The XC2S200-6FGG1246C is a high-pin-count Field Programmable Gate Array (FPGA) from Xilinx’s proven Spartan-II family. Housed in a 1246-ball Fine-Pitch Ball Grid Array (FBGA) package with Pb-free (RoHS-compliant “G” suffix) construction, this device delivers 200,000 system gates and up to 5,292 logic cells in the commercial temperature range. Whether you are sourcing components for legacy system maintenance, industrial control, or telecommunications infrastructure, the XC2S200-6FGG1246C remains a widely referenced programmable logic device in the global electronic components market.

For a broader overview of the complete Spartan and successor families, visit our Xilinx FPGA resource page.

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XC2S200-6FGG1246C Overview: What Is This Device?

The XC2S200-6FGG1246C belongs to the Xilinx Spartan-II FPGA family, a series of cost-optimized programmable logic devices built on 0.18 µm CMOS process technology. Spartan-II devices were designed as a high-volume, lower-cost alternative to mask-programmed ASICs, enabling engineers to implement custom digital logic without the non-recurring engineering (NRE) costs and long development cycles traditionally associated with ASICs.

Decoding the Part Number: XC2S200-6FGG1246C

Understanding the part number is essential when sourcing or specifying this component.

Note: The “-6” speed grade is exclusively available in the commercial temperature range for the XC2S200 device. Industrial temperature variants use slower speed grades.

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XC2S200-6FGG1246C Key Technical Specifications

Core Logic Resources

Electrical & Process Technology

Package & Physical Details

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Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The XC2S200 is the largest device in the Spartan-II family. The table below shows how it compares to its sibling devices.

The XC2S200 offers the maximum logic density, user I/O, and on-chip memory within the Spartan-II lineup, making it the preferred choice for applications demanding the highest capacity in this cost-optimized family.

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XC2S200-6FGG1246C Architecture: Inside the Spartan-II

Configurable Logic Blocks (CLBs)

The fundamental building block of the XC2S200-6FGG1246C is the Configurable Logic Block (CLB). Each CLB contains four logic cells, and each logic cell incorporates a 4-input function generator (look-up table, or LUT), carry logic, and a storage element (flip-flop). This architecture allows efficient implementation of combinational logic, arithmetic functions, and registered outputs.

Input/Output Blocks (IOBs)

The device features up to 284 maximum user I/O pins via its programmable Input/Output Blocks. Each IOB supports a wide range of single-ended and differential I/O standards. IOBs include programmable slew-rate control, pull-up/pull-down resistors, and optional input delay, providing designers with fine-grained control over signal integrity.

Distributed and Block RAM

The XC2S200 provides two forms of on-chip memory:

• Distributed RAM (75,264 bits): Formed by configuring CLB look-up tables as synchronous or asynchronous RAM. Ideal for small, fast, distributed storage and FIFOs.
• Block RAM (56K bits): Two dedicated columns of true dual-port block RAM on opposite sides of the die. Each block RAM can be configured for various depth and width combinations, ideal for larger data buffers, look-up tables, and packet storage.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) are placed at each corner of the die. The DLLs provide zero-delay clock buffering, clock division/multiplication, and phase shifting, enabling precise clock management across high-speed designs without external components.

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XC2S200 Package Options Comparison

The XC2S200 device is available in multiple package options. The FGG1246 (1,246-ball FBGA) is the highest pin-count package, offering the maximum number of available user I/O connections.

The FGG1246 package is the Pb-free (RoHS-compliant) variant with 1,246 balls. This is the package for the XC2S200-6FGG1246C.

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Speed Grade Explained: What Does “-6” Mean?

The -6 speed grade is the fastest available speed grade for the XC2S200 family. In Xilinx’s naming convention, a higher number indicates a faster device with shorter propagation delays. For the Spartan-II family:

The -6 grade is exclusively restricted to the commercial temperature range (denoted by the “C” suffix), making the XC2S200-6FGG1246C specifically suited for controlled-environment applications where the highest clock speeds are required.

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XC2S200-6FGG1246C Supported I/O Standards

The Spartan-II IOBs support a wide range of industry-standard I/O interfaces:

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Configuration Modes for XC2S200-6FGG1246C

The XC2S200-6FGG1246C is an SRAM-based FPGA, meaning it must be configured at power-up each time. Supported configuration modes include:

• Master Serial Mode – Using Xilinx Serial PROMs (XC17xx, XCF0xS)
• Slave Serial Mode – Driven by an external controller or daisy-chain configuration
• SelectMAP (Parallel) Mode – Fast 8-bit parallel loading via microprocessor or dedicated controller
• JTAG Boundary Scan – IEEE 1149.1-compliant JTAG for in-system configuration and testing
• Slave Parallel Mode – Parallel loading for highest configuration speed

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Typical Applications of the XC2S200-6FGG1246C

The combination of 200K gates, 284 I/O pins, dedicated DLLs, and a robust block RAM structure makes this device well-suited for a range of embedded and systems-level applications.

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XC2S200-6FGG1246C vs. XC2S200-6FGG456C: Key Differences

Engineers sourcing the XC2S200 frequently compare the FGG1246 and the more common FGG456 package variants. The core die is identical; the differences are purely at the package level.

Both variants offer the same logical performance. The FGG1246 provides a larger physical footprint which, in some board designs, eases PCB routing constraints despite the higher ball count, by spreading pins across a larger grid pitch.

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Design Tools and Software Support

The XC2S200-6FGG1246C is supported by Xilinx (now AMD) legacy design tools:

• Xilinx ISE Design Suite – The primary design environment for Spartan-II. Supports HDL synthesis (VHDL, Verilog), implementation, timing analysis, and bitstream generation.
• PlanAhead – Floorplanning and design analysis tool compatible with Spartan-II designs.
• ChipScope Pro – On-chip debug and logic analysis tool.
• iMPACT – Configuration and JTAG programming utility.

Xilinx’s newer Vivado Design Suite does not support Spartan-II devices. For XC2S200 development and maintenance, ISE 14.7 (the final ISE release) is required.

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Ordering Information & Product Status

Important: The XC2S200-6FGG1246C has been formally discontinued by AMD/Xilinx. It is available through authorized distributors and aftermarket electronics suppliers for legacy system maintenance, spares, and end-of-life production runs.

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Frequently Asked Questions: XC2S200-6FGG1246C

What is the difference between XC2S200-6FGG1246C and XC2S200-6FG1246C?

The difference is the “G” in the package suffix. The “FGG” designation indicates a Pb-free (lead-free) package compliant with RoHS directives, while “FG” refers to the standard tin-lead (SnPb) package. Both variants contain the same silicon die with identical electrical characteristics. For modern supply chain compliance, the FGG (Pb-free) variant is generally preferred.

Is the XC2S200-6FGG1246C still in production?

No. The XC2S200 family has been discontinued by AMD/Xilinx. The part is available through the secondary electronics market, authorized distributors with legacy inventory, and specialist component brokers. Always verify authenticity through authorized channels when sourcing discontinued components.

What is the maximum operating frequency of the XC2S200-6FGG1246C?

The Spartan-II XC2S200 can achieve system frequencies of up to 263 MHz in the -6 speed grade, depending on design complexity and timing constraints. Internal logic paths and routing delays will determine the actual achievable frequency for a given design.

Can I replace the XC2S200-6FGG1246C with a newer Xilinx device?

Direct pin-for-pin replacement is not possible due to architectural and physical package differences. However, functional migration to Spartan-3, Spartan-6, or Spartan-7 devices is feasible with HDL redesign and PCB layout modification. AMD provides migration guides for transitioning legacy Spartan-II designs to newer families.

What configuration PROM is compatible with the XC2S200?

Xilinx XCF Series (Platform Flash) and XC17xx Serial PROMs are compatible with Spartan-II serial configuration. For parallel configuration, dedicated byte-wide configuration controllers or microprocessor-driven SelectMAP configurations are used.

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Summary: XC2S200-6FGG1246C at a Glance

The XC2S200-6FGG1246C remains a technically capable programmable logic device for legacy maintenance and last-time-buy procurement needs. Its 200K-gate capacity, 284 user I/O, and -6 speed grade performance make it one of the most capable variants in the Spartan-II lineup. Engineers working with existing Spartan-II based designs can rely on this component for continuity, while new designs should consider migration to AMD’s current-generation Spartan-7 or Artix-7 FPGA families.