Meta Description: Buy XC2S200-6FGG1242C — Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, -6 speed grade, 1,242-pin FGG BGA package. Full specs, pinout, and ordering info.

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The XC2S200-6FGG1242C is a high-density, commercially graded Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. Combining 200,000 system gates, a fast -6 speed grade, and a large-format 1,242-pin Fine-Pitch Ball Grid Array (FGG BGA) package, this device delivers the I/O density and logic capacity demanded by complex embedded, communications, and industrial designs. As part of AMD Xilinx’s proven Spartan-II product line, the XC2S200-6FGG1242C is supported by the mature ISE Design Suite and remains widely sourced for legacy and sustaining engineering applications.

For engineers evaluating the broader Spartan and successor device portfolio, see our complete guide to Xilinx FPGA solutions.

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What Is the XC2S200-6FGG1242C? — Product Overview

The XC2S200-6FGG1242C belongs to the XC2S200 sub-family within the Spartan-II series, which tops out at 200,000 system gates. The part number breaks down as follows:

The “-6” speed grade is exclusively available in the Commercial temperature range, making the XC2S200-6FGG1242C ideal for high-speed, controlled-environment applications where maximum clock performance is the priority.

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XC2S200-6FGG1242C Key Features & Technical Highlights

Core Logic Resources

• 200,000 System Gates (logic and RAM combined)
• 5,292 Logic Cells arranged in a 28-column × 42-row CLB array
• 1,176 Configurable Logic Blocks (CLBs) — each CLB contains two slices, each with two Look-Up Tables (LUTs) and two flip-flops
• 75,264 bits of Distributed RAM — implemented within the CLB array for high-speed local storage
• 56K bits (56,000 bits) of Block RAM — dedicated on-chip block memory for FIFOs, buffers, and dual-port memory

Clock Management

• 4 Delay-Locked Loops (DLLs) — one at each corner of the die
• Supports clock multiplication, division, phase shifting, and duty-cycle correction
• Global clock distribution network with dedicated routing for minimal skew

I/O and Packaging

• 284 maximum user I/O pins (not counting the four dedicated global clock/user input pins)
• 1,242-ball FGG BGA package — fine-pitch ball grid array providing maximum signal routing flexibility for high-pin-count system boards
• Supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL, and CTT

Process Technology & Power

• Fabricated on 0.18 µm process technology
• Core voltage: 2.5V
• I/O voltage: 3.3V (5V tolerant with proper configuration)
• Commercial operating temperature: 0°C to +85°C

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XC2S200-6FGG1242C Full Specifications Table

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Spartan-II Family Comparison — Where Does XC2S200 Fit?

The XC2S200 is the largest device in the Spartan-II family, providing the most logic resources across the entire lineup. The table below shows the full family hierarchy:

The XC2S200 offers 37% more logic cells than the XC2S150 and nearly 12× the capacity of the entry-level XC2S15 — making it the right choice for designs that demand maximum on-chip resources within the Spartan-II generation.

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XC2S200 Package Options — Choosing the Right Variant

The XC2S200 core die is available in several package options. The FGG1242 variant used in the XC2S200-6FGG1242C offers the highest ball count for maximum I/O routing:

The FGG1242 package is designed for applications requiring the maximum number of routable user I/O connections and board-level integration density.

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XC2S200-6FGG1242C Architecture — Inside the Device

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG1242C contains two slices. Each slice provides two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), and carry logic. The CLB fabric supports:

• Combinational and registered logic
• Distributed RAM (16×1 or 16×2 configurations per LUT)
• Shift register functions
• Wide function multiplexers (F5, F6, F7, F8)

Block RAM

The XC2S200 integrates two columns of dedicated block RAM. Each block RAM module is a true dual-port memory supporting simultaneous read and write operations, configurable widths from ×1 to ×16, and optional pipelining. Block RAM is ideal for FIFOs, lookup tables, and local data buffers.

Input/Output Blocks (IOBs)

The IOBs in the XC2S200-6FGG1242C support a wide range of single-ended and differential I/O standards. Key IOB features include:

• Programmable input delay
• Slew-rate control for output drivers
• Optional pull-up or pull-down resistors
• 3-state output control
• Support for DDR registers

Delay-Locked Loops (DLLs)

Four on-chip DLLs eliminate clock distribution delay and support frequency synthesis. Each DLL can multiply or divide the incoming clock and generate phase-shifted outputs, enabling zero-delay clock buffering and multi-clock-domain designs.

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Configuration Modes for XC2S200-6FGG1242C

The XC2S200-6FGG1242C supports four standard FPGA configuration modes, selected via the M0, M1, and M2 mode pins:

During power-on and throughout configuration, all I/O drivers remain in a high-impedance state until configuration completes and startup is released.

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Typical Applications for the XC2S200-6FGG1242C

The XC2S200-6FGG1242C’s combination of 200K gates, 284 user I/Os, and a -6 speed grade makes it well-suited for a broad range of applications:

Communications & Networking

• Line-rate packet processing and protocol bridging
• Network interface controllers and media access control (MAC) logic
• Serial-to-parallel and parallel-to-serial conversion

Industrial Automation & Control

• Motor drive control and servo feedback loops
• Programmable logic controller (PLC) replacement
• Sensor fusion and real-time data acquisition

Medical & Instrumentation

• Medical imaging pre-processing (ultrasound, X-ray)
• High-speed ADC/DAC interface logic

Embedded Processing

• Glue logic replacement for multi-chip designs
• Bus bridging (PCI, VME, PCIe legacy)

Defense & Aerospace (Commercial Temp Applications)

• Signal intelligence (SIGINT) front-end processing
• Radar signal pre-processing
• Ruggedized computing platform interface logic

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XC2S200-6FGG1242C vs. Competitor Devices

Note: The XC2S200-6FGG1242C is a mature device on a 0.18 µm process. Designs requiring lower power or higher density should evaluate Xilinx Spartan-3 or Spartan-6 successors.

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Ordering Information & Part Number Decoder

When ordering the XC2S200-6FGG1242C, verify the following fields to ensure you receive the correct variant:

Important: The -6 speed grade is exclusively available in the Commercial (C) temperature range. Industrial-temp (-40°C to +100°C) variants of XC2S200 are available at -5 and lower speed grades only.

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Frequently Asked Questions — XC2S200-6FGG1242C

 What is the difference between XC2S200-6FGG1242C and XC2S200-5FGG1242C?

The only difference is the speed grade. The -6 variant is the fastest commercially available option and supports higher maximum clock frequencies than the -5. Both are commercial temperature range devices in the same FGG1242 package.

Is the XC2S200-6FGG1242C RoHS compliant?

Yes. The G in the FGG package designation indicates a Pb-free (lead-free), RoHS-compliant package, suitable for use in environmentally regulated products.

What design tools support the XC2S200-6FGG1242C?

The XC2S200-6FGG1242C is fully supported by the Xilinx ISE Design Suite (versions 14.x and earlier). Xilinx Vivado does not support Spartan-II devices. For new designs, migrating to a Spartan-6 or Artix-7 device and using Vivado is recommended.

#### What is the configuration bitstream size for XC2S200?

The total configuration bits for the XC2S200 is 1,335,840 bits, as required for full device programming in all supported configuration modes.

#### Can the XC2S200-6FGG1242C be used in automotive designs?

No. The C suffix denotes a commercial-grade part (0°C to +85°C). Automotive designs typically require extended or automotive-grade temperature ratings. Xilinx does not offer XC2S200 in AEC-Q100 automotive qualification.

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Summary — Why Choose the XC2S200-6FGG1242C?

The XC2S200-6FGG1242C remains a well-understood, fully characterized FPGA ideal for engineers maintaining existing designs or requiring a high-I/O, high-logic-capacity device within the Xilinx Spartan-II ecosystem. Its key advantages are:

• Maximum logic capacity in the Spartan-II family (200K gates, 5,292 cells)
• Fastest -6 speed grade available commercially
• 1,242-ball FGG BGA for maximum I/O routing flexibility
• 4 on-chip DLLs for robust clock management
• 56K block RAM + 75K distributed RAM for versatile memory architectures
• Pb-free packaging for RoHS compliance
• Mature ecosystem with extensive ISE toolchain support and application notes

For engineers exploring the full range of Xilinx programmable logic — from Spartan-II through Artix, Kintex, and Virtex UltraScale+ — visit our comprehensive Xilinx FPGA resource page.