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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
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XC2S200-6FGG1299C: Xilinx Spartan-II FPGA Specifications, Features & Complete Buyer’s Guide

Product Details

Meta Description: The XC2S200-6FGG1299C is a Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, -6 speed grade, and a 1299-ball Pb-free FGG BGA package. Full specs, pinout, and applications.


The XC2S200-6FGG1299C is a top-tier Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family, designed for engineers who demand maximum programmable logic performance in a compact, RoHS-compliant package. Featuring 200,000 system gates, 5,292 logic cells, a -6 (fastest) commercial speed grade, and a 1299-ball Fine-Pitch BGA (FGG) Pb-free package, this device represents the highest-density device in the entire Spartan-II product line. From high-speed telecommunications logic to industrial automation and embedded signal processing, the XC2S200-6FGG1299C provides the logic resources, memory bandwidth, and I/O flexibility required for demanding production-grade designs.


What Is the XC2S200-6FGG1299C?

Understanding the Part Number

The XC2S200-6FGG1299C is a member of Xilinx’s Spartan-II FPGA family, built on a cost-optimized 0.18-micron CMOS process. Its part number carries a precise technical meaning that tells engineers exactly what they are receiving:

Part Number Segment Meaning
XC2S200 Spartan-II family, 200,000 system gate density
-6 Speed Grade -6 — the fastest commercial Spartan-II variant
FGG Fine-Pitch Ball Grid Array, Pb-free (lead-free / RoHS compliant)
1299 1299 solder ball count
C Commercial temperature range: 0°C to +85°C

The “G” suffix in FGG distinguishes this part from the standard FG leaded variant. Both share the same die, footprint, and electrical behavior — the only difference is the lead-free solder ball composition, making the FGG variant fully RoHS and WEEE directive compliant for global distribution.


XC2S200-6FGG1299C: Full Technical Specifications

Core Logic Resources

The XC2S200 is the largest member of the Spartan-II family, offering densities up to 200,000 system gates and up to 5,292 logic cells. The table below summarizes all core logic parameters:

Parameter XC2S200-6FGG1299C Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 Rows × 42 Columns
Total CLBs 1,176
Maximum User I/O Pins 284
Distributed RAM (SelectRAM) 75,264 bits
Block RAM 56K bits (56,000 bits)
Delay-Locked Loops (DLLs) 4 (one per die corner)

Electrical & Timing Characteristics

The Spartan-II family provides system clock rates up to 200 MHz, with a core supply of 2.5V and I/Os powered at 1.5V, 2.5V, or 3.3V.

Parameter Value
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 1.5V / 2.5V / 3.3V (per bank)
Maximum System Clock Up to 263 MHz (speed-grade -6)
Process Node 0.18 µm CMOS
Speed Grade -6 (Fastest Commercial)
Configuration Technology Static SRAM-based (unlimited reprogramming)

Package & Compliance Details

Parameter Value
Package Type FGG — Fine-Pitch BGA, Pb-Free
Total Ball Count 1,299
Temperature Grade Commercial (0°C to +85°C)
RoHS Compliance Yes — Pb-free solder balls
WEEE Compliant Yes
Boundary Scan IEEE 1149.1 (JTAG) compatible

Architecture Deep Dive: How the XC2S200-6FGG1299C Works

Configurable Logic Blocks (CLBs)

The Spartan-II family features a regular, flexible, programmable architecture of Configurable Logic Blocks (CLBs) surrounded by a perimeter of programmable Input/Output Blocks (IOBs). The XC2S200’s 1,176 CLBs are arranged in a 28×42 matrix — the largest in the Spartan-II lineup. Each CLB contains:

  • Four Look-Up Tables (LUTs) — each capable of implementing any 4-input Boolean function
  • Four flip-flops — with programmable set, reset, and clock enable
  • Dedicated carry logic — for high-speed ripple-carry arithmetic
  • Cascade chains — for wide-input combinatorial functions

SelectRAM: Hierarchical Dual-Mode Memory

The Spartan-II family includes SelectRAM hierarchical memory: 16 bits per LUT as distributed RAM and configurable 4K-bit block RAM, with fast interfaces to external RAM.

Memory Type Total Capacity Best Use Case
Distributed RAM 75,264 bits Speed-critical small buffers, FIFOs, register files
Block RAM (×4K) 56,000 bits Large synchronous dual-port memory, data buffering

Delay-Locked Loops (DLLs)

There are four Delay-Locked Loops (DLLs), one at each corner of the die. These on-chip DLLs provide:

  • Clock deskewing — eliminates PCB-level clock distribution delay
  • Frequency synthesis — multiply or divide the input clock
  • Phase shifting — fine-tune phase relationships between clock domains
  • Zero-delay buffering — maintain precise timing margins across the full device

Flexible I/O Banks & Supported Standards

With 284 user I/O pins and independently powered I/O banks, the XC2S200-6FGG1299C supports 16 high-performance I/O interface standards, including:

I/O Standard Voltage Level Typical Application
LVTTL 3.3V General-purpose digital I/O
LVCMOS 2.5V / 3.3V 2.5V / 3.3V Low-voltage MCU interfaces
PCI (3.3V) 3.3V PCI bus compliance
GTL / GTL+ 1.2V / 1.5V High-speed point-to-point links
HSTL (Class I–IV) 1.5V Memory and ASIC interfaces
SSTL2 / SSTL3 2.5V / 3.3V SDRAM/DDR SDRAM interfaces

XC2S200-6FGG1299C vs. Spartan-II Family Comparison

The table below places the XC2S200 in the context of the full Spartan-II family to help engineers right-size their device selection:

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8×12 86 16K
XC2S30 972 30,000 12×18 92 24K
XC2S50 1,728 50,000 16×24 176 32K
XC2S100 2,700 100,000 20×30 176 40K
XC2S150 3,888 150,000 24×36 260 48K
XC2S200 (this device) 5,292 200,000 28×42 284 56K

The XC2S200-6FGG1299C is the undisputed top performer in the Spartan-II family — offering 12× more logic cells than the entry-level XC2S15 and 75% more block RAM.


Top Applications for the XC2S200-6FGG1299C

#### Telecommunications & Protocol Processing

The combination of 284 I/O pins, on-chip DLLs, and -6 speed grade makes the XC2S200-6FGG1299C a natural fit for line card controllers, multi-protocol bridges, ATM cell processors, and Ethernet MAC logic. Its CLB fabric can implement multi-channel UART/SPI/I²C interfaces in parallel without external ASICs.

#### Industrial Automation & Motion Control

In industrial settings, the XC2S200-6FGG1299C is deployed in PLC controllers, servo amplifiers, multi-axis motion coordinators, and safety I/O modules. The device’s real-time responsiveness and abundant I/O banks eliminate the need for dedicated glue logic ICs.

#### Digital Signal Processing (DSP)

The device supports efficient implementations of FIR filters, IIR filters, FFT engines, and digital up/down converters. Pipelined arithmetic is accelerated by the dedicated carry chain logic built into every CLB row, enabling multiply-accumulate structures that run at the full device clock rate.

#### Embedded Hardware Acceleration

When paired with a soft-core processor (such as Xilinx’s PicoBlaze) or an external MCU, the XC2S200-6FGG1299C acts as a dedicated hardware accelerator — offloading tasks like CRC computation, encryption co-processing, DMA engines, and real-time bus arbitration.

#### Medical Imaging & Diagnostics

The high I/O count and 16 supported I/O standards make this device an excellent interface hub in ultrasound front-ends, CT scanner data pipelines, and laboratory diagnostic instruments where multiple voltage domains and high-speed ADC/DAC interfaces must coexist on a single PCB.

#### Aerospace & Defense (Industrial Temp Variants)

While the XC2S200-6FGG1299C targets commercial temperature ranges, the Spartan-II architecture is also offered in industrial variants. The core design skills and toolchain remain identical, simplifying re-qualification efforts for regulated applications.


Why the XC2S200-6FGG1299C Outperforms Mask-Programmed ASICs

The Spartan-II family is a superior alternative to mask-programmed ASICs. The FPGA avoids the initial cost, lengthy development cycles, and inherent risk of conventional ASICs. FPGA programmability also permits design upgrades in the field with no hardware replacement necessary — something that is impossible with ASICs.

Here is a side-by-side comparison:

Factor XC2S200-6FGG1299C (FPGA) Mask-Programmed ASIC
NRE Cost $0 $500K–$5M+
Time-to-First-Silicon Same day (program in-circuit) 12–26 weeks
Design Iterations Unlimited Costly re-spin each time
Field Updates Yes — reprogram remotely No
Minimum Order Quantity 1 unit Often 10,000+ units
Risk Level Low High

For teams building low-to-medium volume systems or products that require iterative firmware updates, the XC2S200-6FGG1299C delivers a fundamentally better total cost of ownership than custom silicon.


Development Tools & Configuration Methods

Supported EDA Tools

The Spartan-II family is fully supported by the powerful Xilinx ISE development system, including fully automatic mapping, placement, and routing.

Tool Role
Xilinx ISE Design Suite 14.7 RTL synthesis, implementation, bitstream generation
ModelSim / ISIM HDL simulation and functional verification
ChipScope Pro In-system signal monitoring and logic debugging
JTAG Programmer / iMPACT Bitstream download and device configuration

Configuration Modes

Configuration data can be read from an external serial PROM (master serial mode), or written into the FPGA in slave serial, slave parallel, or Boundary Scan modes.

Mode Method Typical Use
Master Serial Reads from SPI/Serial PROM at power-up Standalone production systems
Slave Serial Host MCU streams bitstream in Managed embedded systems
Slave Parallel Parallel bus from MCU High-speed configuration needed
JTAG / Boundary Scan IEEE 1149.1 via debug probe Development, prototyping, ISP

Compatible Configuration PROMs

  • XCF01S (1 Mbit)
  • XCF02S (2 Mbit)
  • XCF04S (4 Mbit) ← Recommended for XC2S200 bitstream storage

Ordering & Product Information

Full Part Number Breakdown

Field Value
Full Part Number XC2S200-6FGG1299C
Manufacturer Xilinx (now AMD)
Product Family Spartan-II
Series XC2S200
Package 1299-Ball Fine-Pitch BGA (FGG), Pb-Free
Speed Grade -6 (Fastest Commercial)
Temperature Range Commercial: 0°C to +85°C
Core Supply Voltage 2.5V (VCCINT)
I/O Supply Voltage 1.5V / 2.5V / 3.3V (VCCO, per bank)
Configuration SRAM-based, unlimited reprogramming
RoHS Status Compliant (Pb-Free)
Lifecycle Status End-of-Life (legacy support stocked)

For engineers sourcing or designing with this device, visiting a Xilinx FPGA specialist supplier is the recommended path to verifying stock availability and lead times for the XC2S200-6FGG1299C.


Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1299C?

The -6 speed grade is the fastest timing variant available in the Spartan-II commercial family. It delivers the lowest propagation delays across all CLB, IOB, routing, and DLL paths — enabling system clock frequencies up to 263 MHz for the XC2S200 device. The -6 grade is only available in the commercial temperature range (0°C to +85°C).

What is the difference between the FG and FGG packages?

Both packages share an identical die, ball map, and electrical characteristics. The FG suffix indicates standard leaded (Pb-containing) solder balls, while the FGG suffix signifies a Pb-free (lead-free) variant, compliant with RoHS and WEEE regulations. The FGG package is required for products sold in the European Union and many other markets.

Is the XC2S200-6FGG1299C still in production?

The Xilinx Spartan-II family has reached End-of-Life (EOL) status. Xilinx no longer manufactures new units; however, authorized component distributors and franchised electronics brokers maintain stock for legacy board support, system maintenance, and authorized replacement purposes.

What programming language is used to design for the XC2S200-6FGG1299C?

The XC2S200-6FGG1299C is programmed using standard HDL (Hardware Description Language) — either VHDL or Verilog. The design flow runs through Xilinx ISE Design Suite, which handles synthesis, technology mapping, place-and-route, timing analysis, and bitstream generation.

Can the XC2S200-6FGG1299C be used as a drop-in replacement for other Spartan-II devices?

Spartan-II devices share footprint compatibility in common packages across the family, but the XC2S200’s 1299-ball FGG package is specific to the XC2S200 density. Engineers looking to upgrade from a smaller Spartan-II device should verify PCB pad layout and I/O bank voltage assignments before substituting.


Summary

The XC2S200-6FGG1299C is the most logic-dense and fastest commercial variant in the Xilinx Spartan-II FPGA family. With 200,000 system gates, 5,292 configurable logic cells, 284 user I/O pins, 56K bits of Block RAM, 75,264 bits of Distributed RAM, four on-chip Delay-Locked Loops, and a lead-free 1299-ball FGG BGA package, this device provides the performance, integration, and RoHS compliance required for professional-grade commercial applications. Whether you are sustaining a legacy product line, prototyping a new embedded design, or replacing a discontinued ASIC with programmable logic, the XC2S200-6FGG1299C is a battle-tested, well-documented, and widely supported FPGA solution.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.