Meta Description: Buy the XC2S200-6FGG1297C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, and 1297-ball FGG BGA package. Full specs, features & pricing guide.

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The XC2S200-6FGG1297C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for engineers who need a cost-effective yet powerful programmable logic solution, this device offers 200,000 system gates, 5,292 configurable logic cells, and a 1297-ball Fine-Pitch BGA (FGG) lead-free package — making it one of the most capable members of the Spartan-II lineup for demanding commercial applications. Whether you are designing communication systems, industrial controllers, or digital signal processing pipelines, the XC2S200-6FGG1297C delivers the logic density and speed performance your project requires.

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What Is the XC2S200-6FGG1297C?

The XC2S200-6FGG1297C belongs to Xilinx’s Spartan-II FPGA family — a generation of devices built on 0.18-micron process technology and optimized for high-volume, cost-sensitive designs. The part number breaks down as follows:

The -6 speed grade is exclusively available in the Commercial temperature range, meaning this variant is engineered specifically for commercial-grade environments where maximum clock performance is the priority.

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XC2S200-6FGG1297C Key Specifications

Core Logic Resources

Electrical & Timing Characteristics

Package Information

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XC2S200-6FGG1297C Features & Architecture

#### Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1297C is its matrix of 1,176 Configurable Logic Blocks arranged in a 28 × 42 grid. Each CLB contains Look-Up Tables (LUTs), flip-flops, and multiplexers, offering flexible implementation of combinatorial and sequential digital logic. This architecture supports both fine-grained and coarse-grained logic mapping, making it suitable for everything from simple glue logic to full state machine controllers.

#### Block RAM and Distributed Memory

The device includes 56K bits of dedicated Block RAM and 75,264 bits of distributed RAM embedded within the CLB fabric. These two memory tiers serve distinct design roles:

• Distributed RAM is woven directly into the CLB LUTs, ideal for small, speed-critical buffers and FIFOs.
• Block RAM provides large, synchronous dual-port memory blocks that are perfect for data buffering, look-up tables, and co-processor memory structures.

#### Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (one at each corner of the die) enable precise clock management, including clock deskewing, frequency synthesis, and phase shifting. This eliminates PCB-level clock distribution problems and maximizes system timing margins.

#### Flexible I/O Structure

With up to 284 user I/O pins, the XC2S200-6FGG1297C supports multiple I/O standards including LVTTL, LVCMOS 2.5V/3.3V, PCI (3.3V), GTL, HSTL, and more. Each I/O bank can be independently powered, providing system-level voltage flexibility across different bus interfaces.

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XC2S200-6FGG1297C vs. Other Spartan-II Family Members

Understanding how the XC2S200-6FGG1297C stacks up against its siblings helps engineers choose the right device for their design.

The XC2S200 is the largest and highest-density device in the Spartan-II family, making the XC2S200-6FGG1297C the top-performing commercial variant available in this generation.

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Applications of the XC2S200-6FGG1297C

#### Telecommunications & Networking

The high I/O count and fast speed grade make the XC2S200-6FGG1297C an excellent choice for line-card controllers, protocol bridges, and network packet processors. Its CLB fabric can implement high-throughput state machines and serial interface logic with ease.

#### Industrial Automation & Motor Control

In industrial environments, the device’s reliable CLB architecture and flexible I/O banks are used in PLC-style controllers, servo drives, and multi-axis motion systems. The device supports real-time feedback loops and PWM generation without additional external logic.

#### Digital Signal Processing (DSP)

The XC2S200-6FGG1297C supports FIR/IIR filter implementations, FFT engines, and image processing pipelines. The combination of distributed RAM and Block RAM allows designers to build pipelined DSP architectures that process data at full-clock rates.

#### Embedded System Acceleration

When paired with a microcontroller or DSP, this FPGA acts as a hardware accelerator — offloading time-critical tasks like DMA control, data formatting, and hardware encryption to the programmable logic fabric.

#### Medical & Test Equipment

The device’s 284-pin I/O flexibility and on-chip DLLs make it well-suited for medical imaging equipment, diagnostic instruments, and precision test & measurement systems that demand high signal integrity.

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Why Choose the XC2S200-6FGG1297C Over Mask-Programmed ASICs?

Unlike conventional ASICs, the XC2S200-6FGG1297C offers significant advantages for production and development teams:

• No NRE (Non-Recurring Engineering) costs — eliminate the expensive mask-set charges of custom ASICs.
• Field reconfigurability — update your design in the field without replacing hardware.
• Faster time-to-market — skip the 12–24 week ASIC fabrication cycle.
• Lower risk — iterate on your design freely without committing to silicon.

For engineers who require the Xilinx FPGA reliability with the flexibility of programmable logic, the XC2S200-6FGG1297C is a proven, production-grade solution.

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Design Tools & Development Support

The XC2S200-6FGG1297C is supported by the following Xilinx (AMD) software tools:

The device is programmed using JTAG or a supported configuration PROM (e.g., XCF01S / XCF02S). It is fully supported under Xilinx ISE 14.7, the last official release to include Spartan-II device support.

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Ordering Information

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Frequently Asked Questions (FAQ)

Q: What does the “-6” speed grade mean on the XC2S200-6FGG1297C? A: The -6 speed grade indicates the fastest timing performance available in the Spartan-II commercial family. It is only offered in the commercial temperature range (0°C to +85°C) and provides the lowest propagation delays across all logic paths.

Q: What is the difference between the FG and FGG packages? A: The standard FG package uses leaded solder balls, while the FGG (double-G) package is the Pb-free (RoHS-compliant) version of the same footprint. Both are electrically and pin-compatible; the suffix change only reflects the solder composition.

Q: Is the XC2S200-6FGG1297C still in production? A: The Spartan-II family has reached End-of-Life status. However, authorized distributors and component brokers maintain inventory for legacy support and system maintenance purposes.

Q: What configuration memory is compatible with the XC2S200-6FGG1297C? A: Xilinx Platform Flash PROMs such as the XCF01S, XCF02S, and XCF04S are compatible and can be used to store and automatically load the bitstream at power-up.

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Summary

The XC2S200-6FGG1297C is the highest-density, fastest commercial device in the Xilinx Spartan-II FPGA family. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, 56K bits of Block RAM, and a lead-free 1297-ball FGG BGA package, it provides a powerful and RoHS-compliant solution for a wide range of professional applications. Whether you are maintaining legacy systems or evaluating this device for a new embedded design, the XC2S200-6FGG1297C remains a well-documented, widely-supported, and readily available FPGA option.