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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
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Notes:
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XC2S200-6FGG1249C: Xilinx Spartan-II FPGA – Full Specifications & Buyer’s Guide

Product Details

Meta Description: Buy XC2S200-6FGG1249C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, 1249-pin FGG BGA package. Full specs, pinout, and applications guide.


What Is the XC2S200-6FGG1249C?

The XC2S200-6FGG1249C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family, operating on a 2.5V supply. It is built on Xilinx’s proven 0.18 µm process technology and delivers 200,000 system gates with 5,292 logic cells, making it one of the most capable devices in the Spartan-II lineup.

The part number breaks down as follows:

Code Segment Meaning
XC2S200 Spartan-II device, 200K system gates
-6 Speed grade (-6 is the fastest commercial grade)
FGG Fine-Pitch Ball Grid Array (FBGA), Pb-Free package
1249 1,249-pin package
C Commercial temperature range (0°C to +85°C)

Whether you’re sourcing this component for legacy board repair, high-volume embedded applications, or cost-sensitive prototyping, this guide covers everything you need to know about the XC2S200-6FGG1249C — from core architecture to ordering and alternatives.


XC2S200-6FGG1249C Key Specifications at a Glance

Core Logic & Memory Specifications

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Total Distributed RAM 75,264 bits
Total Block RAM 56K bits
Delay-Locked Loops (DLLs) 4

Electrical & Packaging Specifications

Parameter Value
Core Supply Voltage 2.5V
I/O Supply Voltage 2.5V / 3.3V (LVCMOS, LVTTL)
Process Technology 0.18 µm
Maximum System Frequency 263 MHz
Package Type FGG (Fine-Pitch BGA, Pb-Free)
Pin Count 1,249
Temperature Range Commercial: 0°C to +85°C
Speed Grade -6 (fastest commercial)
RoHS Compliance Pb-Free (denoted by “G” in FGG)

Note: The -6 speed grade is exclusively available in the Commercial temperature range. Industrial temperature range devices use the -5 or -4 speed grades.


XC2S200-6FGG1249C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1249C uses a 28 × 42 array of Configurable Logic Blocks, totaling 1,176 CLBs. Each CLB contains four logic cells, enabling complex combinational and sequential logic functions. The CLB architecture supports:

  • 4-input Look-Up Tables (LUTs) for flexible logic implementation
  • Flip-flops for registered outputs
  • Fast carry logic for arithmetic-intensive designs
  • Wide function multiplexers

Input/Output Blocks (IOBs)

With 284 maximum user I/O pins, the XC2S200-6FGG1249C supports a wide range of I/O standards including LVCMOS, LVTTL, SSTL, and more. Each IOB features:

  • Programmable input delay to meet setup/hold requirements
  • Slew rate control for signal integrity
  • Individual pull-up and pull-down resistors
  • Open-drain output support

Block RAM

The device includes 56K bits of dedicated Block RAM organized in two columns on opposite sides of the die. Block RAM can be configured as:

Block RAM Mode Configuration Options
Single-Port RAM Up to 4K × 1, 2K × 2, 1K × 4, 512 × 8
Dual-Port RAM Simultaneous read/write from two ports
ROM Pre-initialized look-up tables
FIFO With optional FIFO logic

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops — one at each corner of the die — provide advanced clock management:

  • Zero-skew global clock distribution
  • Clock frequency synthesis (multiply/divide)
  • Phase shifting for timing margin optimization
  • Input jitter filtering

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The table below shows the XC2S200 in context with its Spartan-II siblings, helping engineers select the right device density for their design.

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8 × 12 86 16K
XC2S30 972 30,000 12 × 18 92 24K
XC2S50 1,728 50,000 16 × 24 176 32K
XC2S100 2,700 100,000 20 × 30 176 40K
XC2S150 3,888 150,000 24 × 36 260 48K
XC2S200 5,292 200,000 28 × 42 284 56K

The XC2S200 is the largest and highest-density device in the Spartan-II family, making the XC2S200-6FGG1249C the go-to choice when maximum logic resources are required within the Spartan-II portfolio.


Understanding the XC2S200-6FGG1249C Part Number

Xilinx uses a structured ordering code to encode device characteristics. Here’s a full breakdown for the XC2S200-6FGG1249C:

Ordering Code Breakdown

XC  2  S  200  -  6  FGG  1249  C
│   │  │   │   │  │   │    │    └─ Temperature: C = Commercial (0°C to +85°C)
│   │  │   │   │  │   │    └────── Pin Count: 1249 pins
│   │  │   │   │  │   └─────────── Package: FGG = Fine-Pitch BGA, Pb-Free
│   │  │   │   │  └─────────────── Speed Grade: -6 (fastest)
│   │  │   │   └────────────────── Separator
│   │  │   └────────────────────── Gates: 200K system gates
│   │  └────────────────────────── Family: S = Spartan
│   └───────────────────────────── Generation: 2 = Spartan-II
└───────────────────────────────── Manufacturer: XC = Xilinx/AMD

Package Variant Comparison for XC2S200

Part Number Package Pins Pb-Free Temp Range
XC2S200-6PQ208C PQFP 208 No Commercial
XC2S200-6FG256C FBGA 256 No Commercial
XC2S200-6FGG456C FBGA 456 Yes Commercial
XC2S200-6FGG1249C FBGA 1249 Yes Commercial

XC2S200-6FGG1249C Typical Applications

The XC2S200-6FGG1249C excels in applications that demand high I/O density combined with substantial programmable logic. Common use cases include:

Industrial & Embedded Control

  • Motor drive controllers requiring many PWM channels
  • Industrial Ethernet interfaces (MAC layer implementation)
  • PLC I/O expansion modules
  • Real-time sensor fusion systems

 Communications & Networking

  • Protocol bridging (UART, SPI, I²C, parallel bus)
  • Custom serial interface controllers
  • Data multiplexers and demultiplexers
  • Signal processing pipelines

Test & Measurement

  • Logic analyzer front-ends
  • Pattern generators
  • Data acquisition systems with multiple parallel channels
  • Board-level BIST (Built-In Self-Test) controllers

Legacy System Support & Board Repair

The XC2S200-6FGG1249C is widely used as a replacement component in legacy PCBs where the original FPGA has failed. Its large I/O count in the 1249-pin package makes it especially suitable for high-density legacy boards.


Why Choose a Spartan-II FPGA for Your Design?

For engineers considering whether the XC2S200-6FGG1249C is the right FPGA, here are the main advantages of the Spartan-II architecture:

Cost-Effective vs. ASICs

The Spartan-II was designed as a superior alternative to mask-programmed ASICs. It eliminates the high NRE (Non-Recurring Engineering) costs, lengthy development cycles, and risk inherent in custom silicon.

 In-Field Reprogrammability

Unlike ASICs, the XC2S200-6FGG1249C can be reprogrammed in the field without hardware replacement. Design updates, bug fixes, and feature additions are deployed through configuration file updates.

Mature & Stable Technology

The Spartan-II 0.18 µm process is a mature node with well-characterized timing models, making it ideal for applications requiring long-term supply certainty and stable behavior across temperature.

For a broader look at the full range of programmable devices in this ecosystem, visit Xilinx FPGA.


XC2S200-6FGG1249C Configuration & Programming

Configuration Modes

The XC2S200 supports several configuration modes, selectable via the M0–M1 mode pins:

Mode Description Typical Use Case
Master Serial FPGA drives configuration clock, reads serial PROM Most common, uses XC17V/XCF PROM
Slave Serial External clock drives configuration Daisy-chaining multiple FPGAs
Slave Parallel Byte-wide parallel configuration bus Processor-driven configuration
JTAG (Boundary Scan) IEEE 1149.1 JTAG interface Debug, testing, programming

Supported Design Tools

Tool Version Support Purpose
Xilinx ISE Design Suite ISE 14.7 (final) Synthesis, implementation, bitstream
XST (Xilinx Synthesis Tool) Included with ISE HDL synthesis
ModelSim / Vivado Simulator Legacy simulation RTL and gate-level simulation
ChipScope Pro ISE embedded In-system debug via JTAG

Important: The XC2S200-6FGG1249C is not supported in Vivado. Use ISE 14.7 (the final ISE release) for all Spartan-II designs. ISE 14.7 is available as a free download from AMD/Xilinx.


Electrical Characteristics Summary

Absolute Maximum Ratings

Parameter Value
Supply Voltage (VCCINT) –0.5V to +3.0V
I/O Voltage (VCCO) –0.5V to +4.0V
Storage Temperature –65°C to +150°C
Operating Temperature 0°C to +85°C (Commercial)

DC Operating Conditions

Parameter Min Typical Max
Core Voltage (VCCINT) 2.375V 2.5V 2.625V
I/O Voltage (VCCO) 2.5V / 3.3V
Input Low Voltage (VIL) –0.5V 0.8V
Input High Voltage (VIH) 2.0V VCCO + 0.5V

Frequently Asked Questions (FAQ)

Q: Is the XC2S200-6FGG1249C RoHS compliant?

Yes. The “G” in the “FGG” package designation indicates this is the Pb-free (lead-free) packaging variant, compliant with RoHS directives.

Q: What is the difference between XC2S200-6FGG1249C and XC2S200-6FGG456C?

The primary difference is the pin count and package size. The FGG1249 package has 1,249 pins versus 456 pins, providing a significantly larger footprint with higher I/O density capability. Both devices contain identical XC2S200 silicon with the same -6 speed grade.

Q: Can I use Vivado to program the XC2S200-6FGG1249C?

No. The Spartan-II family is not supported in Vivado. You must use Xilinx ISE Design Suite version 14.7, which is the last release that supports legacy Spartan-II devices.

Q: What PROM should I use to configure the XC2S200-6FGG1249C?

Xilinx XCF (Platform Flash) PROMs or legacy XC17V series PROMs are compatible with Master Serial configuration mode. The XCF04S, XCF08P, or XCF16P are commonly used with XC2S200 designs.

 Q: Is the XC2S200-6FGG1249C still in production?

The Spartan-II family has been discontinued for new designs (per Xilinx PDN notice). However, inventory is still available from authorized distributors and the component is widely used in legacy system maintenance.

Q: What is the -6 speed grade compared to -5?

The -6 speed grade is the fastest available for commercial-temperature Spartan-II devices, offering lower propagation delays and higher maximum operating frequencies compared to -5. The -6 grade is exclusively available in the Commercial (0°C to +85°C) temperature range.


Summary: XC2S200-6FGG1249C at a Glance

Attribute Detail
Manufacturer Xilinx (now AMD)
Family Spartan-II
Part Number XC2S200-6FGG1249C
System Gates 200,000
Logic Cells 5,292
Max User I/O 284
Block RAM 56K bits
Speed Grade -6 (fastest commercial)
Package 1249-pin Fine-Pitch BGA (Pb-Free)
Supply Voltage 2.5V
Process 0.18 µm
Temperature 0°C to +85°C (Commercial)
Design Tool ISE Design Suite 14.7
RoHS Yes (Pb-Free)

The XC2S200-6FGG1249C remains a reliable, proven FPGA solution for engineers maintaining legacy designs or building high-I/O embedded systems. Its combination of 200K gates, 284 user I/Os, and the fastest -6 commercial speed grade in a Pb-free 1249-pin BGA package makes it a highly capable component for demanding applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.