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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1244C: Complete Guide to the Xilinx Spartan-II FPGA

Product Details

The XC2S200-6FGG1244C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Offering 200,000 system gates, 5,292 logic cells, and a blazing-fast -6 speed grade, this device delivers outstanding digital processing capability in a 1244-ball Fine-Pitch Ball Grid Array (FBGA) package. Whether you are designing embedded systems, telecommunications hardware, or industrial automation controllers, the XC2S200-6FGG1244C is a proven, cost-effective ASIC replacement with unlimited reprogrammability.


What Is the XC2S200-6FGG1244C?

The XC2S200-6FGG1244C belongs to Xilinx’s Spartan-II FPGA product line — a family engineered as a second-generation ASIC replacement technology. The part number breaks down as follows:

Code Segment Meaning
XC2S200 Spartan-II device, 200K system gates
-6 Speed grade -6 (fastest available, commercial range only)
FGG Fine-Pitch Ball Grid Array package (Pb-free “G” suffix)
1244 1244 pins
C Commercial temperature range (0°C to 85°C)

This makes the XC2S200-6FGG1244C the top-speed, high pin-count, Pb-free commercial variant of the XC2S200 device — ideal for designs requiring maximum I/O flexibility and the fastest possible timing performance.


XC2S200-6FGG1244C Key Specifications

Core Logic Resources

Parameter Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K (56,000 bits)

Electrical & Physical Characteristics

Parameter Value
Core Supply Voltage 2.5V (range: 2.375V – 2.625V)
I/O Voltage Support 2.5V and 3.3V (multi-volt I/O)
Technology Node 0.18 µm CMOS
Package Type Fine-Pitch BGA (FBGA)
Package Pins 1244
RoHS / Pb-Free Yes (FGG suffix)
Operating Temperature 0°C to 85°C (Commercial)
Max System Clock Up to 263 MHz
Speed Grade -6 (fastest commercial grade)

Memory Architecture

Memory Type Capacity
Distributed SelectRAM™ (per LUT) 16 bits
Configurable Block RAM 4K bits per block
Total Block RAM 56,000 bits
Total Distributed RAM 75,264 bits

XC2S200-6FGG1244C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1244C is built around a 28×42 array of Configurable Logic Blocks (CLBs). Each CLB contains four-input Look-Up Tables (LUTs), flip-flops, and fast carry logic, enabling the implementation of sophisticated combinational and sequential digital circuits. The CLB architecture follows Xilinx’s streamlined Virtex®-derived design, offering both speed and logic density.

Input/Output Blocks (IOBs)

Surrounding the CLB array is a full perimeter of programmable Input/Output Blocks (IOBs). The XC2S200-6FGG1244C supports up to 284 user I/O pins and is compatible with 16 selectable I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. This multi-volt I/O capability enables seamless interfacing with a wide range of peripheral devices and system buses.

Delay-Locked Loops (DLLs)

The device integrates four Delay-Locked Loops (DLLs), one at each corner of the die. These DLLs enable zero-delay clock buffering, clock multiplication and division, and precise phase alignment — critical features for high-speed synchronous design.

Block RAM

Two columns of configurable block RAM are placed on opposite sides of the die, between the CLB array and the IOB columns. Each 4K-bit block RAM can be independently configured as a dual-port memory, supporting various width combinations to match application needs.

Routing Architecture

The functional elements of the XC2S200-6FGG1244C are interconnected through a hierarchical routing fabric featuring local, long-line, and global routing resources. This hierarchy minimizes routing delays while maximizing design flexibility.


XC2S200-6FGG1244C Configuration Modes

The XC2S200-6FGG1244C supports multiple configuration modes to suit various system requirements:

Configuration Mode CCLK Direction Data Width Serial DOUT
Master Serial Output 1-bit Yes
Slave Serial Input 1-bit Yes
Slave Parallel Input 8-bit No
Boundary-Scan (JTAG) N/A 1-bit No

During power-on and throughout the configuration process, all I/O drivers remain in a high-impedance state, protecting connected circuitry. After configuration, unused I/Os remain high-impedance unless explicitly assigned.


Spartan-II Family Comparison: Where Does XC2S200 Fit?

Device Logic Cells System Gates CLB Array Max User I/O Dist. RAM (bits) Block RAM (bits)
XC2S15 432 15,000 8 × 12 86 6,144 16K
XC2S30 972 30,000 12 × 18 92 13,824 24K
XC2S50 1,728 50,000 16 × 24 176 24,576 32K
XC2S100 2,700 100,000 20 × 30 176 38,400 40K
XC2S150 3,888 150,000 24 × 36 260 55,296 48K
XC2S200 5,292 200,000 28 × 42 284 75,264 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, making it the preferred choice for applications requiring the highest logic density and I/O count within the Spartan-II lineup.


Top Applications for the XC2S200-6FGG1244C

The XC2S200-6FGG1244C is widely deployed across industries where fast, reprogrammable logic is critical:

Telecommunications & Wireless Infrastructure

The device excels in baseband processing for 4G/5G base stations, satellite communication links, and IoT gateway hardware. Its 200,000 gates support the implementation of complex modulation, FEC coding, and protocol conversion logic, while the high pin count of the FGG1244 package enables rich interface connectivity.

 Industrial Automation & Control Systems

With 284 I/Os and a 2.5V operating core, the XC2S200-6FGG1244C interfaces directly with sensors, actuators, and fieldbus systems. It is used in programmable logic controllers (PLCs), motor drives, and process automation equipment where deterministic real-time performance is non-negotiable.

High-Speed Data Acquisition

The device’s 263 MHz maximum clock rate and deep memory resources (75K+ bits distributed + 56K block RAM) make it ideal for ADC/DAC interfacing, waveform capture, and signal preprocessing in radar, test & measurement, and medical imaging systems.

Embedded Vision & Image Processing

The XC2S200-6FGG1244C supports real-time image processing pipelines for machine vision cameras, surveillance systems, and robotic guidance hardware. The high CLB count enables efficient implementation of convolution, edge detection, and compression algorithms.

Prototyping & ASIC Emulation

As a second-generation ASIC replacement technology, the XC2S200-6FGG1244C eliminates NRE costs and allows in-field firmware upgrades — making it a cost-effective vehicle for hardware prototyping before committing to ASIC tape-out.


Ordering Information & Part Number Decoder

Xilinx Spartan-II parts follow a structured naming convention:

XC2S200  -  6  -  FGG  -  1244  -  C
  |          |     |         |      |
Device    Speed  Package   Pins  Temp
Type      Grade  Type            Range
  • Device Type: XC2S200 — Spartan-II, 200K gate density
  • Speed Grade: -6 — fastest available; exclusively commercial temperature
  • Package: FGG — Pb-free Fine-Pitch Ball Grid Array
  • Pin Count: 1244 — high pin-count BGA for maximum I/O
  • Temperature: C — Commercial (0°C to 85°C)

Note: The -6 speed grade is exclusively available in the Commercial temperature range. For industrial temperature range (-40°C to 100°C) applications, select the -5I speed grade variants.


Design Tools & Development Support

Xilinx ISE Design Suite

The XC2S200-6FGG1244C is fully supported by Xilinx ISE (Integrated Software Environment), the dedicated design tool for Spartan-II FPGAs. ISE provides synthesis, place-and-route, simulation, and bitstream generation for this device family. Note that newer tools like AMD Vivado do not support Spartan-II devices — ISE remains the correct toolchain.

 JTAG Boundary-Scan Support

The device supports IEEE 1149.1 Boundary-Scan (JTAG), enabling in-circuit testing, debugging, and programming without removing the FPGA from the board.

SelectMAP & Serial Configuration

Engineers can configure the XC2S200-6FGG1244C via Xilinx Platform Flash PROMs, external microcontrollers (slave serial/parallel modes), or JTAG for debug and development environments.


Why Choose the XC2S200-6FGG1244C?

Advantage Detail
Highest speed grade -6 grade delivers the lowest propagation delays in the Spartan-II family
Maximum logic density Largest device in Spartan-II at 200K gates and 5,292 logic cells
High I/O count 1244-pin package maximizes connectivity options
Pb-free compliance FGG package meets RoHS / environmental directives
Reprogrammable Unlimited reconfiguration with no hardware replacement
Cost-effective Significantly lower BOM cost than equivalent gate-count ASICs
Multi-volt I/O Supports 16 I/O standards including 2.5V and 3.3V interfaces
Proven reliability 0.18 µm CMOS process with extensive production history

For engineers and procurement teams sourcing Spartan-II components, explore the full range of Xilinx FPGA solutions available for your design requirements.


XC2S200-6FGG1244C vs. Alternative Variants

Part Number Speed Grade Package Pins Temp Range Pb-Free
XC2S200-6FGG1244C -6 FBGA 1244 Commercial Yes
XC2S200-6FGG456C -6 FBGA 456 Commercial Yes
XC2S200-6FGG256C -6 FBGA 256 Commercial Yes
XC2S200-6FG456C -6 FBGA 456 Commercial No
XC2S200-5FGG456I -5 FBGA 456 Industrial Yes
XC2S200-6PQG208C -6 PQFP 208 Commercial Yes

The FGG1244C variant is specifically chosen when a design requires the maximum possible I/O count within the XC2S200 device, combined with the highest -6 speed grade and Pb-free packaging compliance.


Frequently Asked Questions (FAQ)

What is the maximum clock frequency of the XC2S200-6FGG1244C?

The XC2S200-6FGG1244C can operate at system clock rates up to 263 MHz, making it suitable for high-speed data processing in demanding real-time applications.

Is the XC2S200-6FGG1244C RoHS compliant?

Yes. The “G” in the FGG package designation indicates a Pb-free (lead-free) package, confirming full RoHS compliance.

What design software supports the XC2S200-6FGG1244C?

The device is supported by Xilinx ISE Design Suite. AMD Vivado does not support the Spartan-II family. ISE remains the correct and fully functional toolchain for all XC2S200 design work.

Can the XC2S200-6FGG1244C be used in industrial temperature applications?

No. The -6 speed grade is exclusively available for the Commercial temperature range (0°C to 85°C). For industrial temperature range applications (-40°C to 100°C), the -5I speed grade variants should be selected instead.

How many I/O pins does the XC2S200-6FGG1244C support?

The XC2S200 core supports up to 284 user I/O pins. The 1244-ball package provides additional ball count to accommodate power, ground, and configuration pins alongside the full complement of user I/Os.

What I/O standards are supported?

The XC2S200-6FGG1244C supports 16 selectable I/O standards including LVTTL, LVCMOS2, PCI (3.3V/5V), GTL, GTL+, HSTL (Class I/III), SSTL2 (Class I/II), SSTL3 (Class I/II), AGP, and CTT.


Summary

The XC2S200-6FGG1244C is the flagship device of the Xilinx Spartan-II FPGA family — combining 200,000 system gates, 5,292 logic cells, 284 user I/O, and Pb-free packaging in the maximum pin-count FGG1244 BGA form factor. With the fastest -6 commercial speed grade and robust on-chip memory resources, it is an exceptional solution for telecommunications, industrial automation, high-speed data acquisition, and embedded vision applications. Its unlimited reprogrammability and elimination of ASIC NRE costs make it a uniquely compelling choice for both production deployments and prototyping environments.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.