Meta Description: Buy XC2S200-6FGG1263C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, FGG1263 package. Full specs, applications, and datasheet guide.

The XC2S200-6FGG1263C is a high-capacity Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Combining 200,000 system gates, a -6 speed grade for maximum performance, and a robust 1,263-ball Fine-Pitch BGA package, this component is engineered for demanding digital design applications in telecommunications, industrial automation, embedded computing, and more. As a cost-effective, reconfigurable alternative to ASICs, the XC2S200-6FGG1263C delivers exceptional logic density and I/O flexibility for both prototyping and production environments.

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What Is the XC2S200-6FGG1263C?

The XC2S200-6FGG1263C is the top-density member of the Xilinx Spartan-II FPGA family. The part number breaks down as follows:

This device is manufactured by Xilinx (now AMD) using 0.18 µm process technology and operates on a 2.5V core supply, striking a balance between logic capacity, speed, and power efficiency.

XC2S200-6FGG1263C Key Specifications

Core Logic Resources

Electrical & Timing Specifications

Package Information

XC2S200-6FGG1263C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1263C is built around a 28×42 array of Configurable Logic Blocks. Each CLB contains Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling the implementation of virtually any combinational or sequential digital function. With 1,176 total CLBs and 5,292 logic cells, this device supports substantial design complexity.

Block RAM and Distributed RAM

Embedded Memory Architecture

Block RAM columns are located on opposite sides of the die, providing balanced access across the logic fabric and minimizing routing congestion.

Delay-Locked Loops (DLLs)

Four on-chip DLLs — one at each corner of the die — enable precise clock management, including:

• Clock deskewing and phase adjustment
• Frequency synthesis
• Duty-cycle correction
• Zero-delay buffering for system-level clock distribution

Input/Output Blocks (IOBs)

The 284 maximum user I/O pins support multiple I/O standards, including:

• LVCMOS (1.8V, 2.5V, 3.3V)
• LVTTL
• SSTL (2 and 3)
• GTL / GTL+
• PCI (33 MHz, 3.3V)

Configuration Modes

The XC2S200-6FGG1263C supports four standard Xilinx configuration modes:

All I/O drivers remain in a high-impedance state during power-on and throughout the configuration process. Configuration data can be stored in standard Xilinx serial PROMs or loaded via JTAG for in-system programming.

XC2S200-6FGG1263C vs. Other Spartan-II Devices

The XC2S200 is the largest and highest-capacity device in the Spartan-II family, making it the right choice when maximum logic and I/O resources are required within the Spartan-II generation.

Applications and Use Cases

Telecommunications and Networking

The XC2S200-6FGG1263C is widely used in telecommunications infrastructure for:

• High-speed serial/parallel data conversion
• Protocol bridging (e.g., SPI, UART, I²C, custom protocols)
• Network packet processing and routing logic
• Line card controllers and framing engines

Industrial Automation and Control

With its reliable commercial-grade specifications and high I/O count, this FPGA supports:

• Motor control algorithms
• Real-time process monitoring
• Industrial fieldbus interfaces (e.g., CAN, Modbus)
• Machine vision preprocessing

Embedded Computing and Co-Processing

The large distributed and block RAM resources make the XC2S200-6FGG1263C suitable for:

• Implementing soft-core processors
• Hardware accelerators for DSP algorithms
• Memory controller interfaces
• Custom data pipeline architectures

Medical and Scientific Instrumentation

The device’s reconfigurability and precision timing make it ideal for:

• Diagnostic imaging front-ends
• Patient monitoring signal processing
• Waveform generation and analysis
• High-precision timing and synchronization circuits

Security and Access Control Systems

• Cryptographic algorithm implementation (AES, DES)
• Biometric data processing
• Secure hardware root-of-trust logic
• Access control state machines

Why Choose the XC2S200-6FGG1263C Over an ASIC?

The XC2S200-6FGG1263C eliminates the initial cost, lengthy development cycles, and inherent risk associated with conventional ASIC development. In-field programmability allows design updates and bug fixes without any hardware replacement.

Design Tools and Software Support

The XC2S200-6FGG1263C is supported by the following Xilinx/AMD design tools:

Xilinx ISE Design Suite

The legacy, purpose-built toolchain for Spartan-II and other classic Xilinx FPGAs. ISE provides:

• HDL synthesis (VHDL, Verilog)
• Place-and-route for Spartan-II devices
• Timing analysis and simulation
• iMPACT for device configuration via JTAG

Simulation and Verification

• ModelSim (Mentor Graphics) — industry-standard HDL simulation
• Vivado Simulator — available for some legacy device flows
• ISim — bundled with ISE Design Suite

Note: The XC2S200-6FGG1263C is classified as “Not Recommended for New Designs” (NRND) by AMD Xilinx. For new projects requiring similar logic density, consider migrating to a newer Spartan-6 or Spartan-7 device. However, for maintenance, repair, and legacy system support, the XC2S200-6FGG1263C remains a critical and actively sourced component.

Ordering Information and Part Number Decoder

Spartan-II Part Number Syntax

XC 2S 200 - 6 FG G 1263 C
|  |   |    |  |  |   |   |
|  |   |    |  |  |   |   +-- Temperature: C=Commercial, I=Industrial
|  |   |    |  |  |   +----- Ball count: 1263
|  |   |    |  |  +--------- Pb-free: G = RoHS-compliant package
|  |   |    |  +------------ Package: FG = Fine-Pitch BGA
|  |   |    +--------------- Speed Grade: -6 (fastest, commercial only)
|  |   +-------------------- Density: 200K system gates
|  +------------------------ Family: Spartan-II
+--------------------------- Manufacturer: Xilinx (AMD)

Available Spartan-II XC2S200 Packages

Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1263C?

The -6 speed grade is the fastest available for the Spartan-II XC2S200 device. A higher (less negative) speed grade number indicates faster propagation delays and higher maximum operating frequencies. Importantly, the -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C) and is not offered in the Industrial temperature range.

What is the difference between FGG and FG in the package code?

The extra “G” in FGG designates a Pb-free (lead-free) package, compliant with RoHS environmental regulations. An FG package uses standard tin-lead solder balls, while FGG uses halogen-free, lead-free solder materials. For most modern applications and regulatory compliance, the FGG (Pb-free) variant is strongly preferred.

Is the XC2S200-6FGG1263C still in production?

The XC2S200-6FGG1263C is classified as Not Recommended for New Designs (NRND) by AMD Xilinx. It is no longer in active production but remains available through authorized distributors and component brokers with significant inventory for MRO (Maintenance, Repair, and Operations) and legacy system support.

What configuration memory is compatible with the XC2S200?

Xilinx XCFxxS (Platform Flash) and XC17xxS series serial PROMs are compatible for Master Serial configuration of Spartan-II devices. The XC2S200 requires approximately 1,335,840 configuration bits, so a minimum 2Mbit PROM is typically used.

Can the XC2S200-6FGG1263C be programmed in-circuit?

Yes. Via the JTAG (Boundary-Scan) interface, the XC2S200-6FGG1263C can be programmed and tested in-circuit using Xilinx iMPACT software or any compatible JTAG programmer, without removing the device from the board.

Summary: XC2S200-6FGG1263C at a Glance