Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1275C Xilinx Spartan-II FPGA: Complete Technical Specifications and Overview

Product Details

Meta Description: Explore the high-performance XC2S200-6FGG1275C Xilinx Spartan-II FPGA. Featuring 200,000 system gates and 5,292 logic cells, this technical guide covers specs, pinouts, and applications for industrial and commercial designs.

The XC2S200-6FGG1275C is a premier Field Programmable Gate Array (FPGA) within the Xilinx Spartan-II family. Designed to offer a cost-effective alternative to fixed-gate ASICs, this device provides substantial logic density and high-speed performance for demanding digital applications. Built on a proven 0.18µm CMOS process, the XC2S200-6FGG1275C balances power efficiency with the robust processing power required for modern embedded systems.

Core Architecture of XC2S200-6FGG1275C

The XC2S200-6FGG1275C utilizes the refined Virtex-based architecture, which allows for seamless design migration and scalability. At its core, the device features a flexible grid of Configurable Logic Blocks (CLBs), surrounded by a perimeter of programmable Input/Output Blocks (IOBs). This structure ensures that designers can implement complex combinational and sequential logic with predictable timing and low latency.

Logic and Memory Resources

With 5,292 logic cells and 200,000 system gates, the XC2S200-6FGG1275C is capable of handling sophisticated algorithms. The memory hierarchy includes both Block RAM for large data buffers and Distributed RAM for localized, high-speed lookup tables.

XC2S200-6FGG1275C Technical Specifications Table

The following table highlights the primary electrical and logical attributes of the XC2S200-6FGG1275C.

Parameter Specification
Series Spartan-II
System Gates 200,000
Logic Cells 5,292
Configurable Logic Blocks (CLBs) 1,176
Total Block RAM 56 Kbits
Distributed RAM 75,264 Bits
Speed Grade -6 (Fastest Commercial)
Operating Temperature 0°C to +85°C (Commercial)
Supply Voltage (Core) 2.5V (± 5%)
I/O Standards LVTTL, LVCMOS, PCI, GTL, SSTL

Key Features of the XC2S200-6FGG1275C

Advanced Clock Management

The device incorporates four dedicated Delay-Locked Loops (DLLs) for advanced clock control. These DLLs provide precise clock de-skewing, frequency multiplication, and division, which are critical for maintaining signal integrity in high-frequency designs.

Versatile I/O Capabilities

The XC2S200-6FGG1275C supports 16 high-performance interface standards. This versatility allows the FPGA to interface directly with various system components operating at different voltage levels, ranging from 1.5V to 3.3V.

Unlimited Reprogrammability

As an SRAM-based FPGA, the XC2S200-6FGG1275C offers unlimited reconfiguration cycles. This feature allows for in-system updates, rapid prototyping, and reduced time-to-market compared to traditional ASIC development.

Package and Pinout Information

The “FGG1275” designation refers to the Fine-pitch Ball Grid Array (FBGA) package. This high-density packaging is designed for applications requiring a massive number of user I/Os and superior thermal dissipation.

Package Attribute Details
Package Type Fine-pitch BGA (FGG)
Pin/Ball Count 1275 Pins
Mounting Style Surface Mount (SMD/SMT)
RoHS Compliance Lead-Free (Pb-free)
Material High-grade substrate for thermal stability

Primary Applications for XC2S200-6FGG1275C

The robust feature set of the XC2S200-6FGG1275C makes it suitable for a wide variety of industries:

  1. Telecommunications: High-speed data routing and protocol conversion.

  2. Industrial Automation: Real-time motor control and PLC replacement logic.

  3. Consumer Electronics: Video processing and high-bandwidth interface bridging.

  4. Digital Signal Processing (DSP): Efficient implementation of FIR and IIR filters.

For more information on selecting the right components for your next project, visit our guide on Xilinx FPGA.

Conclusion

The XC2S200-6FGG1275C stands out as a reliable and flexible solution for designers who need high gate counts without the extreme costs associated with modern high-end FPGAs. By combining the speed of the -6 grade with the extensive I/O capacity of the 1275-pin package, it remains a go-to choice for sophisticated digital systems. Whether you are developing complex industrial controllers or high-bandwidth communication tools, the XC2S200-6FGG1275C provides the performance and stability required for success.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.