The XC2S200-6FGG1303C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and a rich set of programmable resources — all housed in a 1303-pin Fine Pitch Ball Grid Array (FBGA) package. Whether you’re designing digital signal processing pipelines, communication systems, or industrial control logic, the XC2S200-6FGG1303C offers a proven, flexible platform at competitive cost.

Looking for compatible Xilinx programmable devices? Browse our full catalog of Xilinx FPGA solutions.

---

What Is the XC2S200-6FGG1303C?

The XC2S200-6FGG1303C is part of Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic device manufactured using 0.18µm CMOS technology. It is designed as a superior alternative to mask-programmed ASICs, eliminating the high non-recurring engineering (NRE) costs and long design cycles that ASICs typically require. Engineers can reprogram the device in the field without any hardware replacement — a critical advantage for iterative development and rapid prototyping.

The part number breaks down as follows:

---

XC2S200-6FGG1303C Key Specifications

The following table summarizes the core electrical and logic specifications of the XC2S200-6FGG1303C:

---

XC2S200-6FGG1303C Architecture Overview

Configurable Logic Blocks (CLBs)

The heart of the XC2S200 is its array of 1,176 Configurable Logic Blocks arranged in a 28-column by 42-row grid. Each CLB contains multiple logic cells capable of implementing combinatorial and sequential logic functions. The distributed nature of the CLB array allows efficient routing and high logic utilization for complex digital designs.

Input/Output Blocks (IOBs)

The device offers 284 maximum user I/O pins, each configurable to support a wide variety of I/O standards including LVTTL, LVCMOS, PCI, GTL+, HSTL, SSTL-2, and SSTL-3. IOBs surround the CLB array in a programmable perimeter, providing flexible interfacing with external memory, processors, and peripherals.

Block RAM

The XC2S200 integrates 56K bits of block RAM, organized in two columns on opposite sides of the die. Block RAM is ideal for implementing FIFOs, lookup tables, and local data buffers without consuming CLB resources.

Distributed RAM

In addition to block RAM, the device provides 75,264 bits of distributed RAM built from LUT resources within the CLBs — giving designers flexible on-chip memory options.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) are placed at each corner of the die. These DLLs enable precise clock management including clock deskewing, frequency synthesis, and phase shifting — essential for high-speed synchronous designs.

---

Spartan-II Family Comparison

The XC2S200 is the largest device in the Spartan-II family. The table below compares all members to help you select the right device for your design:

The XC2S200-6FGG1303C, as the top-tier member of this family, delivers the most logic resources, the most I/O, and the highest memory capacity available within the Spartan-II generation.

---

Speed Grade and Timing Performance

The -6 speed grade is the fastest commercially available speed grade for the Spartan-II family. It is exclusively offered in the Commercial temperature range (0°C to +85°C) and is not available in Industrial temperature variants. This makes the XC2S200-6FGG1303C the optimal choice for performance-critical commercial applications where maximum clock frequency is a design priority.

---

Package Information: FGG1303 (1303-Pin FBGA)

The FGG1303 package designation indicates a Fine Pitch Ball Grid Array with 1,303 solder balls in a Pb-free (RoHS-compliant) configuration. The “G” in “FGG” confirms the lead-free finish, making this part compliant with EU RoHS directives and suitable for modern environmental standards.

---

Supported I/O Standards

The XC2S200-6FGG1303C supports a comprehensive set of I/O voltage standards, enabling it to interface with a broad range of external ICs and buses:

---

Typical Applications for the XC2S200-6FGG1303C

Thanks to its large gate count, high I/O density, and fast -6 speed grade, the XC2S200-6FGG1303C is well suited for a wide range of embedded and system-level applications:

• Digital Signal Processing (DSP) — FIR/IIR filter implementations, FFT engines, audio and video pipelines
• Communications & Networking — Protocol bridging, serializer/deserializer logic, line card control
• Industrial Automation — Motor control, sensor fusion, real-time I/O management
• Embedded Processing — Softcore CPU implementations (MicroBlaze, PicoBlaze)
• Rapid Prototyping — ASIC emulation, algorithm validation before tape-out
• Consumer Electronics — Display controllers, image processing, set-top box logic
• Test & Measurement — Data acquisition, pattern generation, automated test equipment (ATE)

---

Development Tools & Programming

The XC2S200-6FGG1303C is supported by Xilinx’s ISE Design Suite, the legacy toolchain designed for Spartan-II and related families. Key tools include:

• ISE Project Navigator — RTL design entry and project management
• XST (Xilinx Synthesis Technology) — RTL synthesis engine
• IMPACT — JTAG-based device programming tool
• ChipScope Pro — In-circuit logic analyzer for debug
• ModelSim / ISim — Functional and timing simulation

HDL support includes both VHDL and Verilog, with optional schematic-based entry for simpler designs. The device supports JTAG boundary scan (IEEE 1149.1) for board-level testing and in-system programming.

---

Why Choose the XC2S200-6FGG1303C?

✔ Maximum Logic Density in Spartan-II Family

With 5,292 logic cells and 200,000 system gates, the XC2S200 is the top device in the Spartan-II lineup — ideal for designs that have outgrown smaller members.

✔ Fastest Available Speed Grade

The -6 speed grade pushes system performance to approximately 263 MHz, making it the best choice for latency-sensitive or high-throughput designs.

✔ High I/O Count with 1303-Pin Package

The FGG1303 package provides unmatched pin availability, enabling dense connectivity to memories, buses, sensors, and display interfaces in complex board designs.

✔ Pb-Free & RoHS Compliant

The “G” suffix in FGG confirms lead-free packaging, meeting modern environmental and regulatory requirements for global markets.

✔ Proven ASIC Alternative

The Spartan-II architecture was specifically designed to replace mask-programmed ASICs at a fraction of the upfront cost and development time, with the added benefit of in-field reconfigurability.

---

Frequently Asked Questions (FAQ)

Q: What is the XC2S200-6FGG1303C used for? It is used in applications requiring complex programmable logic, such as DSP, communications, industrial control, and ASIC prototyping, where high gate count and fast timing are essential.

Q: Is the XC2S200-6FGG1303C RoHS compliant? Yes. The “G” in the FGG package designation indicates Pb-free (lead-free) construction, making it RoHS compliant.

Q: What software is used to program the XC2S200-6FGG1303C? Xilinx ISE Design Suite is the primary toolchain. The device can be programmed via JTAG using the Xilinx IMPACT programmer or compatible third-party tools.

Q: What is the difference between XC2S200-6FGG1303C and XC2S200-5FGG1303C? The -6 speed grade is faster (up to ~263 MHz) and is only available in the commercial temperature range (0°C to +85°C). The -5 grade supports both commercial and industrial temperature ranges with lower maximum frequency.

Q: Is the XC2S200-6FGG1303C still in production? The Spartan-II family has reached end-of-life status with Xilinx/AMD. However, authorized distributors and component brokers continue to offer stock. Always purchase from reputable, authorized sources to ensure authenticity.

---

Summary

The XC2S200-6FGG1303C remains a highly capable FPGA for engineers working with legacy Spartan-II designs or sourcing components for established production lines. With its 200K gate capacity, 284 user I/Os, 263 MHz maximum frequency, and 1303-pin RoHS-compliant package, it delivers everything needed for demanding digital design tasks. Its programmable nature makes it a cost-effective and flexible solution wherever rapid iteration and field upgradability are valued.

For the full range of compatible and successor devices, visit our Xilinx FPGA product catalog.