Meta Description: Buy XC2S200-6FGG1265C – Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, -6 speed grade, 1265-pin FGG BGA package. Commercial temperature range. Full specs, pinout, and datasheet guide.

---

What Is the XC2S200-6FGG1265C?

The XC2S200-6FGG1265C is a high-density Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family, manufactured on advanced 0.18μm CMOS technology. This component delivers 200,000 system gates, 5,292 logic cells, and is housed in a 1265-pin Fine-pitch Ball Grid Array (FGG BGA) Pb-free package — making it one of the most capable variants in the Spartan-II lineup.

Designed as a cost-effective, reprogrammable alternative to mask-programmed ASICs, the XC2S200-6FGG1265C is ideal for engineers who need high I/O density, fast clock performance, and flexible logic integration in commercial-grade designs.

Looking for the complete Spartan-II FPGA product family? Explore our Xilinx FPGA selection for pricing and availability.

---

XC2S200-6FGG1265C Part Number Decoder

Understanding the ordering code helps verify you have the right component:

Note: The “G” in “FGG” indicates a Pb-free (RoHS-compliant) package. Standard (non-Pb-free) versions use “FG” without the extra “G”.

---

XC2S200-6FGG1265C Key Specifications

Core Logic Resources

Electrical & Physical Specifications

---

XC2S200-6FGG1265C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 features a 28×42 CLB array containing 1,176 total CLBs. Each CLB comprises two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture delivers substantial combinatorial and sequential logic capacity for complex digital designs.

Input/Output Blocks (IOBs)

The device supports up to 284 user I/O pins, all programmable with multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. Each IOB includes input and output registers, tri-state capability, and programmable pull-up/pull-down resistors.

Block RAM

The XC2S200 includes 56Kbits of dedicated block RAM organized in dual-port modules. Each block RAM can be configured as various depth × width combinations, providing fast on-chip memory without consuming CLB resources.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs), one at each corner of the die, enable clock distribution with zero skew, frequency synthesis, and phase shifting — critical for high-speed synchronous designs.

---

Spartan-II Family Comparison Table

The XC2S200 sits at the top of the Spartan-II family. Here’s how it compares across the lineup:

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, I/O count, and memory resources.

---

XC2S200-6FGG1265C vs. Other XC2S200 Package Variants

Xilinx offers the XC2S200 in multiple package options. The FGG1265 offers the highest pin count for maximum I/O flexibility:

The FGG1265 package provides the same maximum 284 user I/Os as the FG456, but in a larger BGA footprint — offering better board-level signal routing flexibility and potentially improved thermal performance in high-density PCB designs.

---

Speed Grade -6: What Does It Mean?

The -6 speed grade is the fastest available option in the Spartan-II family and is exclusively offered in the Commercial temperature range (0°C to +85°C). It is not available in the Industrial temperature range.

Key timing advantages of the -6 speed grade:

• Higher maximum operating frequency (up to ~263 MHz)
• Lower propagation delays through logic and routing
• Better setup-and-hold timing margins for high-speed interfaces
• Preferred for applications requiring maximum throughput

If your application requires the Industrial range (-40°C to +85°C), consider the -5I or -4I speed grade variants.

---

XC2S200-6FGG1265C Supported I/O Standards

The XC2S200 IOBs are highly configurable and support a wide range of single-ended and differential I/O standards:

---

Typical Applications for XC2S200-6FGG1265C

The XC2S200-6FGG1265C is well-suited for a wide range of commercial-grade embedded applications:

Digital Signal Processing (DSP)

High logic density and fast clock support make the XC2S200 suitable for FIR/IIR filters, FFTs, and real-time signal conditioning circuits.

Communications & Networking

The device handles multi-channel serial/parallel interface logic, FIFO management, and protocol bridging (UART, SPI, I2C, Ethernet framing).

Industrial Automation & Control

Real-time control logic, motor drive sequencing, sensor fusion, and embedded state machines benefit from the flexible CLB architecture.

High-Volume Consumer Electronics

Spartan-II FPGAs were specifically designed for cost-sensitive, high-volume applications where off-the-shelf FPGAs reduce NRE (Non-Recurring Engineering) costs versus custom ASICs.

Embedded Systems & SoC Prototyping

The XC2S200 can serve as a platform for prototyping custom ASIC logic prior to tape-out, validating RTL designs in real hardware environments.

---

FPGA vs. ASIC: Why Choose the XC2S200-6FGG1265C?

For low-to-mid volume production or evolving requirements, the XC2S200 provides a compelling cost-performance tradeoff versus custom silicon.

---

Configuration & Programming

The XC2S200-6FGG1265C supports multiple configuration modes:

• Master Serial – using Xilinx Platform Flash PROMs (XCF series)
• Slave Serial – driven by an external processor or controller
• Master Parallel (SelectMAP) – faster byte-wide parallel loading
• Slave Parallel (SelectMAP) – processor-controlled parallel download
• JTAG (Boundary Scan) – IEEE 1149.1 compliant, for debug and in-system programming

Configuration bitstream files are generated using Xilinx ISE Design Suite (legacy) or can be targeted via Vivado for migration purposes.

---

Design Tools & Software Support

Note: The Spartan-II is a legacy device. Xilinx ISE (last version: 14.7) is the recommended toolchain. Vivado does not support the Spartan-II family.

---

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1265C used for?

The XC2S200-6FGG1265C is used in embedded control, DSP, communications, and prototyping applications that require up to 200,000 system gates of programmable logic in a commercial-grade FPGA with high I/O pin count.

What is the difference between XC2S200-6FG456C and XC2S200-6FGG1265C?

Both support the same 284 maximum user I/O. The primary difference is the package: the FGG1265 is a larger BGA with 1,265 balls, offering greater PCB routing flexibility, while the FG456 has 456 pins in a more compact footprint. The “GG” in FGG also indicates Pb-free packaging.

Is the XC2S200-6FGG1265C RoHS compliant?

Yes. The “G” suffix in the package code (FGG) confirms this is a Pb-free, RoHS-compliant component.

Does the -6 speed grade support industrial temperature?

No. The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). For industrial (-40°C to +85°C) applications, use -5I or -4I variants.

Is the XC2S200 still in production?

The Spartan-II XC2S200 family has been subject to product discontinuation notices (PDN). It is recommended to verify current availability with authorized distributors and consider evaluating next-generation Xilinx FPGA families (Spartan-6, Artix-7) for new designs.

What programming tool do I use with XC2S200-6FGG1265C?

Use Xilinx ISE 14.7 for synthesis and bitstream generation, and iMPACT for JTAG-based device programming. Vivado does not support this device family.

---

Summary: XC2S200-6FGG1265C at a Glance