The XC2S200-6FGG1257C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this 2.5V FPGA delivers 200,000 system gates, 5,292 logic cells, and a fine-pitch BGA package — making it a powerful and flexible solution for digital design engineers across telecommunications, industrial automation, automotive, and aerospace sectors.
Whether you are sourcing a replacement component, evaluating Spartan-II devices for a new design, or looking for a detailed technical breakdown, this guide covers everything you need to know about the XC2S200-6FGG1257C.
What Is the XC2S200-6FGG1257C?
The XC2S200-6FGG1257C is a member of the Xilinx Spartan-II FPGA family, manufactured on a 0.18µm CMOS process technology. It operates at a core voltage of 2.5V and is packaged in a Fine-Pitch Ball Grid Array (FBGA) format. The “-6” suffix denotes its speed grade, which is the fastest available in the Spartan-II lineup and is exclusively offered in the commercial temperature range.
For engineers seeking a broader selection of Spartan-II and other programmable logic devices, explore the full range of Xilinx FPGA products available for procurement.
XC2S200-6FGG1257C: Part Number Breakdown
Understanding the part number helps engineers quickly identify the exact variant needed for procurement or design replacement.
| Code Segment |
Meaning |
| XC |
Xilinx product line |
| 2S200 |
Spartan-II series, 200K system gates |
| -6 |
Speed grade (fastest in Spartan-II; commercial range only) |
| FGG |
Fine-pitch Ball Grid Array (Pb-free / RoHS package variant) |
| 1257 |
Package pin/ball count reference |
| C |
Commercial temperature range (0°C to +85°C) |
XC2S200-6FGG1257C Key Specifications
Core Logic Resources
| Parameter |
XC2S200 Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM (bits) |
75,264 |
| Block RAM (bits) |
56K (56,000 bits) |
Electrical & Physical Characteristics
| Parameter |
Value |
| Core Voltage (VCC) |
2.5V |
| I/O Voltage |
2.5V (with multi-voltage I/O support) |
| Process Technology |
0.18µm CMOS |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Temperature Range |
Commercial: 0°C to +85°C |
| Speed Grade |
-6 (fastest; commercial only) |
| Clock Speed (max) |
263 MHz |
On-Chip Memory Summary
| Memory Type |
XC2S200 Capacity |
| Total Distributed RAM |
75,264 bits |
| Total Block RAM |
56,000 bits (56K) |
| Block RAM Columns |
2 (one on each side of CLB array) |
| Configuration Bits |
1,335,840 |
XC2S200-6FGG1257C Architecture Overview
H3: Configurable Logic Blocks (CLBs)
The heart of the XC2S200-6FGG1257C is its array of 1,176 Configurable Logic Blocks (CLBs). Each CLB contains Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling flexible implementation of both combinational and sequential digital logic. The 28×42 CLB grid provides substantial capacity for complex algorithms and state machines.
H3: Input/Output Blocks (IOBs)
The device features 284 programmable I/O pins surrounding the CLB core. Each IOB supports:
- Programmable slew rate control
- Optional pull-up and pull-down resistors
- Input delay elements for timing margin
- Multiple I/O standards including LVTTL, LVCMOS, and PCI compatibility
H3: Block RAM
Two columns of block RAM are located on either side of the CLB array, providing 56K bits of dedicated high-speed memory. Block RAM is ideal for FIFOs, data buffers, look-up tables, and embedded storage requirements.
H3: Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) — positioned one at each corner of the die — provide clock management functions including:
- Clock deskewing
- Frequency multiplication and division
- Phase shifting
- Duty cycle correction
H3: Routing Architecture
The CLBs, IOBs, block RAM, and DLLs are interconnected via a hierarchical routing fabric, offering versatile signal routing with minimal propagation delay. This architecture supports both local (short) and global routing resources, which is critical for achieving the -6 speed grade’s 263 MHz clock performance.
Configuration Modes
The XC2S200-6FGG1257C supports multiple configuration modes, giving designers flexibility in how the device is programmed at startup.
| Configuration Mode |
Pre-config Pull-ups |
CCLK Direction |
Data Width |
DOUT |
| Master Serial |
No |
Output |
1-bit |
Yes |
| Slave Serial |
Yes |
Input |
1-bit |
Yes |
| Slave Parallel |
Yes |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
Yes |
N/A |
1-bit |
No |
Note: During power-on and throughout configuration, all I/O drivers remain in a high-impedance state. Unused I/Os remain high-impedance after configuration unless explicitly assigned.
XC2S200-6FGG1257C vs. Other Spartan-II Family Members
To help engineers select the right device, the table below compares the XC2S200 against smaller Spartan-II members.
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Dist. RAM (bits) |
Block RAM (bits) |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 |
56K |
The XC2S200 is the largest device in the Spartan-II family, offering the most logic cells, the highest I/O count, and the greatest memory resources.
Applications for the XC2S200-6FGG1257C
The XC2S200-6FGG1257C’s combination of high gate count, embedded memory, clock management, and flexible I/O makes it suited for a wide range of applications:
H3: Communications & Networking
Used to implement protocol processing engines, network routers, high-speed serial interfaces, and line cards in telecom infrastructure equipment.
H3: Industrial Automation & Control
Supports motor control, PLC logic replacement, process monitoring, and real-time control systems requiring deterministic timing.
H3: Automotive Electronics
Suitable for body control modules, sensor fusion applications, and vehicle bus interface controllers operating within commercial temperature ranges.
H3: Medical & Diagnostic Equipment
Powers imaging systems, signal acquisition front ends, patient monitoring devices, and FDA-regulated diagnostic equipment where reprogrammability provides lifecycle flexibility.
H3: Aerospace & Defense (Commercial Grade)
Used in non-extreme-environment avionic systems and defense electronics where the commercial temperature range is sufficient and FPGA reconfigurability provides a system upgrade path.
H3: Consumer Electronics
Deployed in high-volume consumer products such as set-top boxes, digital video processors, and multimedia interfaces where the Spartan-II’s cost-efficiency is a key advantage.
Why Choose the XC2S200-6FGG1257C Over a Custom ASIC?
The Spartan-II FPGA family was explicitly positioned as a superior alternative to mask-programmed ASICs for cost-sensitive applications. Key advantages include:
| Factor |
ASIC |
XC2S200-6FGG1257C FPGA |
| NRE (Non-Recurring Engineering) Cost |
Very High ($100K–$5M+) |
None |
| Development Cycle |
6–18 months |
Weeks |
| Design Risk |
High (one-time mask) |
Low (fully reprogrammable) |
| Field Upgradeability |
Impossible |
Full in-field reprogramming |
| Volume Break-Even |
Very High |
Low |
| Time-to-Market |
Slow |
Fast |
For prototyping, short-run production, or applications requiring field updates, the XC2S200-6FGG1257C delivers ASIC-like performance with none of the upfront financial risk.
Ordering Information & Package Options
The XC2S200 is available in several package configurations. The FGG suffix in the part number denotes the Pb-free (RoHS-compliant) Fine-Pitch BGA packaging variant. Standard (non-Pb-free) packages use the “FG” designation without the additional “G.”
| Package Code |
Description |
Pb-Free |
| FG256 |
256-ball Fine-Pitch BGA |
No |
| FGG256 |
256-ball Fine-Pitch BGA |
Yes |
| FG456 |
456-ball Fine-Pitch BGA |
No |
| FGG456 |
456-ball Fine-Pitch BGA |
Yes |
| PQ208 |
208-pin PQFP |
No |
| PQG208 |
208-pin PQFP |
Yes |
Note: The -6 speed grade is exclusively available in the Commercial temperature range (C suffix). Industrial-temperature variants use the -5 speed grade.
Development Tools & Design Software
The XC2S200-6FGG1257C is supported by Xilinx (now AMD) design tools:
- ISE Design Suite — Legacy toolchain fully supporting Spartan-II devices; the recommended environment for new XC2S200 designs
- ChipScope Pro — In-system logic analysis for debugging
- CORE Generator — Parameterized IP core generation (FIFOs, multipliers, DCM modules)
- IMPACT — Configuration download and device programming utility
Note: The newer Vivado Design Suite does not support Spartan-II devices. ISE 14.7 remains the correct toolchain for this family.
Frequently Asked Questions (FAQ)
H4: What does the “-6” speed grade mean on the XC2S200-6FGG1257C?
The -6 speed grade is the fastest available in the Spartan-II family, supporting system clock speeds up to 263 MHz. It is only offered in the commercial temperature range (0°C to +85°C). Devices requiring industrial temperature support should use the -5 speed grade.
H4: Is the XC2S200-6FGG1257C still in production?
The Spartan-II family has reached end-of-life status. However, the XC2S200 remains widely available through authorized component distributors and excess inventory channels. Always purchase from reputable, authorized sources to avoid counterfeit components.
H4: What is the difference between FG and FGG packages?
The FGG package designation indicates a Pb-free (RoHS-compliant) version of the Fine-Pitch BGA. The standard FG package uses traditional tin-lead solder balls. Both are functionally and pin-to-pin compatible.
H4: Can the XC2S200-6FGG1257C be reprogrammed in the field?
Yes. All Spartan-II FPGAs are fully reprogrammable in-system. Configuration can be updated via Master Serial, Slave Serial, Slave Parallel, or JTAG boundary-scan modes without any hardware replacement.
H4: What tools do I need to program the XC2S200-6FGG1257C?
You will need Xilinx ISE Design Suite (version 14.7 is the final release), a compatible JTAG cable (such as the Xilinx Platform Cable USB), and the IMPACT programming utility included with ISE.
Summary
The XC2S200-6FGG1257C is the largest, fastest, and most capable device in the Xilinx Spartan-II FPGA family. With 200,000 system gates, 5,292 logic cells, 284 I/O pins, 56K bits of block RAM, four DLLs, and a 263 MHz maximum clock speed, it delivers robust programmable logic performance in a compact fine-pitch BGA package. Its zero NRE cost, full reprogrammability, and proven 0.18µm silicon reliability make it an enduring choice for engineers maintaining, repairing, or designing with legacy Spartan-II-based systems.
