Meta Description: The XC2S200-6FGG1245C is a Xilinx Spartan-II FPGA with 200K system gates, -6 speed grade, and 1245-ball Fine Pitch BGA package. Read full specs, pinout, and applications here.

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The XC2S200-6FGG1245C is a field-programmable gate array (FPGA) manufactured by Xilinx as part of the proven Spartan-II family. Combining 200,000 system gates with a high-density 1245-ball Fine Pitch BGA (FGG) package and the fastest commercial -6 speed grade, this device delivers exceptional programmable logic performance for cost-sensitive embedded designs. Whether you are sourcing components for telecommunications, industrial control, or digital signal processing projects, the XC2S200-6FGG1245C offers the flexibility and reliability that engineers demand from a trusted Xilinx FPGA.

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What Is the XC2S200-6FGG1245C? Overview and Part Number Breakdown

The part number XC2S200-6FGG1245C encodes the device’s complete identity:

This device belongs to the largest density node in the Spartan-II lineup, making it the top-tier choice within this family for designs that require maximum logic resources.

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XC2S200-6FGG1245C Key Specifications at a Glance

The following table summarizes the most critical electrical and physical specifications for the XC2S200-6FGG1245C.

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XC2S200-6FGG1245C Architecture: Inside the Spartan-II Core

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1245C is its array of 1,176 Configurable Logic Blocks arranged in a 28-column by 42-row matrix. Each CLB contains four logic cells, and each logic cell includes a 4-input function generator (LUT), carry logic, and a storage element (flip-flop). This architecture enables efficient implementation of counters, state machines, arithmetic circuits, and complex combinational logic.

Block RAM and Distributed RAM

The XC2S200-6FGG1245C provides two complementary memory architectures:

Block RAM resources are physically placed in two columns on opposite sides of the die, optimizing routing performance for memory-intensive applications.

Input/Output Blocks (IOBs) and User I/O

With 284 maximum user I/O pins, the XC2S200-6FGG1245C supports a rich set of I/O standards, including LVTTL, LVCMOS, PCI, GTL, and more. Every IOB supports:

• Programmable input delay (to eliminate setup time concerns)
• Optional output slew-rate control
• Pull-up, pull-down, and keeper logic
• 3-state control for bidirectional signals

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one at each corner of the die — provide zero-delay clock buffering, frequency synthesis, and phase shifting. This eliminates clock distribution skew and simplifies high-speed synchronous design without requiring external clock conditioning circuitry.

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Speed Grade -6: What It Means for Your Design

The -6 speed grade is the fastest and most performance-optimized variant in the XC2S200 lineup. According to Xilinx documentation, the -6 speed grade is exclusively available in the Commercial temperature range, making the XC2S200-6FGG1245C a purpose-built device for lab, consumer, and commercial-grade equipment operating within 0°C to +85°C.

If your application requires maximum timing margin and deterministic high-frequency operation, the -6 speed grade is the correct selection.

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Package Details: 1245-Ball Fine Pitch BGA (FGG)

The FGG1245 package is a high pin-count Fine Pitch Ball Grid Array designed to maximize I/O density on compact PCB footprints. Key package characteristics include:

The “G” in FGG explicitly indicates the lead-free, RoHS-compliant solder ball finish, making this part suitable for designs requiring EU RoHS 2 and REACH compliance.

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XC2S200-6FGG1245C vs. Other XC2S200 Variants

The XC2S200 core is offered in multiple package and speed grade options. The table below helps engineers select the right variant for their application.

The XC2S200-6FGG1245C stands out due to its exceptionally high ball count of 1,245, providing system designers maximum I/O connectivity and routing flexibility for highly complex multi-bus designs.

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Spartan-II Family Comparison: Where the XC2S200 Fits

The XC2S200 is the largest and highest-performance device in the Spartan-II family, delivering the greatest logic density, I/O count, and memory resources within this product line.

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Typical Applications for the XC2S200-6FGG1245C

The combination of 200K system gates, high I/O count, and -6 speed grade makes the XC2S200-6FGG1245C well-suited for a broad range of embedded and digital hardware applications:

Digital Signal Processing (DSP)

Implement FIR/IIR filters, FFT engines, and real-time data processing pipelines using the abundant CLB and distributed RAM resources.

Telecommunications Equipment

The high I/O count and fast clock speeds support multi-channel serial interfaces, framing logic, and protocol conversion in line cards and switching equipment.

Industrial Control Systems

Programmable I/O standards and DLL clock management make this FPGA ideal for motion control, sensor fusion, and PLC replacement applications.

Embedded Processor Interfaces

Bridge between microprocessors and peripheral buses (PCI, UART, SPI, I2C) using the XC2S200’s flexible IOB architecture.

Video and Image Processing

Block RAM enables efficient frame buffering and line caching for real-time video pipeline designs.

ASIC Prototyping

The XC2S200 series is a proven ASIC prototyping platform, allowing logic verification before committing to mask tooling costs.

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Design Tools and Programming Support

The XC2S200-6FGG1245C is supported by Xilinx (AMD) design toolchains:

Note: The Spartan-II family predates Vivado. Xilinx ISE 14.7 is the final and recommended design environment for all XC2S200 devices.

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XC2S200-6FGG1245C Configuration Modes

Spartan-II FPGAs including the XC2S200-6FGG1245C support several configuration modes:

Configuration data is stored in an external non-volatile memory (such as Xilinx XCF-series Platform Flash PROMs) and loaded into the FPGA’s SRAM-based configuration memory at power-up.

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Ordering Information and Part Number Guide

When ordering the XC2S200-6FGG1245C, verify the following parameters to avoid substitution errors:

Authorized distributors including Digi-Key, Mouser, Avnet, and Arrow Electronics may carry this part or its closest available equivalent. Always confirm the complete part number including the suffix letter when placing orders.

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1245C used for?

The XC2S200-6FGG1245C is a high-density Xilinx Spartan-II FPGA used in digital signal processing, telecommunications, industrial automation, embedded processor interfacing, and ASIC prototyping.

What is the difference between FG and FGG packages?

The “G” suffix in FGG denotes a Pb-free (lead-free), RoHS-compliant ball grid array package. The FG package uses standard tin-lead (SnPb) solder balls, while the FGG variant uses lead-free (SAC305 or equivalent) alloy.

Is the -6 speed grade available in industrial temperature range?

No. Per Xilinx’s official datasheet, the -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). For industrial temperature (-40°C to +100°C) applications, the -5 speed grade must be selected.

What programming software is used for XC2S200 FPGAs?

The XC2S200-6FGG1245C is programmed using Xilinx ISE Design Suite (version 14.7 is the final supported version). Vivado does not support the Spartan-II family.

Can the XC2S200-6FGG1245C replace an ASIC?

Yes. The Spartan-II family was explicitly designed as a cost-effective alternative to mask-programmed ASICs. The XC2S200 allows field-upgradable designs, eliminating the NRE costs and long lead times associated with ASIC development.

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Summary: Why Choose the XC2S200-6FGG1245C?

The XC2S200-6FGG1245C combines the largest logic density in the Spartan-II family with the fastest available speed grade and a high-density RoHS-compliant 1245-ball BGA package. Its mature, well-documented architecture, broad I/O standard support, and compatibility with Xilinx ISE make it a reliable choice for engineers maintaining legacy designs or deploying new applications in commercial-grade environments.

For engineers evaluating broader Xilinx programmable logic solutions beyond the Spartan-II generation, explore the full range of available options at Xilinx FPGA.