The XC2S200-6FGG1308C is a high-density, commercially graded Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and 284 user I/Os — all operating on a 2.5V core supply with the -6 speed grade for maximum performance in commercial temperature environments. Whether you are building embedded systems, telecommunications equipment, or industrial controllers, the XC2S200-6FGG1308C offers a proven, programmable alternative to mask-programmed ASICs.

For a broader overview of compatible programmable logic solutions, visit our guide to Xilinx FPGA products.

---

What Is the XC2S200-6FGG1308C? Part Number Decoded

Understanding the Xilinx part number convention is essential for selecting the right component. Each segment of XC2S200-6FGG1308C encodes key device attributes:

The “G” in FGG signifies a lead-free (Pb-free) package, meeting RoHS environmental compliance directives — a key consideration for global product deployment.

---

XC2S200-6FGG1308C Key Specifications

Core Logic Resources

Electrical & Physical Characteristics

---

XC2S200-6FGG1308C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II CLB architecture is the heart of the XC2S200. Arranged in a 28 × 42 matrix of 1,176 CLBs, each block contains four look-up tables (LUTs), flip-flops, and carry logic. This structure supports efficient implementation of arithmetic functions, state machines, and data-path circuits. The 75,264 bits of distributed RAM embedded within the CLB array enables fast, local data storage without consuming dedicated block RAM resources.

Block RAM and Memory Architecture

The XC2S200-6FGG1308C includes 56K bits of dedicated block RAM arranged in two columns at opposite sides of the die. Each block RAM is dual-port capable, supporting simultaneous read and write operations — making this FPGA well-suited for FIFO buffers, lookup tables, and embedded processor memory.

Input/Output Blocks (IOBs)

The device features 284 user-configurable I/O pins supported by flexible IOBs. Each IOB supports:

• Programmable pull-up and pull-down resistors
• 3-state control
• Slew-rate control for reduced EMI
• Multiple I/O standards (LVCMOS, LVTTL, PCI, GTL+, SSTL, and more)

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one at each corner of the die — provide precise clock distribution, phase alignment, and frequency synthesis. DLLs eliminate clock skew across the device and enable zero-delay clock buffering for high-speed synchronous designs.

---

XC2S200-6FGG1308C vs. Other Spartan-II Devices

The table below positions the XC2S200 within the Spartan-II family to help engineers select the right device for their logic density requirements:

The XC2S200 is the largest and most capable device in the Spartan-II family, making the XC2S200-6FGG1308C the go-to choice for complex designs that require maximum I/O flexibility and logic density within the Spartan-II product line.

---

Applications of the XC2S200-6FGG1308C

The XC2S200-6FGG1308C’s combination of high gate count, abundant I/Os, and commercial-grade -6 speed makes it suited for a wide range of demanding applications:

#### Telecommunications & Networking

High-speed packet processing, protocol bridging, and line card control benefit from the 263 MHz clock capability and flexible multi-standard IOBs. The dual-port block RAM supports efficient FIFO management in switching applications.

#### Industrial Automation & Control

With 284 user I/Os and configurable voltage banks, this FPGA interfaces seamlessly with a wide range of sensors, actuators, and field buses (e.g., SPI, I²C, UART). Its in-field reprogrammability allows firmware updates without hardware replacement — a significant advantage over fixed-function ASICs.

#### Embedded Signal Processing

The CLB array’s distributed RAM and block RAM resources support FIR filters, FFT engines, and other DSP primitives. The XC2S200-6FGG1308C is frequently used in radar signal processing, medical imaging, and software-defined radio (SDR) front-ends.

#### Video & Image Processing

The 75,264 bits of distributed RAM and 56K bits of block RAM provide enough on-chip storage for line buffers and frame synchronization logic in embedded vision systems and machine vision cameras.

#### Prototyping & ASIC Emulation

As a programmable alternative to mask-programmed ASICs, the XC2S200-6FGG1308C eliminates the up-front NRE cost and long development cycles associated with custom silicon. Design changes can be applied in the field, accelerating development iteration.

---

XC2S200-6FGG1308C Ordering & Compliance Information

Ordering Code Structure

Environmental Compliance

Note: The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). For Industrial temperature range (-40°C to +85°C) designs, the -5 or lower speed grades must be used.

---

Design Tools & Configuration Support

Supported Design Flows

The XC2S200-6FGG1308C is supported by the following Xilinx (AMD) development environments:

Configuration Modes

Spartan-II devices including the XC2S200 support multiple configuration modes:

• Master Serial – Simple daisy-chain configuration from external serial PROM
• Slave Serial – Controlled by an external processor or microcontroller
• Master Parallel (SelectMAP) – High-speed byte-wide configuration
• JTAG Boundary Scan – IEEE 1149.1-compliant in-circuit testing and configuration

---

Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1308C?

The -6 speed grade is the fastest available for the Spartan-II family and is exclusively offered in the Commercial temperature range (0°C to +85°C). A higher speed grade number indicates faster propagation delays and a higher maximum operating frequency — up to 263 MHz for the XC2S200.

Is the XC2S200-6FGG1308C RoHS compliant?

Yes. The “G” in the FGG package designation signifies a lead-free (Pb-free), RoHS-compliant package. This makes it suitable for products sold in markets with strict environmental regulations, including the European Union.

What configuration PROM is compatible with the XC2S200?

Xilinx XCF (Platform Flash) and XC18V series PROMs are commonly used for configuring the XC2S200-6FGG1308C in Master Serial mode. Consult the Xilinx PROM selection guide for the exact bit-width and density requirements.

Can the XC2S200-6FGG1308C be reprogrammed in the field?

Yes. Like all Spartan-II FPGAs, this device is infinitely reprogrammable using SRAM-based configuration. Each power-up cycle loads configuration from an external PROM or host processor, allowing field updates without any hardware replacement.

What is the difference between XC2S200-6FGG1308C and XC2S200-6FGG456C?

Both devices share the same XC2S200 silicon core (200K gates, 5,292 logic cells, 284 I/Os). The primary difference is the package pin count: the FGG1308 package provides 1,308 ball positions versus 456 in the FGG456, offering significantly more PCB routing flexibility and power/ground distribution for dense board designs.

---

Summary

The XC2S200-6FGG1308C delivers the full capability of Xilinx’s flagship Spartan-II device — 200K system gates, 5,292 logic cells, 284 user I/Os, 56K bits of block RAM, and four DLLs — in a lead-free, 1,308-pin fine-pitch BGA package running at the peak -6 speed grade. Its ASIC-replacement value proposition, infinite reprogrammability, and multi-standard I/O support make it a highly flexible solution for commercial-grade designs in telecommunications, industrial automation, signal processing, and embedded vision.

For additional information on compatible and alternative Xilinx programmable logic devices, explore our complete Xilinx FPGA resource library.