Meta Description: Buy XC2S200-6FGG1264C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, 1264-ball FGG BGA package, 2.5V, commercial temp. Full specs, features & applications.

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The XC2S200-6FGG1264C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Combining 200,000 system gates, 5,292 logic cells, and a 1,264-ball Fine-Pitch Ball Grid Array (FGG BGA) package, this device delivers the reconfigurability and cost-efficiency that engineers need for complex digital designs. Whether you are developing telecommunications equipment, industrial automation systems, or embedded processing applications, the XC2S200-6FGG1264C provides a robust, proven platform backed by Xilinx’s industry-leading toolchain.

For a broader selection of compatible programmable logic devices, explore our full range of Xilinx FPGA solutions.

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What Is the XC2S200-6FGG1264C? – Overview & Part Number Breakdown

The part number XC2S200-6FGG1264C encodes the device’s complete specification at a glance:

The “G” character in “FGG” denotes RoHS-compliant, lead-free (Pb-free) packaging, distinguishing it from the standard “FG” variant. This makes the XC2S200-6FGG1264C suitable for modern designs that must meet environmental and export regulations.

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XC2S200-6FGG1264C Key Specifications

Core Logic & Memory Resources

I/O & Package Details

Electrical & Timing Characteristics

Configuration Modes

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XC2S200-6FGG1264C Architecture – How It Works

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1264C is its 1,176 Configurable Logic Blocks arranged in a 28 × 42 grid. Each CLB contains:

• Look-Up Tables (LUTs) for implementing arbitrary combinational logic
• Flip-Flops for synchronous storage and pipelining
• Fast carry logic for efficient arithmetic operations
• Multiplexers for flexible signal routing

This architecture enables the implementation of complex state machines, arithmetic units, and custom digital logic in a single reconfigurable chip.

Block RAM Architecture

The XC2S200-6FGG1264C includes 56K bits (57,344 bits) of dedicated Block RAM organized in two columns flanking the CLB core. Block RAM supports:

• True dual-port operation
• Configurable aspect ratios (16K×1 up to 512×36)
• Synchronous read/write for high-speed data buffering
• On-chip FIFO and memory controller implementations

Input/Output Blocks (IOBs) & I/O Standards

With 284 maximum user I/O pins, the XC2S200-6FGG1264C supports a wide range of interface standards, including single-ended and differential I/O. Each IOB includes:

• Programmable input delay
• Optional output slew rate control
• 3-state output enable
• Selectable pull-up or pull-down resistors

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) – one at each corner of the die – provide:

• Zero-delay clock distribution
• Clock frequency multiplication and division
• Phase shifting for precise timing alignment
• Elimination of clock skew across the device

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Spartan-II Family Comparison – Where XC2S200 Fits

The table below places the XC2S200 in context with the full Spartan-II device lineup:

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest gate count, logic cell count, I/O count, and on-chip memory of any Spartan-II part. The FGG1264 package variant provides maximum pin accessibility for designs requiring high I/O density.

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Speed Grade –6: What It Means for Your Design

The -6 speed grade is the fastest speed grade available in the Spartan-II family and is exclusively offered in the Commercial temperature range (0°C to +85°C). Key performance benefits include:

• Lower propagation delays through CLBs and routing resources
• Higher achievable clock frequencies compared to –5 and –4 grade devices
• Tighter setup and hold times for reliable high-speed synchronous designs
• Ideal for applications requiring maximum throughput within the Spartan-II architecture

Note: If your application requires industrial temperature operation (–40°C to +100°C), the –5 or –4 speed grades are available in the XC2S200 family.

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XC2S200-6FGG1264C vs. Similar Part Numbers

Engineers often encounter multiple variants of the XC2S200. The table below clarifies the differences:

The XC2S200-6FGG1264C stands out with its larger 1,264-ball package, which provides more I/O breakout flexibility and improved PCB routing options for high-density board designs.

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Applications of the XC2S200-6FGG1264C FPGA

Telecommunications & Networking

The XC2S200-6FGG1264C excels in telecom applications due to its high-speed serial and parallel I/O support. Common uses include:

• Line card processing and framing logic
• Protocol bridge implementations (SONET, ATM, Ethernet)
• Signal routing and switching fabric control
• Packet inspection and classification engines

Industrial Automation & Motor Control

In industrial environments, this FPGA enables real-time control with deterministic latency:

• Servo and stepper motor control loops
• Field bus interfaces (CAN, Profibus, Modbus)
• PLC replacement and custom I/O expansion
• Sensor fusion and signal conditioning

Embedded Processing & Data Acquisition

With its large on-chip memory and flexible CLB architecture, the XC2S200-6FGG1264C supports:

• Soft-core processor implementations (e.g., PicoBlaze)
• High-speed ADC/DAC interfacing
• DMA controller and bus arbitration logic
• Custom co-processor acceleration

Military, Aerospace & Defense (Legacy Systems)

The Spartan-II family has an extensive installed base in defense and aerospace programs. The XC2S200-6FGG1264C is frequently used for:

• Radar signal processing
• Avionics data bus bridging (MIL-STD-1553, ARINC 429)
• Ruggedized communication equipment
• Legacy system maintenance and board re-spin

Consumer Electronics & Multimedia

• Video signal processing and format conversion
• Display timing controller implementations
• Set-top box and digital TV glue logic
• Image sensor interface and preprocessing

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Programming & Development Tools

Xilinx ISE Design Suite

The XC2S200-6FGG1264C is supported by the Xilinx ISE (Integrated Synthesis Environment) design suite, which provides:

• RTL synthesis (VHDL / Verilog)
• Place-and-route (PAR) implementation
• Timing analysis and constraint management
• FPGA Editor for floorplanning

Note: ISE is the recommended toolchain for all Spartan-II devices. Vivado does not support the Spartan-II family.

Configuration Methods

The device supports multiple configuration interfaces:

Supported HDL Languages

• VHDL (IEEE 1076-1993 and 1076-2000)
• Verilog (IEEE 1364-1995 and 1364-2001)
• Schematic entry via ISE schematic editor

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PCB Design Considerations for the FGG1264 Package

Board Layout Guidelines

The 1,264-ball FGG BGA package requires careful PCB design attention:

• Minimum via diameter: Follow IPC-2221 for 1.0 mm or finer ball pitch BGA escape routing
• Decoupling capacitors: Place 100nF decoupling capacitors as close as possible to each VCCINT and VCCO power pin
• Ground planes: Use a solid ground reference plane directly under the BGA for signal integrity
• Controlled impedance: Route high-speed I/O signals on controlled-impedance traces (typically 50Ω single-ended)

Power Supply Requirements

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Frequently Asked Questions (FAQ)

Is the XC2S200-6FGG1264C still in production?

The Spartan-II family, including the XC2S200, has been noted as “Not Recommended for New Designs” (NRND) by AMD/Xilinx. However, the part remains available through authorized distributors for maintenance, repair, and legacy system support.

What is the difference between FG and FGG packages?

The FGG package includes the “G” suffix indicating Pb-free (RoHS-compliant) solder balls, while the standard FG package uses traditional tin-lead solder. The silicon die and electrical performance are identical.

Can the XC2S200-6FGG1264C be reprogrammed?

Yes. Like all Xilinx FPGAs, the XC2S200-6FGG1264C uses SRAM-based configuration, meaning it can be reprogrammed an unlimited number of times in-system. Configuration is loaded from an external PROM or controller at power-up.

What replaces the XC2S200 in new designs?

For new designs, Xilinx recommends migration to more modern families such as the Spartan-6, Spartan-7, or Artix-7 series, which offer greater logic density, lower power, faster I/O, and support in the Vivado Design Suite.

Is the –6 speed grade available in industrial temperature?

No. The –6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). For industrial temperature (–40°C to +100°C), the maximum available speed grade is –5.

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Why Choose the XC2S200-6FGG1264C for Your Project?

• ✅ Highest gate density in the Spartan-II family (200K gates / 5,292 cells)
• ✅ Fastest speed grade (–6) for maximum design performance
• ✅ Pb-free / RoHS-compliant FGG1264 package
• ✅ 284 user I/O pins for complex multi-bus interface designs
• ✅ 56K bits Block RAM for on-chip data buffering
• ✅ Four DLLs for zero-skew, jitter-reduced clock distribution
• ✅ Proven technology with over two decades of deployed installations
• ✅ Supported by Xilinx ISE with a mature, stable toolchain

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Ordering Information

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All specifications are sourced from the official Xilinx Spartan-II FPGA Family Data Sheet (DS001). Always verify against the current datasheet before finalizing your design.