The XC2S200-6FGG1268C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in a 1268-ball Fine-Pitch BGA (FBGA) package — making it one of the most capable members of the Spartan-II lineup. Whether you are designing embedded systems, telecom hardware, or industrial controllers, the XC2S200-6FGG1268C offers a powerful balance of logic density, I/O flexibility, and 2.5V operation.
What Is the XC2S200-6FGG1268C?
The XC2S200-6FGG1268C is part of the Xilinx Spartan-II FPGA series — a family of 2.5V, SRAM-based programmable logic devices built on 0.18 µm process technology. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II family, 200K system gates |
| -6 |
Speed grade 6 (fastest in the family, commercial range only) |
| FGG |
Fine-pitch Ball Grid Array (BGA), Pb-free packaging (extra “G”) |
| 1268 |
1268 pins/balls |
| C |
Commercial temperature range (0°C to +85°C) |
This device is available in Pb-free (RoHS-compliant) packaging, indicated by the double “GG” in the package code.
XC2S200-6FGG1268C Key Specifications
The table below summarizes all critical electrical and logic specifications for the XC2S200-6FGG1268C.
| Parameter |
Value |
| Family |
Xilinx Spartan-II |
| Device |
XC2S200 |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM (bits) |
75,264 |
| Block RAM (bits) |
56K |
| Speed Grade |
-6 (fastest) |
| Core Voltage |
2.5V |
| Process Technology |
0.18 µm |
| Max Frequency |
263 MHz |
| Package |
1268-Ball Fine-Pitch BGA (FGG1268) |
| Temperature Range |
Commercial: 0°C to +85°C |
| DLL Count |
4 (one per corner) |
| Configuration Modes |
Master Serial, Slave Serial, Slave Parallel, Boundary Scan |
| RoHS Compliant |
Yes (Pb-free, FGG package) |
XC2S200-6FGG1268C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1268C contains 1,176 CLBs arranged in a 28×42 grid. Each CLB includes four-input Look-Up Tables (LUTs), flip-flops, and fast carry logic. This flexible architecture enables efficient implementation of combinational and sequential logic, arithmetic circuits, and state machines.
Block RAM and Distributed RAM
The device provides two memory resources for on-chip storage:
- Distributed RAM: 75,264 bits, embedded within CLBs using LUT resources
- Block RAM: 56K bits, organized as two columns of dedicated RAM blocks on opposite sides of the die
These resources make the XC2S200-6FGG1268C well-suited for buffering, FIFO design, and lookup table-heavy applications.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide precise clock management. DLLs enable clock deskew, frequency synthesis, and phase shifting, which are critical for high-speed synchronous designs.
Input/Output Blocks (IOBs)
The XC2S200-6FGG1268C supports up to 284 user I/Os plus four dedicated global clock/user input pins. The IOBs support a wide range of I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL, offering broad compatibility with modern digital interfaces.
Spartan-II Family Comparison Table
The XC2S200 is the largest member of the Spartan-II family. The table below shows how it compares to other devices in the series.
| Device |
Logic Cells |
System Gates |
CLB Array |
Total CLBs |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
96 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
216 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
384 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
600 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
864 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
1,176 |
284 |
75,264 bits |
56K |
The XC2S200 delivers the maximum logic density and I/O count available in the Spartan-II generation, making it the top choice for designs that require the full capability of this family.
Configuration Modes
The XC2S200-6FGG1268C supports four configuration modes, providing flexible programming options for different system architectures.
| Configuration Mode |
Pre-Config Pull-ups |
CCLK Direction |
Data Width |
Serial DOUT |
| Master Serial |
No |
Output |
1 |
Yes |
| Slave Parallel |
Yes |
Input |
8 |
No |
| Boundary-Scan |
Yes |
N/A |
1 |
No |
| Slave Serial |
Yes |
Input |
1 |
Yes |
All I/O drivers remain in a high-impedance state during power-on and throughout configuration, ensuring safe system startup behavior.
XC2S200-6FGG1268C Package Information
The FGG1268 package is a 1268-ball Fine-Pitch Ball Grid Array with Pb-free (lead-free) solder balls, indicated by the double “G” suffix in compliance with RoHS directives. This large-footprint BGA package provides maximum I/O pin access for complex, high-density PCB designs.
| Package Detail |
Value |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Pins/Balls |
1,268 |
| Pb-Free |
Yes (FGG = Pb-free BGA) |
| Terminal Form |
Solder Ball |
| Package Shape |
Square |
| RoHS Status |
Compliant |
Key Features and Benefits of the XC2S200-6FGG1268C
#### Speed Grade -6: Maximum Performance
The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the commercial temperature range. Operating up to 263 MHz, it is ideal for performance-critical applications where clock speed and timing margins are decisive factors.
#### Cost-Effective ASIC Alternative
The Spartan-II was specifically designed as a cost-effective, flexible alternative to mask-programmed ASICs. Unlike traditional ASICs, the XC2S200-6FGG1268C eliminates the need for expensive non-recurring engineering (NRE) costs, long development cycles, and the risk of hardware obsolescence — design changes can be made in the field by reprogramming the device.
#### Versatile I/O Standard Support
With support for multiple I/O standards (LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL2, SSTL3), this FPGA integrates easily into mixed-voltage environments and legacy system designs.
#### Hierarchical Routing Architecture
A powerful, multi-level routing hierarchy connects CLBs, IOBs, and block RAM, minimizing routing congestion and improving timing closure even in complex, high-fanout designs.
Typical Applications
The XC2S200-6FGG1268C is deployed across a wide range of industries due to its versatility, logic capacity, and I/O density.
| Application Area |
Use Case Example |
| Telecommunications |
Line card logic, protocol bridging, framing controllers |
| Industrial Automation |
Motor control interfaces, PLC co-processors, sensor fusion |
| Embedded Systems |
Custom processor peripherals, hardware accelerators |
| Consumer Electronics |
Display controllers, signal processing pipelines |
| Test & Measurement |
Data acquisition front-ends, pattern generators |
| Automotive |
Engine control unit (ECU) assist logic, CAN interface expansion |
| Military/Defense |
Signal intelligence, radar processing front-end |
Development Tools and Software Support
Designing with the XC2S200-6FGG1268C requires Xilinx’s legacy ISE Design Suite (the Spartan-II is not supported in Vivado). Key toolchain components include:
- ISE Design Suite – Synthesis, implementation, and bitstream generation
- ChipScope Pro – In-system logic analyzer for real-time debugging
- IMPACT – Programming and configuration tool for JTAG and configuration PROMs
- XPower – Power estimation and analysis
Note: The XC2S200 series is classified as “Not Recommended for New Designs” (NRND) by AMD Xilinx. For new projects requiring similar logic density, consider evaluating newer Spartan families. For legacy system maintenance, repair, or exact replacement sourcing, the XC2S200-6FGG1268C remains a reliable option.
Ordering Information and Part Number Decoder
Understanding the Xilinx Spartan-II part number structure ensures you order the correct variant for your application.
XC2S200 - 6 - FGG - 1268 - C
| | | | |
| | | | └─ Temperature: C = Commercial (0°C ~ +85°C)
| | | | I = Industrial (-40°C ~ +85°C)
| | | └─ Pin Count: 1268 balls
| | └─ Package: FGG = Pb-free Fine-Pitch BGA
| └─ Speed Grade: -6 (fastest, commercial only)
└─ Device: Spartan-II, 200K system gates
For a broader selection of Xilinx programmable logic devices across all Spartan and Artix generations, visit our Xilinx FPGA product catalog.
XC2S200-6FGG1268C vs. Similar Devices
If the XC2S200-6FGG1268C is not available or does not meet your requirements, the following alternatives provide similar logic capacity:
| Part Number |
Gates |
Package |
Speed Grade |
Key Difference |
| XC2S200-6FG456C |
200K |
456-ball FBGA (Pb-free) |
-6 |
Smaller package, fewer accessible I/Os |
| XC2S200-5FGG1268C |
200K |
1268-ball FBGA (Pb-free) |
-5 |
Same package, slower speed grade |
| XC2S200-6PQ208C |
200K |
208-pin PQFP |
-6 |
Through-hole-friendly QFP, fewer I/Os |
| XC2S200E-6FGG1268C |
200K |
1268-ball FBGA |
-6 |
Enhanced Spartan-IIE, extra features |
Frequently Asked Questions (FAQ)
What does the “6” speed grade mean on the XC2S200-6FGG1268C?
The -6 speed grade is the fastest available in the Spartan-II family, supporting a maximum operating frequency of up to 263 MHz. It is only available in the commercial temperature range (0°C to +85°C).
Is the XC2S200-6FGG1268C RoHS compliant?
Yes. The double “G” in “FGG” indicates a Pb-free (lead-free) package, making this part RoHS compliant and suitable for use in environmentally regulated markets.
What is the difference between FG and FGG packages?
“FG” denotes a standard Fine-Pitch BGA with standard (leaded) solder balls. “FGG” (extra “G”) indicates the Pb-free version of the same package — identical in footprint and dimensions, differing only in solder ball composition.
Can the XC2S200-6FGG1268C be used in industrial temperature applications?
No. Speed grade -6 is exclusively available in the Commercial temperature range (0°C to +85°C). For industrial temperature operation (-40°C to +85°C), use the -5 or -4 speed grade variants with the “I” suffix.
What design software should I use for the XC2S200-6FGG1268C?
Use Xilinx ISE Design Suite (Legacy). The Spartan-II family predates Vivado and is not supported in that toolchain. ISE Design Suite is available as a free download from AMD’s website for legacy device support.
What configuration memory is compatible with the XC2S200-6FGG1268C?
Xilinx Platform Flash PROMs (XCF-series) are the standard companion configuration memories. The device can also be configured via JTAG boundary scan or by an external microcontroller in Slave Serial or Slave Parallel mode.
Summary
The XC2S200-6FGG1268C is the flagship device of the Xilinx Spartan-II family — offering 200,000 system gates, 5,292 logic cells, 284 user I/Os, 75K bits of distributed RAM, and 56K bits of block RAM in a 1268-ball, Pb-free Fine-Pitch BGA package. Running at the fastest available -6 speed grade with a commercial temperature rating, it remains a highly capable and widely-sourced FPGA for legacy system maintenance, repair, and specialized design work.
For the full range of Xilinx programmable logic solutions — including current-generation Spartan, Artix, and Kintex devices — explore our complete Xilinx FPGA catalog.