The XC2S200-6FGG1306C is a high-density, cost-effective Field Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD) as part of the Spartan-II family. Designed for commercial-temperature applications, this device delivers 200,000 system gates in a compact 1306-ball Fine-Pitch Ball Grid Array (FBGA) Pb-free package. Whether you are prototyping a new embedded system, replacing a legacy ASIC, or scaling a high-volume production design, the XC2S200-6FGG1306C offers the programmability, density, and reliability your project demands.

What Is the XC2S200-6FGG1306C? Understanding the Part Number

Before diving into specifications, it helps to decode the part number:

The “-6” speed grade is exclusively available in the commercial temperature range, making the XC2S200-6FGG1306C the top-performance variant for demanding commercial applications.

XC2S200-6FGG1306C Key Specifications

Core Logic & Architecture

Package & Physical Specifications

Timing & Performance

Spartan-II Family Comparison: Where XC2S200 Stands

The XC2S200 is the largest device in the Spartan-II family, offering the most logic resources, I/O, and memory of any device in its generation.

Architecture Overview: Inside the XC2S200-6FGG1306C

Configurable Logic Blocks (CLBs)

Each CLB in the Spartan-II architecture contains four logic cells, each built around a 4-input Look-Up Table (LUT) and a D-type flip-flop. The 28×42 array of 1,176 CLBs gives designers enormous flexibility for implementing combinational logic, sequential circuits, and custom memory structures.

Input/Output Blocks (IOBs)

The XC2S200 supports up to 284 user-configurable I/O pins, each capable of operating with a wide range of I/O standards. Every IOB includes optional input and output registers to maximize I/O timing performance.

Block RAM

Two columns of dedicated block RAM — totaling 56K bits — are positioned on opposite sides of the die between the CLBs and IOBs. These dual-port RAM blocks are ideal for FIFOs, lookup tables, and on-chip data buffering without consuming precious distributed RAM resources.

Delay-Locked Loops (DLLs)

Four DLLs — one at each corner of the die — provide clock distribution with zero delay and clock domain management. DLLs eliminate clock skew and enable clock multiplication, division, and phase shifting for sophisticated clocking schemes.

Routing Architecture

A rich hierarchy of versatile routing resources connects CLBs, block RAMs, IOBs, and DLLs. The Spartan-II interconnect supports both local (fast) and global (long-distance) routing paths, allowing designers to optimize for speed or resource utilization.

Configuration Modes of the XC2S200-6FGG1306C

The XC2S200-6FGG1306C supports four standard configuration modes:

During power-on and throughout configuration, all I/O drivers remain in a high-impedance state, protecting downstream circuitry. After configuration is complete, unused I/Os remain high-impedance unless explicitly assigned.

Why Choose the XC2S200-6FGG1306C? Key Advantages

Superior Alternative to Mask-Programmed ASICs

The Spartan-II FPGA eliminates the high non-recurring engineering (NRE) costs and lengthy tape-out cycles associated with custom ASICs. With full in-field reprogrammability, engineering teams can push design updates, fix bugs, and add features without replacing any hardware — a capability that ASICs fundamentally cannot match.

Fastest Commercial Speed Grade (-6)

The -6 speed grade delivers maximum performance within the Spartan-II family, with internal clock frequencies reaching up to 263 MHz. This makes the XC2S200-6FGG1306C the right choice when timing closure and throughput are critical design constraints.

Pb-Free, RoHS-Compliant Packaging

The “G” in the “FGG” package designator confirms lead-free construction, ensuring compliance with RoHS and WEEE environmental directives. This is essential for products targeting EU markets or environmentally conscious supply chains.

 Cost-Effective High-Volume Production

The Spartan-II family was specifically architected for cost-sensitive, high-volume applications. The XC2S200-6FGG1306C provides the performance headroom needed for complex designs while keeping per-unit BOM costs competitive.

Typical Applications for the XC2S200-6FGG1306C

The XC2S200-6FGG1306C is suited for a broad range of embedded and digital system applications:

XC2S200-6FGG1306C vs. Common Alternatives

The XC2S200-6FGG1306C uniquely combines the highest gate count in the family, the fastest commercial speed grade, the largest available ball count for maximum I/O flexibility, and RoHS-compliant Pb-free packaging in a single orderable part.

Development Tools & Software Support

Designers working with the XC2S200-6FGG1306C can use the following Xilinx (AMD) tools:

• ISE Design Suite — The legacy Xilinx toolchain that fully supports the Spartan-II family, including synthesis, place-and-route, timing analysis, and bitstream generation.
• ChipScope Pro — On-chip logic analysis and debugging integrated with ISE.
• CORE Generator — IP core generation for common functions including FIFOs, arithmetic blocks, and communication interfaces.
• iMPACT — Device programming and boundary-scan tool for JTAG configuration.

Note: The Spartan-II family predates Vivado Design Suite. For new designs, AMD/Xilinx recommends evaluating newer FPGA families supported by Vivado. However, for production maintenance and legacy system support, ISE remains the correct toolchain for the XC2S200.

Ordering Information & Part Marking Guide

Xilinx uses a standardized part-marking system for all Spartan-II devices. The XC2S200-6FGG1306C follows this convention:

XC2S200  -6  FGG  1306  C
   │      │    │    │    └── Temperature: C = Commercial (0°C to +85°C)
   │      │    │    └─────── Pin Count: 1306 balls
   │      │    └──────────── Package: FGG = Fine-Pitch BGA, Pb-Free
   │      └───────────────── Speed Grade: -6 (fastest commercial)
   └──────────────────────── Device: Spartan-II, 200K gates

Frequently Asked Questions (FAQ)

Q: Is the XC2S200-6FGG1306C still in production? The Spartan-II family has been subject to Product Discontinuation Notices (PDNs). Buyers should confirm current availability with authorized distributors and consider sourcing from trusted component brokers for legacy system support.

Q: What is the difference between FGG1306 and FG256 packages? The FGG1306 package offers 1,306 balls compared to 256 in the FG256 package. While both expose the same internal logic, the larger package provides more routing layers, better signal isolation, and the full complement of 284 user I/O connections in a more thermally favorable footprint.

Q: Can I use Vivado to program this device? Vivado Design Suite does not support the Spartan-II family. You must use Xilinx ISE Design Suite to develop, synthesize, and program the XC2S200-6FGG1306C.

Q: What voltage does this device operate at? The XC2S200-6FGG1306C operates with a 2.5V core supply voltage. I/O banks can support various voltage standards depending on the IOB configuration.

Q: Is the XC2S200-6FGG1306C RoHS compliant? Yes. The “G” in the FGG package designation confirms Pb-free, RoHS-compliant construction.

Where to Buy the XC2S200-6FGG1306C

For sourcing the XC2S200-6FGG1306C, consult authorized distributors and verified component brokers. When purchasing legacy FPGA components, always verify:

• Authenticity and traceability documentation
• Lot codes and date codes matching expected production windows
• ESD-safe packaging and shipping conditions
• Seller warranty and return policy

For a broader selection of Xilinx programmable logic devices, visit our Xilinx FPGA catalog for current stock, pricing, and technical support.

Summary: Is the XC2S200-6FGG1306C Right for Your Design?

The XC2S200-6FGG1306C is the definitive choice when you need:

• The highest logic density in the Spartan-II family (200K gates, 5,292 cells)
• The fastest commercial speed grade (-6, up to 263 MHz)
• Maximum I/O flexibility with 284 user pins in a 1306-ball FBGA footprint
• Pb-free, RoHS-compliant construction for regulatory compliance
• A proven, reprogrammable alternative to fixed-function ASICs

Whether you are maintaining a legacy product line or prototyping a new embedded application, this device offers mature silicon, well-documented architecture, and strong community support through decades of Xilinx ecosystem tooling.