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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1269C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

The XC2S200-6FGG1269C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Combining 200,000 system gates, 5,292 logic cells, and a 1,269-ball Fine-Pitch BGA (FBGA) package, this device delivers outstanding programmable logic capability for commercial-grade embedded applications. Whether you are designing digital signal processing systems, communication hardware, or industrial controllers, the XC2S200-6FGG1269C offers the flexibility and reliability engineers demand.


What Is the XC2S200-6FGG1269C? A Complete Overview

The XC2S200-6FGG1269C is part of Xilinx’s Spartan-II 2.5V FPGA product line — a family that was designed as a cost-effective, high-volume programmable alternative to mask-programmed ASICs. It eliminates lengthy ASIC development cycles and allows in-field design updates without hardware replacement, making it ideal for iterative product development.

The part number decodes as follows:

Code Segment Meaning
XC2S200 Spartan-II family, 200K system gates
-6 Speed grade -6 (fastest available, commercial range only)
FGG Fine-Pitch Ball Grid Array (FBGA), Pb-Free package
1269 1,269 pins/balls
C Commercial temperature range (0°C to +85°C)

For engineers sourcing programmable logic devices, the Xilinx FPGA portfolio offers a broad range of options across performance tiers and package types.


XC2S200-6FGG1269C Key Specifications

Core Logic Resources

Parameter Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K

Electrical & Physical Characteristics

Parameter Value
Core Supply Voltage (VCCINT) 2.5V
Technology Node 0.18 µm
Maximum Operating Frequency 263 MHz
Package Type FBGA (Fine-Pitch BGA), Pb-Free
Pin Count 1,269
Temperature Range Commercial (0°C to +85°C)
Speed Grade -6 (fastest Spartan-II speed grade)
RoHS Compliance Pb-Free (“G” in ordering code)

Configuration Modes Supported

Configuration Mode Pre-config Pull-ups CCLK Direction Data Width
Master Serial No Output 1-bit
Slave Serial Yes Input 1-bit
Slave Parallel Yes Input 8-bit
Boundary-Scan (JTAG) Yes N/A 1-bit

XC2S200-6FGG1269C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The XC2S200 features a 28×42 array of Configurable Logic Blocks (CLBs), totalling 1,176 CLBs. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that can be configured to implement virtually any combinational or sequential logic function. The CLB architecture supports fast carry logic for efficient arithmetic operations and wide function generators for complex boolean expressions.

Block RAM

The device provides 56K bits of dedicated Block RAM organized in two columns on opposite sides of the die. Block RAM supports synchronous read/write operations and can be configured in various aspect ratios, making it suitable for FIFOs, lookup tables, and on-chip memory buffers.

Distributed RAM

Beyond block RAM, 75,264 bits of distributed RAM are available within the CLB array itself. This allows high-speed, single-cycle access to small memory structures without consuming dedicated block RAM resources.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1269C includes four Delay-Locked Loops (DLLs), one at each corner of the die. DLLs enable precise clock management, including zero-delay buffering, clock phase shifting, and frequency synthesis, which are critical for high-speed synchronous designs.

Input/Output Blocks (IOBs)

The device supports up to 284 user I/O pins. Each IOB includes programmable pull-up/pull-down resistors, 3-state control, and supports multiple I/O standards, giving designers flexibility in interfacing with external components.


XC2S200-6FGG1269C vs. Other Spartan-II Devices

The table below places the XC2S200 in context within the full Spartan-II family, helping designers select the right device for their gate count and I/O requirements.

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Dist. RAM (bits) Block RAM
XC2S15 432 15,000 8×12 96 86 6,144 16K
XC2S30 972 30,000 12×18 216 92 13,824 24K
XC2S50 1,728 50,000 16×24 384 176 24,576 32K
XC2S100 2,700 100,000 20×30 600 176 38,400 40K
XC2S150 3,888 150,000 24×36 864 260 55,296 48K
XC2S200 5,292 200,000 28×42 1,176 284 75,264 56K

The XC2S200 is the largest and most capable device in the Spartan-II lineup, making it the preferred choice for designs requiring maximum logic density within this family.


Common Applications for the XC2S200-6FGG1269C

Digital Signal Processing (DSP)

The abundant CLBs and distributed RAM make this FPGA well-suited for FIR/IIR filter implementations, FFT engines, audio codecs, and image processing pipelines that require parallel computation.

Communications & Networking

The XC2S200-6FGG1269C can implement custom communication protocols, forward error correction (FEC) encoders/decoders, SERDES bridges, and network interface logic, particularly in telecom line cards and routers.

Industrial Automation & Control

With programmable I/O and a wide range of supported I/O standards, this device is used in motor drive controllers, programmable logic controllers (PLCs), sensor fusion platforms, and industrial data acquisition systems.

Embedded System Acceleration

Designers use the FPGA’s large gate count to implement soft processors (such as MicroBlaze) alongside custom peripherals, enabling highly integrated SoC-like designs on a single programmable chip.

Aerospace & Defense (Evaluation/Prototype)

The commercial-grade speed-6 variant is widely used during prototype and evaluation phases for aerospace instrumentation and radar front-end processing before migrating to radiation-hardened devices.


Understanding the XC2S200-6FGG1269C Part Number: Ordering Guide

Pb-Free vs. Standard Packaging

The “G” in “FGG” indicates a Pb-Free (RoHS-compliant) package, distinguishing it from earlier standard packaging variants. When ordering for RoHS-compliant products, always verify the “G” suffix is present in the package code.

Speed Grade -6: What It Means

The -6 speed grade is the highest performance speed grade available in the Spartan-II family and is exclusively offered in the Commercial temperature range. It provides the shortest propagation delays and the highest achievable operating frequency (up to 263 MHz), making it the go-to choice for timing-critical designs.

Temperature Range

The trailing “C” designates Commercial temperature range, specifying operation from 0°C to +85°C ambient. For designs requiring operation across a wider temperature range, the Industrial (“I”) grade variants at slower speed grades should be considered.


Design Tools & Software Support

The XC2S200-6FGG1269C is supported by Xilinx’s ISE Design Suite (the primary toolchain for legacy Spartan-II devices). The recommended design flow includes:

Tool Purpose
ISE Design Suite Synthesis, implementation, place & route
ModelSim / XSIM HDL simulation (VHDL / Verilog)
iMPACT Device programming and configuration
ChipScope Pro In-circuit logic analysis and debugging
CORE Generator IP core generation (DLLs, FIFO, etc.)

Note: Vivado Design Suite does not support Spartan-II devices. Designers must use ISE 14.7 or earlier for this device family.


Frequently Asked Questions (FAQ)

What does the -6 speed grade mean for the XC2S200?

The -6 speed grade is the fastest available in the Spartan-II family, providing minimum propagation delays and the highest achievable clock frequencies. It is only available in the Commercial (0°C to +85°C) temperature range.

Is the XC2S200-6FGG1269C RoHS compliant?

Yes. The “G” suffix in the package code (FGG) indicates a Pb-Free, RoHS-compliant package suitable for modern environmentally-conscious manufacturing processes.

Can the XC2S200-6FGG1269C be reprogrammed in the field?

Yes. Like all SRAM-based FPGAs, the XC2S200 is fully reprogrammable and supports in-system reconfiguration via JTAG (Boundary-Scan), Master Serial, Slave Serial, or Slave Parallel configuration modes without any hardware replacement.

What is the core supply voltage?

The core supply voltage (VCCINT) is 2.5V. The I/O voltage (VCCO) is configurable per I/O bank to support multiple I/O standards.

Which design software supports this device?

Xilinx ISE Design Suite (version 14.7 or earlier) is required for Spartan-II devices. Vivado does not support the Spartan-II family.


Summary: Why Choose the XC2S200-6FGG1269C?

The XC2S200-6FGG1269C stands out as the largest and highest-performance device in the Spartan-II family, offering 200K system gates, 284 user I/O pins, 56K bits of block RAM, and the -6 speed grade in a compact 1,269-ball Pb-Free FBGA package. It represents a proven, cost-effective programmable logic solution for commercial embedded design, ideal for engineers who need maximum logic density with in-field reconfigurability and a well-established silicon platform.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.