Meta Description: Buy XC2S200-6FGG1253C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, speed grade -6, 1,053-ball FGG package. Full specs, pinout, applications, and datasheet guide.

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The XC2S200-6FGG1253C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. Designed for engineers and system integrators requiring robust, reconfigurable logic in commercial-grade applications, this device combines 200,000 system gates, 5,292 configurable logic cells, and a large Fine-Pitch Ball Grid Array (FGG) package. Whether you are designing for communications, industrial automation, or embedded processing, the XC2S200-6FGG1253C delivers proven reliability at 2.5V operation.

For a broader selection of compatible devices and alternatives, visit Xilinx FPGA at PCBSync.

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What Is the XC2S200-6FGG1253C?

The XC2S200-6FGG1253C is part of Xilinx’s Spartan-II FPGA family, one of the most widely deployed low-cost, high-density FPGA product lines. The part number breaks down as follows:

This device is a superior alternative to mask-programmed ASICs, eliminating high NRE (non-recurring engineering) costs, long development cycles, and the inherent inflexibility of traditional ASICs. Its in-field programmability allows design upgrades without hardware replacement.

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XC2S200-6FGG1253C Key Specifications

Core Logic Resources

Electrical & Package Characteristics

Memory Architecture

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XC2S200-6FGG1253C Architecture Overview

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1253C is its 28×42 array of Configurable Logic Blocks (CLBs). Each CLB contains Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling implementation of virtually any combinational or sequential digital logic function. With 1,176 total CLBs delivering 5,292 equivalent logic cells, the device handles complex pipelined and parallel processing designs efficiently.

Input/Output Blocks (IOBs)

Up to 284 user I/O pins are available, organized in flexible Input/Output Blocks (IOBs). These support a wide range of I/O standards including LVTTL, LVCMOS, GTL, and SSTL. This multi-standard I/O capability makes the XC2S200-6FGG1253C compatible with a broad ecosystem of processors, memories, and interface chips.

Block RAM

The XC2S200-6FGG1253C integrates 56K bits of dedicated Block RAM arranged in two columns on opposite sides of the die. These high-speed memory blocks are ideal for FIFOs, data buffering, lookup tables, and temporary data storage within digital designs.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs), one at each corner of the die, provide clock distribution, deskewing, and multiplication. These are essential for high-speed synchronous designs requiring precise timing control.

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Spartan-II Family Comparison Table

The table below positions the XC2S200 within the full Spartan-II product family to help engineers choose the right density level.

The XC2S200 is the highest-density device in the Spartan-II family, making the XC2S200-6FGG1253C the top choice when maximum logic resources are required within this product line.

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Speed Grade -6: What It Means

The -6 speed grade is the fastest available within the Spartan-II Commercial temperature range. Key timing implications include:

Note: The -6 speed grade is exclusively available in the Commercial temperature range. For industrial temperature range (-40°C to +85°C) applications, the -5I or -4I speed grades should be considered.

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FGG1253 Package Details

The FGG1253 package is a Fine-Pitch Ball Grid Array with 1,253 solder balls, designed for high pin-count applications requiring substantial I/O routing in a compact PCB footprint. The “G” suffix in FGG denotes the Pb-free (RoHS-compliant lead-free) packaging option, important for compliance with modern environmental regulations including the EU RoHS directive.

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Applications of the XC2S200-6FGG1253C

Communications & Networking

The XC2S200-6FGG1253C handles high-speed data processing and complex signal manipulation, making it well-suited for communication protocol implementation, network routers, switching fabrics, and data transmission equipment. Its 284 user I/O pins and high clock speed support multi-channel serial and parallel communication interfaces.

Industrial Automation & Control

In industrial environments, the device facilitates motor control, process control, and other automated operations that demand precise digital logic. The reconfigurability of FPGA technology means production equipment can be updated in the field without replacing hardware — a significant advantage in long-lifecycle industrial deployments.

Embedded Processing & DSP

The combination of distributed RAM (75,264 bits) and block RAM (56K bits) enables efficient implementation of signal processing pipelines, embedded soft processors, and hardware accelerators for computationally intensive algorithms.

Medical & Scientific Instrumentation

The XC2S200-6FGG1253C supports applications including imaging systems, diagnostic equipment, and patient monitoring devices. Its reconfigurability is especially valuable in medical product development where regulatory submissions may require design revisions.

Security & Access Control

High-throughput data integrity applications — including surveillance systems, biometric identification, and secure access controls — benefit from the device’s parallel processing capability and large I/O count.

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XC2S200-6FGG1253C vs. Other XC2S200 Variants

The XC2S200 silicon die is available across multiple packages. The table below helps identify the right variant for your board design.

The XC2S200-6FGG1253C’s 1,253-ball package offers the highest pin count option, maximizing routing flexibility for complex multi-bus designs.

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Design Tools & Programming

Supported Design Software

The XC2S200-6FGG1253C is supported by Xilinx (now AMD) design tools. While Xilinx’s modern Vivado Design Suite is the current flagship tool, the Spartan-II family is primarily supported through the legacy ISE Design Suite, which remains available for download.

Configuration Modes

The Spartan-II supports multiple configuration modes, including Master Serial, Slave Serial, Slave Parallel, and JTAG, providing flexibility for board-level integration with Xilinx PROMs or external configuration controllers.

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1253C used for?

The XC2S200-6FGG1253C is used in applications requiring reconfigurable digital logic, including communications, industrial automation, embedded processing, and instrumentation. Its large I/O count and 200K gate capacity make it ideal for complex, multi-interface digital systems.

What is the difference between XC2S200-6FGG1253C and XC2S200-6FG256C?

Both devices use the same XC2S200 silicon (same logic resources), but differ in package. The FGG1253C has 1,253 balls (Pb-free), offering far more I/O routing options. The FG256C is a smaller 256-ball package suited to space-constrained designs with fewer I/O requirements.

Is the XC2S200-6FGG1253C RoHS compliant?

Yes. The “G” in the FGG package designation indicates Pb-free (lead-free) packaging, meeting RoHS compliance requirements.

What temperature range does the XC2S200-6FGG1253C support?

The “C” suffix designates the Commercial temperature range: 0°C to +85°C. This device is not rated for industrial or extended temperature operation.

What design software do I need for the XC2S200-6FGG1253C?

Use Xilinx ISE Design Suite for Spartan-II device support. Vivado does not support this device family. ISE provides synthesis, place-and-route, and bitstream generation for the XC2S200.

Is the XC2S200-6FGG1253C recommended for new designs?

Xilinx classifies the Spartan-II family as Not Recommended for New Designs (NRND). For new projects, Xilinx/AMD recommends migrating to newer families such as Spartan-7 or Artix-7. However, the XC2S200-6FGG1253C remains widely available for legacy system support, repair, and production continuity.

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Summary: XC2S200-6FGG1253C at a Glance

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For procurement, datasheets, and alternative Xilinx FPGA options, visit Xilinx FPGA at PCBSync.