Comprehensive Overview of XC2S200-6FGG1292C
The XC2S200-6FGG1292C belongs to the second generation of Xilinx’s ASIC-replacement technology. It features a robust architecture based on the Virtex FPGA platform, optimized for high-volume production. With 200,000 system gates and a core voltage of 2.5V, it delivers the necessary throughput for time-critical applications while maintaining a low-power profile.
Key Technical Specifications
The following table highlights the primary electrical and logical characteristics of the XC2S200 series, ensuring it meets your specific design requirements.
| Attribute |
Specification Value |
| Manufacturer |
AMD / Xilinx |
| Series |
Spartan-II |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| Total RAM Bits |
57,344 Bits |
| Block RAM |
56K Bits |
| Operating Supply Voltage |
2.375 V to 2.625 V (2.5V Typical) |
| Operating Temperature |
0°C ~ +85°C (Commercial) |
| Speed Grade |
-6 (High Performance) |
| Mounting Style |
SMD/SMT (Surface Mount) |
Core Architecture and Functional Features
The architecture of the XC2S200-6FGG1292C is designed for scalability and ease of integration. It utilizes a regular, flexible structure of Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs).
1. Advanced Memory Resources
This FPGA incorporates a hierarchical memory structure. It provides 16 bits of distributed RAM per Look-Up Table (LUT) and dedicated 4K-bit blocks of Block SelectRAM+. This dual-layer approach allows for efficient data buffering and high-speed local storage within the fabric.
2. Clock Management and DLLs
Stability is paramount in high-speed digital designs. The XC2S200 is equipped with four dedicated Delay-Locked Loops (DLLs). These DLLs provide:
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Zero propagation delay clock distribution.
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Clock multiplication and division.
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Quadrature phase outputs (0°, 90°, 180°, and 270°).
3. Versatile I/O Standards
To ensure compatibility with modern system interfaces, the device supports 16 high-performance interface standards, including:
XC2S200-6FGG1292C Packaging and Physical Dimensions
The “FGG” in the part number indicates a Fine-Pitch Ball Grid Array (FBGA) package that is lead-free (RoHS compliant). This packaging is ideal for high-density PCB layouts where space and thermal dissipation are critical factors.
| Package Detail |
Description |
| Package Type |
FBGA-1292 (Fine-Pitch Ball Grid Array) |
| Pin Count |
1292 |
| Standard |
Lead-Free / RoHS Compliant |
| Thermal Range |
Commercial Grade (0°C to 85°C) |
Why Choose the Xilinx Spartan-II Family?
The primary advantage of the XC2S200-6FGG1292C is its ability to eliminate the high non-recurring engineering (NRE) costs and long lead times associated with traditional ASICs. Designers can implement complex logic and perform field upgrades without changing the hardware.
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Fast Time-to-Market: Leverage Xilinx ISE® Design Suite for rapid synthesis and implementation.
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Reprogrammability: Unlimited reprogrammability through SRAM-based configuration.
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Legacy Reliability: A proven architecture used extensively in industrial and telecommunications sectors.
For more information on compatible devices and design resources, visit the Xilinx FPGA LINK: https://pcbsync.com/xilinx-fpga/.
Applications and Use Cases
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Industrial Automation: Real-time motor control and sensor fusion.
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Telecommunications: High-speed data packet processing and switching.
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Consumer Electronics: Bridge logic between disparate hardware protocols.
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Legacy System Support: Ideal for maintaining long-lifecycle industrial equipment.
