMAP) – Fast parallel configuration from a microprocessor or CPLD
• Slave Parallel (SelectMAP) – Parallel mode driven externally
• JTAG – IEEE 1149.1 Boundary Scan, also usable for configuration and in-system debugging

### Supported Design Tools

Xilinx Spartan-II devices are supported by industry-standard EDA tools:

Tip: For Spartan-II design, Xilinx ISE (particularly ISE 14.7, the final release) remains the recommended toolchain. ISE 14.7 is available for Windows and Linux and provides a complete flow from HDL entry through bitstream generation.

For a broader look at compatible programmable logic products and procurement options, visit Xilinx FPGA.

XC2S200-6FGG1310C vs. Common Alternatives

If you’re evaluating the XC2S200-6FGG1310C against other devices, the table below provides a quick cross-comparison:

The FGG1310 package is the key differentiator for the XC2S200-6FGG1310C — it delivers the most I/O connectivity in the Spartan-II 200K gate family.

Ordering & Procurement Guide

### Decoding the Full Part Number

XC  2S  200  -6  FGG  1310  C
│   │   │    │   │    │     └── Temperature: C = Commercial (0 to +85°C)
│   │   │    │   │    └──────── Pin Count: 1310 balls
│   │   │    │   └───────────── Package: FGG = Pb-Free Fine-Pitch BGA
│   │   │    └───────────────── Speed Grade: -6 (fastest commercial)
│   │   └────────────────────── Gates: 200K system gates
│   └────────────────────────── Family: 2S = Spartan-II
└────────────────────────────── Manufacturer Prefix: Xilinx/AMD

### What to Verify Before Purchasing

When sourcing the XC2S200-6FGG1310C from distributors, confirm the following:

• Exact part number match — including speed grade (-6) and temperature suffix (C)
• Package marking — verify FGG (Pb-free) vs. FG (standard SnPb) if RoHS compliance matters
• Date code / lot traceability — important for quality assurance and counterfeit avoidance
• Quantity and lead time — Spartan-II is a mature/legacy product; stock levels vary by distributor
• Certificate of conformance — request CoC documentation for critical or regulated applications

Frequently Asked Questions (FAQ)

Q: Is the XC2S200-6FGG1310C still in production? The Spartan-II family is a mature product line. Availability depends on distributor stock. Always confirm inventory with your supplier, as production has transitioned to newer Xilinx families.

Q: What is the difference between FGG1310 and FG1310? The extra “G” in FGG indicates a Pb-free (lead-free) solder ball package, complying with RoHS regulations. FG (without the second G) uses standard SnPb solder balls.

Q: Can the XC2S200-6FGG1310C be reprogrammed after installation on a PCB? Yes. The device supports in-system reconfiguration via JTAG or the SelectMAP interface, allowing updates to the FPGA logic without removing the component from the board.

Q: What configuration memory is compatible with this FPGA? Xilinx XCF (Platform Flash) PROMs such as the XCF02S, XCF04S, and XCF08P are commonly paired with Spartan-II devices for non-volatile configuration storage.

Q: Is the -6 speed grade the fastest available? Yes, for the commercial temperature range, -6 is the highest (fastest) speed grade in the Spartan-II family.

Q: What design software should I use for the XC2S200-6FGG1310C? Xilinx ISE Design Suite 14.7 is the recommended tool for Spartan-II devices. It supports VHDL and Verilog HDL entry, synthesis, place-and-route, and bitstream generation.

Summary

The XC2S200-6FGG1310C is a proven, high-density FPGA offering 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, and maximum I/O connectivity through its 1310-ball Pb-free FBGA package. Its -6 speed grade ensures top-tier performance within the commercial Spartan-II lineup, while its support for multiple configuration modes and a broad range of I/O standards makes it a flexible solution for diverse applications — from industrial control and telecommunications to medical imaging and digital signal processing.

For engineers seeking a cost-effective, reconfigurable alternative to ASICs with robust connectivity and a well-established development ecosystem, the XC2S200-6FGG1310C remains a compelling choice.