Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1268C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

The XC2S200-6FGG1268C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in a 1268-ball Fine-Pitch BGA (FBGA) package — making it one of the most capable members of the Spartan-II lineup. Whether you are designing embedded systems, telecom hardware, or industrial controllers, the XC2S200-6FGG1268C offers a powerful balance of logic density, I/O flexibility, and 2.5V operation.


What Is the XC2S200-6FGG1268C?

The XC2S200-6FGG1268C is part of the Xilinx Spartan-II FPGA series — a family of 2.5V, SRAM-based programmable logic devices built on 0.18 µm process technology. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II family, 200K system gates
-6 Speed grade 6 (fastest in the family, commercial range only)
FGG Fine-pitch Ball Grid Array (BGA), Pb-free packaging (extra “G”)
1268 1268 pins/balls
C Commercial temperature range (0°C to +85°C)

This device is available in Pb-free (RoHS-compliant) packaging, indicated by the double “GG” in the package code.


XC2S200-6FGG1268C Key Specifications

The table below summarizes all critical electrical and logic specifications for the XC2S200-6FGG1268C.

Parameter Value
Family Xilinx Spartan-II
Device XC2S200
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K
Speed Grade -6 (fastest)
Core Voltage 2.5V
Process Technology 0.18 µm
Max Frequency 263 MHz
Package 1268-Ball Fine-Pitch BGA (FGG1268)
Temperature Range Commercial: 0°C to +85°C
DLL Count 4 (one per corner)
Configuration Modes Master Serial, Slave Serial, Slave Parallel, Boundary Scan
RoHS Compliant Yes (Pb-free, FGG package)

XC2S200-6FGG1268C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1268C contains 1,176 CLBs arranged in a 28×42 grid. Each CLB includes four-input Look-Up Tables (LUTs), flip-flops, and fast carry logic. This flexible architecture enables efficient implementation of combinational and sequential logic, arithmetic circuits, and state machines.

Block RAM and Distributed RAM

The device provides two memory resources for on-chip storage:

  • Distributed RAM: 75,264 bits, embedded within CLBs using LUT resources
  • Block RAM: 56K bits, organized as two columns of dedicated RAM blocks on opposite sides of the die

These resources make the XC2S200-6FGG1268C well-suited for buffering, FIFO design, and lookup table-heavy applications.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide precise clock management. DLLs enable clock deskew, frequency synthesis, and phase shifting, which are critical for high-speed synchronous designs.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1268C supports up to 284 user I/Os plus four dedicated global clock/user input pins. The IOBs support a wide range of I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL, offering broad compatibility with modern digital interfaces.


Spartan-II Family Comparison Table

The XC2S200 is the largest member of the Spartan-II family. The table below shows how it compares to other devices in the series.

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 8×12 96 86 6,144 bits 16K
XC2S30 972 30,000 12×18 216 92 13,824 bits 24K
XC2S50 1,728 50,000 16×24 384 176 24,576 bits 32K
XC2S100 2,700 100,000 20×30 600 176 38,400 bits 40K
XC2S150 3,888 150,000 24×36 864 260 55,296 bits 48K
XC2S200 5,292 200,000 28×42 1,176 284 75,264 bits 56K

The XC2S200 delivers the maximum logic density and I/O count available in the Spartan-II generation, making it the top choice for designs that require the full capability of this family.


Configuration Modes

The XC2S200-6FGG1268C supports four configuration modes, providing flexible programming options for different system architectures.

Configuration Mode Pre-Config Pull-ups CCLK Direction Data Width Serial DOUT
Master Serial No Output 1 Yes
Slave Parallel Yes Input 8 No
Boundary-Scan Yes N/A 1 No
Slave Serial Yes Input 1 Yes

All I/O drivers remain in a high-impedance state during power-on and throughout configuration, ensuring safe system startup behavior.


XC2S200-6FGG1268C Package Information

The FGG1268 package is a 1268-ball Fine-Pitch Ball Grid Array with Pb-free (lead-free) solder balls, indicated by the double “G” suffix in compliance with RoHS directives. This large-footprint BGA package provides maximum I/O pin access for complex, high-density PCB designs.

Package Detail Value
Package Type Fine-Pitch Ball Grid Array (FBGA)
Total Pins/Balls 1,268
Pb-Free Yes (FGG = Pb-free BGA)
Terminal Form Solder Ball
Package Shape Square
RoHS Status Compliant

Key Features and Benefits of the XC2S200-6FGG1268C

#### Speed Grade -6: Maximum Performance

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the commercial temperature range. Operating up to 263 MHz, it is ideal for performance-critical applications where clock speed and timing margins are decisive factors.

#### Cost-Effective ASIC Alternative

The Spartan-II was specifically designed as a cost-effective, flexible alternative to mask-programmed ASICs. Unlike traditional ASICs, the XC2S200-6FGG1268C eliminates the need for expensive non-recurring engineering (NRE) costs, long development cycles, and the risk of hardware obsolescence — design changes can be made in the field by reprogramming the device.

#### Versatile I/O Standard Support

With support for multiple I/O standards (LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL2, SSTL3), this FPGA integrates easily into mixed-voltage environments and legacy system designs.

#### Hierarchical Routing Architecture

A powerful, multi-level routing hierarchy connects CLBs, IOBs, and block RAM, minimizing routing congestion and improving timing closure even in complex, high-fanout designs.


Typical Applications

The XC2S200-6FGG1268C is deployed across a wide range of industries due to its versatility, logic capacity, and I/O density.

Application Area Use Case Example
Telecommunications Line card logic, protocol bridging, framing controllers
Industrial Automation Motor control interfaces, PLC co-processors, sensor fusion
Embedded Systems Custom processor peripherals, hardware accelerators
Consumer Electronics Display controllers, signal processing pipelines
Test & Measurement Data acquisition front-ends, pattern generators
Automotive Engine control unit (ECU) assist logic, CAN interface expansion
Military/Defense Signal intelligence, radar processing front-end

Development Tools and Software Support

Designing with the XC2S200-6FGG1268C requires Xilinx’s legacy ISE Design Suite (the Spartan-II is not supported in Vivado). Key toolchain components include:

  • ISE Design Suite – Synthesis, implementation, and bitstream generation
  • ChipScope Pro – In-system logic analyzer for real-time debugging
  • IMPACT – Programming and configuration tool for JTAG and configuration PROMs
  • XPower – Power estimation and analysis

Note: The XC2S200 series is classified as “Not Recommended for New Designs” (NRND) by AMD Xilinx. For new projects requiring similar logic density, consider evaluating newer Spartan families. For legacy system maintenance, repair, or exact replacement sourcing, the XC2S200-6FGG1268C remains a reliable option.


Ordering Information and Part Number Decoder

Understanding the Xilinx Spartan-II part number structure ensures you order the correct variant for your application.

XC2S200 - 6 - FGG - 1268 - C
  |       |    |      |     |
  |       |    |      |     └─ Temperature: C = Commercial (0°C ~ +85°C)
  |       |    |      |                     I = Industrial (-40°C ~ +85°C)
  |       |    |      └─ Pin Count: 1268 balls
  |       |    └─ Package: FGG = Pb-free Fine-Pitch BGA
  |       └─ Speed Grade: -6 (fastest, commercial only)
  └─ Device: Spartan-II, 200K system gates

For a broader selection of Xilinx programmable logic devices across all Spartan and Artix generations, visit our Xilinx FPGA product catalog.


XC2S200-6FGG1268C vs. Similar Devices

If the XC2S200-6FGG1268C is not available or does not meet your requirements, the following alternatives provide similar logic capacity:

Part Number Gates Package Speed Grade Key Difference
XC2S200-6FG456C 200K 456-ball FBGA (Pb-free) -6 Smaller package, fewer accessible I/Os
XC2S200-5FGG1268C 200K 1268-ball FBGA (Pb-free) -5 Same package, slower speed grade
XC2S200-6PQ208C 200K 208-pin PQFP -6 Through-hole-friendly QFP, fewer I/Os
XC2S200E-6FGG1268C 200K 1268-ball FBGA -6 Enhanced Spartan-IIE, extra features

Frequently Asked Questions (FAQ)

What does the “6” speed grade mean on the XC2S200-6FGG1268C?

The -6 speed grade is the fastest available in the Spartan-II family, supporting a maximum operating frequency of up to 263 MHz. It is only available in the commercial temperature range (0°C to +85°C).

Is the XC2S200-6FGG1268C RoHS compliant?

Yes. The double “G” in “FGG” indicates a Pb-free (lead-free) package, making this part RoHS compliant and suitable for use in environmentally regulated markets.

What is the difference between FG and FGG packages?

“FG” denotes a standard Fine-Pitch BGA with standard (leaded) solder balls. “FGG” (extra “G”) indicates the Pb-free version of the same package — identical in footprint and dimensions, differing only in solder ball composition.

Can the XC2S200-6FGG1268C be used in industrial temperature applications?

No. Speed grade -6 is exclusively available in the Commercial temperature range (0°C to +85°C). For industrial temperature operation (-40°C to +85°C), use the -5 or -4 speed grade variants with the “I” suffix.

What design software should I use for the XC2S200-6FGG1268C?

Use Xilinx ISE Design Suite (Legacy). The Spartan-II family predates Vivado and is not supported in that toolchain. ISE Design Suite is available as a free download from AMD’s website for legacy device support.

What configuration memory is compatible with the XC2S200-6FGG1268C?

Xilinx Platform Flash PROMs (XCF-series) are the standard companion configuration memories. The device can also be configured via JTAG boundary scan or by an external microcontroller in Slave Serial or Slave Parallel mode.


Summary

The XC2S200-6FGG1268C is the flagship device of the Xilinx Spartan-II family — offering 200,000 system gates, 5,292 logic cells, 284 user I/Os, 75K bits of distributed RAM, and 56K bits of block RAM in a 1268-ball, Pb-free Fine-Pitch BGA package. Running at the fastest available -6 speed grade with a commercial temperature rating, it remains a highly capable and widely-sourced FPGA for legacy system maintenance, repair, and specialized design work.

For the full range of Xilinx programmable logic solutions — including current-generation Spartan, Artix, and Kintex devices — explore our complete Xilinx FPGA catalog.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.