Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1258C: Xilinx Spartan-II FPGA – Full Specifications & Buyer’s Guide

Product Details

Meta Description: Buy XC2S200-6FGG1258C – Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, 2.5V, 1258-pin FBGA package, speed grade -6. Full specs, pinout, and datasheet guide.


The XC2S200-6FGG1258C is a high-performance field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates with the flexibility and reprogrammability that no mask-programmed ASIC can match. Whether you are maintaining legacy embedded systems, designing industrial control boards, or sourcing replacement components, this guide covers everything you need to know about the XC2S200-6FGG1258C.


What Is the XC2S200-6FGG1258C? – Part Number Decoded

Before diving into specifications, understanding the part number helps identify exactly what you are ordering:

Part Number Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gates
-6 Speed grade -6 (fastest available; Commercial range only)
FGG Fine-pitch Ball Grid Array (BGA), Pb-free (Green “G”) package
1258 1,258 pins / balls
C Commercial temperature range (0°C to +85°C)

Key Takeaway: The double “GG” in FGG indicates a Pb-free / RoHS-compliant package, distinguishing it from the standard FG variant.


XC2S200-6FGG1258C Core Specifications

Logic & Memory Resources

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Max User I/O Pins 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K (56,000)
Delay-Locked Loops (DLLs) 4

Electrical & Timing Specifications

Parameter Value
Core Supply Voltage 2.5V
Technology Node 0.18 µm
Max System Clock 263 MHz
Speed Grade -6 (Commercial, fastest)
Operating Temperature 0°C to +85°C (Commercial)
I/O Standards Supported LVTTL, LVCMOS2, PCI, GTL, SSTL, HSTL, CTT, AGP

Package Information

Parameter Value
Package Type Fine-pitch BGA (FBGA)
Package Designation FGG1258
Total Pins 1,258
Lead Finish Pb-free (RoHS-compliant)
Mounting Type Surface Mount

XC2S200-6FGG1258C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 features a regular grid of 1,176 CLBs arranged in a 28×42 array. Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs), two flip-flops, carry logic, and multiplexers. This architecture allows designers to implement complex combinatorial and sequential logic with maximum efficiency.

Input/Output Blocks (IOBs)

With up to 284 user I/O pins, the XC2S200-6FGG1258C supports a wide range of single-ended and differential I/O standards. Every IOB includes programmable input delays, optional output registers, and 3-state controls, enabling glitch-free interfacing to external memory, processors, and communication buses.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one at each corner of the die — provide clock distribution with zero skew, frequency synthesis, and phase shifting. This makes the XC2S200-6FGG1258C an excellent choice for designs requiring precise, multi-domain clock management.

Block RAM

The device integrates 56Kbits of block RAM organized in two columns on opposite sides of the die. Each block RAM is a true dual-port memory, configurable from 16K×1 down to 512×32, supporting both synchronous read and write operations.


Configuration Modes

The XC2S200-6FGG1258C supports multiple configuration modes, giving designers flexibility in how the FPGA is programmed at power-up:

Configuration Mode CCLK Direction Data Width Serial DOUT
Master Serial Output 1-bit Yes
Slave Serial Input 1-bit Yes
Slave Parallel (SelectMAP) Input 8-bit No
Boundary-Scan (JTAG) N/A 1-bit No

Note: During power-on and throughout configuration, all I/O drivers remain in a high-impedance state to prevent bus contention.


Ordering Information & Part Number Variants

The XC2S200 die is available across multiple package and speed grade combinations. The table below shows how the XC2S200-6FGG1258C compares with sibling variants:

Part Number Package Pins Speed Grade Pb-Free Temp Range
XC2S200-6FGG1258C FBGA 1,258 -6 Yes Commercial
XC2S200-6FG456C FBGA 456 -6 No Commercial
XC2S200-6FGG456C FBGA 456 -6 Yes Commercial
XC2S200-6PQ208C PQFP 208 -6 No Commercial
XC2S200-5FG256C FBGA 256 -5 No Commercial
XC2S200-5FG256I FBGA 256 -5 No Industrial

Speed Grade Note: The -6 speed grade is exclusively available in the Commercial temperature range. For industrial temperature (-40°C to +85°C) applications, consider the -5I variant.


XC2S200-6FGG1258C vs. Spartan-II Family Comparison

How does the XC2S200 stack up against other members of the Spartan-II family?

Device Logic Cells System Gates CLB Array Max I/O Block RAM
XC2S15 432 15,000 8×12 86 16K
XC2S30 972 30,000 12×18 92 24K
XC2S50 1,728 50,000 16×24 176 32K
XC2S100 2,700 100,000 20×30 176 40K
XC2S150 3,888 150,000 24×36 260 48K
XC2S200 5,292 200,000 28×42 284 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the maximum logic density, I/O count, and memory resources available within the Spartan-II product line.


Key Features & Benefits

#### Why Choose the XC2S200-6FGG1258C?

  • Highest Spartan-II Logic Density – 200,000 system gates and 5,292 logic cells give ample headroom for complex designs.
  • Fast -6 Speed Grade – Supports system clocks up to 263 MHz, suitable for high-throughput data-path applications.
  • 1,258-Pin FBGA Package – The large FGG1258 package exposes all 284 user I/O signals plus power, ground, and configuration pins in a compact footprint.
  • Pb-Free (RoHS-Compliant) – The “G” designator confirms compliance with RoHS and WEEE directives, simplifying global distribution.
  • Four DLLs for Clock Management – On-chip clock conditioning eliminates external oscillator circuits.
  • Versatile I/O Standards – Supports PCI 3.3V, GTL+, SSTL-2, SSTL-3, HSTL, and more for multi-standard bus interfacing.
  • JTAG Boundary Scan – Full IEEE 1149.1 support for board-level testing and in-system programming.
  • ASIC Alternative – Eliminates NRE (Non-Recurring Engineering) costs, long lead times, and the risk inherent in mask-programmed ASICs.

Typical Applications of the XC2S200-6FGG1258C

The XC2S200-6FGG1258C is well-suited for a broad range of embedded and industrial applications:

Application Category Use Case Examples
Industrial Control Motor controllers, PLCs, machine vision
Communications Protocol bridging, line-card FPGAs, data framing
Computing Peripherals Printers, storage controllers, interface logic
Test & Measurement Signal generation, data acquisition, logic analysis
Consumer Electronics Set-top box control, display timing controllers
Military / Aerospace Legacy system repair and sustainment (COTS replacement)
Embedded Processing Co-processing, custom peripherals alongside CPUs

Development Tools for XC2S200-6FGG1258C

Since the Spartan-II family is a legacy product line, development and programming support is provided through Xilinx’s older toolchain:

#### Supported Design Software

  • Xilinx ISE Design Suite – The primary development environment for Spartan-II devices. ISE 14.7 is the final version and remains freely downloadable from AMD/Xilinx.
  • VHDL / Verilog HDL – Both hardware description languages are fully supported.
  • CORE Generator – For instantiating pre-built IP cores (memory controllers, FIFOs, arithmetic blocks).
  • ChipScope Pro – In-system logic analysis for debugging live FPGA designs.

Note: Vivado Design Suite does not support Spartan-II devices. Use ISE 14.7 for all XC2S200 development.

#### Configuration PROMs

The XC2S200-6FGG1258C can be configured from Xilinx Platform Flash PROMs (XCFxxS/XCFxxP series) using Master Serial mode, making non-volatile storage and power-up auto-configuration straightforward.


Where to Buy XC2S200-6FGG1258C

As a mature, legacy component, the XC2S200-6FGG1258C is available through:

  • Authorized Distributors – Check stock at major distributors for genuine Xilinx parts.
  • Independent Distributors (Brokers) – For end-of-life or hard-to-find inventory, reputable component brokers often carry this part.
  • FPGA Component Specialists – Companies specializing in Xilinx FPGA products often maintain legacy Spartan-II inventory for board repair and re-spins.

Counterfeit Warning: Always purchase from traceable sources. Request certificates of conformance (CoC) and lot traceability documentation when sourcing mature Xilinx components. Verify date codes and markings against genuine Xilinx specifications.


Frequently Asked Questions (FAQ)

#### Is the XC2S200-6FGG1258C still in production?

The Xilinx Spartan-II family has reached end-of-life status. New design starts are not recommended. However, significant inventory exists in the secondary market for legacy board repair, system maintenance, and production continuity.

#### What is the difference between XC2S200-6FGG1258C and XC2S200-6FG456C?

Both share the same XC2S200 die and -6 speed grade, but differ in package and I/O exposure. The FGG1258 has 1,258 balls and exposes a larger pin field, while the FG456 is a smaller 456-ball BGA. Functionally, both provide the same 284 user I/O signals; the additional balls in FGG1258 are used for power and ground distribution across a larger PCB footprint.

#### Can I use Vivado to program the XC2S200-6FGG1258C?

No. Vivado does not support Spartan-II devices. You must use Xilinx ISE Design Suite 14.7, which is the last version to support the Spartan-II family.

#### What is the core supply voltage for XC2S200?

The XC2S200 requires a 2.5V core supply (VCCINT). The I/O supply (VCCO) can vary by bank to support 2.5V and 3.3V I/O standards.

#### Is the XC2S200-6FGG1258C RoHS compliant?

Yes. The “G” characters in the FGG package designation confirm that this part uses Pb-free solder balls, making it RoHS and WEEE compliant.


Summary Specifications Table

Specification Value
Manufacturer Xilinx (now AMD)
Part Number XC2S200-6FGG1258C
Product Family Spartan-II
System Gates 200,000
Logic Cells 5,292
Max User I/O 284
Block RAM 56Kbits
Distributed RAM 75,264 bits
DLLs 4
Max Clock Frequency 263 MHz
Speed Grade -6 (fastest)
Core Voltage 2.5V
Package 1258-ball FBGA (FGG1258)
Pb-Free Yes (RoHS compliant)
Temperature Range Commercial (0°C to +85°C)
Process Technology 0.18 µm
Configuration Interface JTAG, Master/Slave Serial, SelectMAP
Design Tool Xilinx ISE 14.7

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.