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XC2S200-6FGG1260C: Xilinx Spartan-II FPGA – Full Specifications & Buyer’s Guide

Product Details

Meta Description: Buy XC2S200-6FGG1260C — Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, 1260-ball FGG BGA package. Full specs, pinout, applications & datasheet guide.


The XC2S200-6FGG1260C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Combining 200,000 system gates, a -6 commercial speed grade, and a large 1260-ball Fine-Pitch Ball Grid Array (FGG BGA) package, this device delivers exceptional logic capacity and I/O density for demanding embedded and industrial designs. Whether you are sourcing for a legacy system, prototyping a new board, or replacing obsolete silicon, this guide covers everything you need to know about the XC2S200-6FGG1260C.


What Is the XC2S200-6FGG1260C? – Product Overview

The XC2S200-6FGG1260C is part of Xilinx’s Spartan-II FPGA series, a family engineered to provide ASIC-level integration at programmable-logic price points. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II family, 200K system gates
-6 Speed grade (fastest commercial grade in Spartan-II)
FGG Fine-Pitch Ball Grid Array, Pb-free (“G” suffix = RoHS-compliant)
1260 1260-ball package
C Commercial temperature range (0°C to +85°C)

Compared to mask-programmed ASICs, the XC2S200-6FGG1260C eliminates upfront NRE costs, long development cycles, and the risk of committing to a fixed netlist — while in-field reprogrammability allows design revisions without hardware replacement.


XC2S200-6FGG1260C Key Specifications at a Glance

Core Logic Resources

Parameter Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O Pins 284
Distributed RAM 75,264 bits
Block RAM 56K bits (14 × 4K blocks)

Electrical & Physical Characteristics

Parameter Value
Core Supply Voltage 2.5V
I/O Voltage Support 1.5V, 1.8V, 2.5V, 3.3V (LVTTL, LVCMOS, etc.)
Speed Grade -6 (fastest; Commercial temperature only)
Maximum System Frequency 263 MHz
Process Technology 0.18 µm
Package Type FGG BGA (Fine-Pitch Ball Grid Array)
Package Ball Count 1,260
Operating Temperature 0°C to +85°C (Commercial)
RoHS Compliance Yes (Pb-free “G” suffix package)

XC2S200-6FGG1260C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1260C is its array of 1,176 CLBs arranged in a 28-column by 42-row grid. Each CLB contains:

  • Look-Up Tables (LUTs): Four 4-input LUTs per CLB, each configurable as logic or 16-bit distributed RAM
  • Flip-Flops: Storage elements for pipelined and registered designs
  • Multiplexers: Flexible routing for complex logic functions
  • Fast Carry Logic: Dedicated carry chains for efficient arithmetic operations

This architecture enables the implementation of complex finite state machines, DSP pipelines, and custom bus interfaces directly in fabric.

Block RAM

The XC2S200-6FGG1260C includes 56K bits of dedicated block RAM organized as 14 independent dual-port memory blocks of 4K bits each.

Block RAM Feature Detail
Total Capacity 56,320 bits
Number of Blocks 14
Per Block Size 4,096 bits
Port Type True Dual-Port
Max Width Configurable (×1, ×2, ×4, ×8, ×16)

Block RAM is ideal for FIFOs, look-up tables, data buffers, and embedded microcontroller program memory.

Input/Output Blocks (IOBs)

With 284 available user I/O pins, the XC2S200-6FGG1260C in its 1260-ball package offers exceptional connectivity. Each IOB supports programmable input delay for setup time optimization, 3-state output enables, slew rate control, pull-up/pull-down/keeper elements, and multiple single-ended and differential I/O standards.

Supported I/O Standards

I/O Standard Voltage Type
LVTTL 3.3V Single-ended
LVCMOS33 / LVCMOS25 / LVCMOS18 / LVCMOS15 Various Single-ended
PCI / PCI-X 3.3V Single-ended
SSTL2 / SSTL3 2.5V / 3.3V Single-ended
GTL / GTL+ Terminated Single-ended
LVDS 2.5V Differential
LVPECL 3.3V Differential

Delay-Locked Loops (DLLs)

The device integrates four on-chip Delay-Locked Loops, one at each corner of the die. The DLLs provide zero-propagation-delay clock distribution, clock multiplication and division, phase shifting for multi-clock domain designs, and jitter reduction for high-speed interfaces.


Configuration Modes

The XC2S200-6FGG1260C supports four configuration modes, selectable via the M0, M1, M2 mode pins:

Configuration Mode M[2:0] CCLK Direction Data Width Serial DOUT
Master Serial 000 Output 1-bit Yes
Slave Parallel 010 Input 8-bit No
Boundary-Scan (JTAG) 100 N/A 1-bit No
Slave Serial 110 Input 1-bit Yes

The device supports configuration from serial PROMs, parallel flash, microcontrollers, and JTAG boundary-scan controllers — giving designers maximum flexibility in production and field-upgrade scenarios.


Spartan-II Family Comparison: Where Does XC2S200 Fit?

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8 × 12 86 16K
XC2S30 972 30,000 12 × 18 92 24K
XC2S50 1,728 50,000 16 × 24 176 32K
XC2S100 2,700 100,000 20 × 30 176 40K
XC2S150 3,888 150,000 24 × 36 260 48K
XC2S200 5,292 200,000 28 × 42 284 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, making it the top choice for applications that push the logic or I/O limits of smaller members.


XC2S200-6FGG1260C Applications

Industrial Automation & Control

The high logic density and deterministic timing of the XC2S200-6FGG1260C make it well suited for motor control algorithms (FOC, BLDC, stepper), PLC replacement and custom industrial controllers, real-time sensor fusion, and high-speed servo loop closure.

Communications & Networking

With support for high-speed I/O standards and differential signaling, this FPGA excels in protocol bridging (UART, SPI, I²C, custom serial), network packet processing, SONET/SDH framing logic, and data concentrators and multiplexers.

Embedded Processing

The XC2S200-6FGG1260C supports custom soft-processor implementations (e.g., PicoBlaze), DMA controllers, custom bus interfaces (AHB, APB, Wishbone), and memory controllers for SRAM and Flash.

Aerospace & Defense (Legacy System Maintenance)

The Spartan-II family remains widely used in long-lifecycle programs. The XC2S200-6FGG1260C is a reliable source component for avionics display and I/O systems, radar signal processing front-ends, and secure communications hardware.

Medical Devices

The device’s reliability and reconfigurability make it ideal for ultrasound signal acquisition, patient monitoring front-ends, diagnostic imaging data paths, and high-reliability embedded control loops.


Ordering Information & Part Number Guide

Field Value
Full Part Number XC2S200-6FGG1260C
Manufacturer AMD Xilinx
Product Family Spartan-II
Package 1260-Ball FGG BGA (Fine-Pitch, Pb-Free)
Speed Grade -6 (Commercial only)
Temperature Range Commercial (0°C to +85°C)
RoHS Status Compliant (Pb-free “G” suffix)
Lifecycle Status Not Recommended for New Designs (NRND) – available for legacy/MRO

Note on Speed Grade -6: The -6 speed grade is the highest-performance option in the Spartan-II family and is exclusively available in the Commercial temperature range. If your design requires Industrial temperature (-40°C to +100°C), the -5I grade should be evaluated instead.


Design Tools & Software Support

Tool Version / Notes
Xilinx ISE Design Suite Recommended for Spartan-II; ISE 14.7 is the final release
Vivado Not supported for Spartan-II; use ISE only
FPGA Editor Included with ISE for floor-planning
ChipScope Pro On-chip debug/logic analyzer integration
PlanAhead Optional floor-planning within ISE

For engineers working with Xilinx FPGA devices across both legacy and modern product lines, note that the Spartan-II toolchain is anchored to ISE 14.7. New designs should migrate to Vivado-compatible families (Spartan-7, Artix-7, etc.) for long-term tool support.


XC2S200-6FGG1260C vs. Modern Alternatives

Feature XC2S200-6FGG1260C XC7S50 (Spartan-7) XC7A35T (Artix-7)
Logic Cells 5,292 52,160 33,280
Block RAM 56K bits 2,700 Kb 1,800 Kb
DSP Slices 0 4 90
Core Voltage 2.5V 1.0V 1.0V
Max Frequency 263 MHz 450+ MHz 450+ MHz
I/O Standards 2.5V/3.3V max Up to 3.3V Up to 3.3V
Design Tool ISE 14.7 Vivado Vivado
Lifecycle Status NRND Active Active

While the XC2S200-6FGG1260C remains an excellent component for legacy system maintenance, new designs benefit from migrating to an active-status Spartan-7 or Artix-7 device.


Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1260C?

The -6 speed grade indicates the fastest timing bin in the Spartan-II family. It provides the lowest propagation delay and highest maximum operating frequency, and it is exclusively available in the Commercial temperature range (0°C to +85°C).

Is the XC2S200-6FGG1260C RoHS compliant?

Yes. The “G” in the FGG package suffix indicates a Pb-free (lead-free) package, making it RoHS compliant for designs shipped into European and other regulated markets.

Can I program the XC2S200-6FGG1260C with Vivado?

No. The Spartan-II family is supported exclusively by Xilinx ISE Design Suite (up to version 14.7). Vivado does not support this device family.

What is the configuration bitstream size for the XC2S200?

The XC2S200 requires approximately 1,335,840 bits for a full configuration bitstream.

Is the XC2S200-6FGG1260C still in production?

Xilinx classifies the Spartan-II family as Not Recommended for New Designs (NRND). The part remains available through authorized distributors and MRO (Maintenance, Repair & Overhaul) channels for legacy system support.


Summary

The XC2S200-6FGG1260C delivers the full capability of the Spartan-II top-of-family device in a high-I/O-count, Pb-free 1260-ball BGA package. With 5,292 logic cells, 284 user I/O pins, 56K bits of block RAM, four on-chip DLLs, and the fastest available -6 speed grade, it remains a reliable choice for sustaining legacy designs in industrial, communications, aerospace, and medical applications. Engineers planning new designs should evaluate migration to Spartan-7 or Artix-7 devices for continued tool support and access to modern features such as DSP slices, GTP transceivers, and PCIe hard blocks.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.