Meta Description: Get full specs for the XC2S200-6FGG1298C – Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, -6 speed grade, and 1298-ball Pb-free FGG BGA package. Datasheet, features & applications guide.
The XC2S200-6FGG1298C is a top-tier programmable logic device from Xilinx’s Spartan-II FPGA family, built on advanced 0.18-micron process technology and engineered for high-performance commercial designs. Featuring 200,000 system gates, 5,292 configurable logic cells, and a 1298-ball Fine-Pitch BGA (FGG) Pb-free package, this device represents the highest logic density available in the Spartan-II generation. If you are sourcing a cost-effective, field-reprogrammable alternative to mask-programmed ASICs for telecommunications, industrial automation, or DSP applications, the XC2S200-6FGG1298C is a proven and versatile solution.
What Is the XC2S200-6FGG1298C?
Understanding the Part Number
The XC2S200-6FGG1298C is a member of the Xilinx Spartan-II FPGA family. Each segment of the part number carries specific technical meaning:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II family, 200,000 system gates |
| -6 |
Speed grade -6 (fastest commercial speed grade) |
| FGG |
Fine-Pitch Ball Grid Array, Pb-free (RoHS-compliant) package |
| 1298 |
1,298 solder balls |
| C |
Commercial temperature range: 0°C to +85°C |
The -6 speed grade is exclusively available in the Commercial temperature range across all Spartan-II devices. This makes the XC2S200-6FGG1298C the highest-performance commercial variant for designs operating in standard industrial and office environments.
XC2S200-6FGG1298C Full Technical Specifications
Core Logic Resources
| Parameter |
Value |
| Logic Cells |
5,292 |
| System Gates (Logic + RAM) |
200,000 |
| CLB Array |
28 × 42 |
| Total Configurable Logic Blocks (CLBs) |
1,176 |
| Maximum User I/O Pins |
284 |
| Total Distributed RAM Bits |
75,264 bits |
| Total Block RAM Bits |
56K bits (56,000 bits) |
| Configuration Bits |
1,335,840 |
Electrical & Timing Specifications
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Supply Voltage (VCCO) |
2.5V / 3.3V (per-bank configurable) |
| Process Node |
0.18 µm |
| Maximum System Clock Frequency |
Up to 263 MHz |
| Speed Grade |
-6 (fastest, Commercial only) |
| On-Chip Delay-Locked Loops (DLLs) |
4 (one at each corner of die) |
Package & Compliance Details
| Parameter |
Value |
| Package Type |
FGG – Fine-Pitch Ball Grid Array, Pb-free |
| Total Ball Count |
1,298 |
| Temperature Grade |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Yes – Pb-free (“G” suffix in package code) |
| Manufacturer |
Xilinx (now AMD) |
XC2S200-6FGG1298C Architecture & Key Features
#### Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1298C contains 1,176 CLBs arranged in a 28-column × 42-row matrix. Each CLB houses Look-Up Tables (LUTs), D-type flip-flops, and fast-carry logic chains. This structure supports the implementation of both combinatorial logic and clocked sequential circuits, enabling everything from simple decoders to complex finite state machines within a single device.
#### Block RAM Architecture
The device provides 56K bits of dual-port Block RAM through two columns of RAM blocks positioned on opposite sides of the die. Each Block RAM can be independently configured in a range of depth-width combinations, making it highly adaptable for use as data buffers, FIFO queues, lookup tables, or scratchpad memory in co-processor designs.
#### Distributed RAM
Beyond Block RAM, the XC2S200-6FGG1298C offers 75,264 bits of distributed RAM embedded directly within the CLB LUTs. This memory type is tightly coupled to the logic fabric, providing ultra-low-latency access for small data arrays, shift registers, and real-time control tables that require single-cycle read performance.
#### Four On-Chip Delay-Locked Loops (DLLs)
One Delay-Locked Loop is placed at each corner of the silicon die, giving the device four independent clock management resources. These DLLs allow designers to eliminate clock skew, multiply or divide the incoming clock frequency, and shift clock phase relationships — all without requiring off-chip components. This greatly simplifies PCB design and improves timing margins.
#### Flexible Multi-Standard I/O Banks
With up to 284 user I/O pins and independently powered I/O banks, the XC2S200-6FGG1298C supports a wide range of I/O voltage standards including LVTTL, LVCMOS 2.5V, LVCMOS 3.3V, PCI 3.3V, GTL, GTL+, HSTL, SSTL2, and SSTL3. Each bank’s VCCO pin can be set independently, allowing the same device to interface with both 2.5V and 3.3V logic families simultaneously.
#### Configuration Modes
| Configuration Mode |
CCLK Direction |
Data Width |
| Master Serial |
Output |
1-bit |
| Slave Serial |
Input |
1-bit |
| Slave Parallel |
Input |
8-bit |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
XC2S200-6FGG1298C vs. Spartan-II Family Members
The table below positions the XC2S200-6FGG1298C within the complete Spartan-II product family so engineers can assess logic density at a glance.
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
56K |
The XC2S200 is the top-tier device in the Spartan-II family, and the XC2S200-6FGG1298C — with its -6 speed grade and Pb-free 1298-ball BGA package — is the fastest and most I/O-rich commercial variant available.
Supported I/O Standards
| I/O Standard |
Supply Voltage |
Description |
| LVTTL |
3.3V |
Low-Voltage TTL |
| LVCMOS33 |
3.3V |
Low-Voltage CMOS 3.3V |
| LVCMOS25 |
2.5V |
Low-Voltage CMOS 2.5V |
| PCI |
3.3V |
33/66 MHz PCI bus |
| GTL |
Configurable |
Gunning Transceiver Logic |
| GTL+ |
Configurable |
GTL with higher VOH |
| HSTL |
1.5V |
High-Speed Transceiver Logic |
| SSTL2 |
2.5V |
Stub Series Terminated Logic 2.5V |
| SSTL3 |
3.3V |
Stub Series Terminated Logic 3.3V |
Application Areas for the XC2S200-6FGG1298C
#### Telecommunications & Protocol Bridging
The XC2S200-6FGG1298C’s 284 user I/O pins and high-speed DLL-managed clocking make it ideal for building SONET framers, ATM cell processors, and multi-protocol converters on line cards. It handles high-bandwidth data routing in real time with minimal external logic.
#### Industrial Automation & Motion Control
In industrial environments, this FPGA drives servo controllers, stepper motor indexers, and multi-axis motion systems. Its CLB fabric generates precise PWM waveforms and processes real-time encoder feedback while maintaining tight timing control from the on-chip DLLs.
#### Digital Signal Processing (DSP) Pipelines
The combination of distributed RAM and Block RAM allows the XC2S200-6FGG1298C to implement fully pipelined FIR filters, FFT engines, and convolution accelerators. Running at up to 263 MHz, these pipelines deliver the throughput needed for audio, video, and sensor data streams.
#### Embedded System Co-Processing
Paired with a host microcontroller or DSP, the XC2S200-6FGG1298C acts as a dedicated hardware accelerator — offloading DMA transfers, hardware encryption, data formatting, and interrupt aggregation from the main processor to free CPU bandwidth for application-level tasks.
#### Medical Imaging & Test Equipment
The device’s flexible multi-voltage I/O banks and on-chip DLLs provide the precision timing control required for ultrasound front-end logic, X-ray data acquisition, and precision benchtop test instruments demanding low jitter and high signal integrity.
#### ASIC Prototyping
Before committing a custom ASIC design to silicon, engineering teams use the XC2S200-6FGG1298C to prototype, validate, and iterate on the design. Reprogrammability eliminates NRE charges and removes the risk of an expensive mask re-spin.
Why the XC2S200-6FGG1298C Over a Custom ASIC?
| Criteria |
XC2S200-6FGG1298C (FPGA) |
Mask-Programmed ASIC |
| Non-Recurring Engineering Cost |
$0 |
$500K–$5M+ |
| Time to First Working Silicon |
Hours (reprogram) |
12–24 weeks |
| Design Change After Tape-Out |
Full reprogrammability |
Not possible |
| Field Upgradability |
Yes – via JTAG or PROM |
No |
| Risk of Design Errors |
Low – iterate freely |
High – one-shot |
| Volume Price Break-Even |
Low–medium volumes |
High volumes only |
For engineers exploring Xilinx FPGA solutions, the XC2S200-6FGG1298C provides an unbeatable combination of logic density, I/O flexibility, and zero NRE overhead — especially valuable in prototyping and low-to-medium production runs.
Design Tools & Software Support
The XC2S200-6FGG1298C is fully supported by the following Xilinx (AMD) software environment:
| Tool |
Version / Notes |
Purpose |
| Xilinx ISE Design Suite |
14.7 (last to support Spartan-II) |
Synthesis, place-and-route, bitstream |
| ISIM / ModelSim |
Bundled with ISE |
HDL behavioral simulation |
| ChipScope Pro |
Integrated analyzer |
In-system debugging via JTAG |
| iMPACT Programmer |
Bundled with ISE |
JTAG configuration and PROM programming |
| CORE Generator |
Bundled with ISE |
IP core instantiation (FIFOs, RAM, etc.) |
The device is programmed via JTAG or auto-configured at power-up from a compatible Xilinx Platform Flash PROM.
Compatible Configuration PROMs
| PROM Part Number |
Configuration Bits |
Notes |
| XCF01S |
1,048,576 |
Fits XC2S200 (1,335,840 bits – use XCF02S) |
| XCF02S |
2,097,152 |
Recommended for XC2S200 |
| XCF04S |
4,194,304 |
Supports daisy-chain multi-device configurations |
Ordering Information
| Parameter |
Detail |
| Full Part Number |
XC2S200-6FGG1298C |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Spartan-II |
| Package |
1298-Ball Fine-Pitch BGA (FGG), Pb-Free |
| Speed Grade |
-6 (Fastest Commercial) |
| Temperature Range |
Commercial: 0°C to +85°C |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
2.5V / 3.3V |
| RoHS Status |
Compliant (Pb-free) |
| Lifecycle Status |
End of Life – legacy stock available |
Frequently Asked Questions (FAQ)
Q: What does the “-6” speed grade mean on the XC2S200-6FGG1298C? A: The -6 speed grade is the fastest timing bin available in the Spartan-II Commercial family. It delivers the lowest propagation delays through all logic paths and is exclusively paired with the Commercial temperature range (0°C to +85°C). If maximum clock frequency is your priority, the -6 grade is the correct choice.
Q: What is the difference between the FG and FGG packages? A: The FG package uses tin-lead (SnPb) solder balls, while the FGG double-G suffix denotes the Pb-free, RoHS-compliant version of the same package. Both are mechanically and electrically equivalent — only the solder composition differs, making the FGG suitable for RoHS-regulated markets worldwide.
Q: How does the XC2S200-6FGG1298C differ from the XC2S200-6FGG1297C? A: The two variants differ only in ball count — 1298 vs. 1297 solder balls — reflecting different package revisions or pin assignments for specific I/O configurations. Engineers should consult the latest AMD/Xilinx packaging documentation and PCB footprint files before committing to a layout to ensure pin-map compatibility.
Q: Is the XC2S200-6FGG1298C still available to purchase? A: The Spartan-II family has reached End-of-Life (EOL) status. However, authorized distributors and specialist component brokers continue to maintain inventory for legacy system maintenance, repair, and production continuity programs.
Q: Which configuration PROM should I use with the XC2S200-6FGG1298C? A: The XCF02S is the recommended Platform Flash PROM, as it offers 2,097,152 configuration bits — sufficient to store the XC2S200’s 1,335,840-bit bitstream with headroom. The XCF04S supports multi-device daisy-chain configurations.
Q: What HDL languages are supported for design entry? A: The XC2S200-6FGG1298C supports design entry in VHDL, Verilog HDL, and schematic capture through Xilinx ISE 14.7. Mixed-language designs are also supported via ISE’s synthesis flow.
Summary
The XC2S200-6FGG1298C is the flagship commercial device in the Xilinx Spartan-II FPGA family. Combining 200,000 system gates, 5,292 logic cells, 284 user I/O pins, 56K bits of Block RAM, four on-chip DLLs, and a 1298-ball Pb-free Fine-Pitch BGA package, it delivers the logic capacity, speed performance, and I/O flexibility needed for demanding commercial applications. Fully supported by Xilinx ISE 14.7 and compatible with JTAG/PROM-based configuration workflows, the XC2S200-6FGG1298C remains a well-documented and readily available choice for both new designs and legacy system support.
