The XC2S200-6FGG1240C is a high-density, programmable logic device from Xilinx’s Spartan-II family — one of the most cost-effective Xilinx FPGA solutions for commercial-grade digital design. Featuring 200,000 system gates, a 1240-ball Fine Pitch BGA package, and a -6 speed grade, this component delivers a powerful combination of logic density, I/O capacity, and design flexibility for engineers working in telecommunications, industrial automation, embedded systems, and digital signal processing.

---

What Is the XC2S200-6FGG1240C?

The XC2S200-6FGG1240C is a member of the Xilinx Spartan-II FPGA family, manufactured on a 0.18 µm, 6-layer metal CMOS process using a 2.5V core voltage. The part number encodes all key ordering information:

Note: The -6 speed grade is exclusively available in the Commercial temperature range. This part is not recommended for new designs (NRND) but remains widely used in legacy system maintenance, repair, and field upgrades.

---

XC2S200-6FGG1240C Key Specifications

Core Logic Resources

Electrical & Package Specifications

---

XC2S200-6FGG1240C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 architecture is built around 1,176 Configurable Logic Blocks, each containing four logic cells. Every logic cell includes:

• A 4-input Look-Up Table (LUT) for combinatorial logic
• A storage element (D-type flip-flop or latch)
• Fast carry logic for arithmetic operations
• Wide function multiplexers

CLBs are arranged in a 28-column × 42-row array, providing 75,264 bits of distributed RAM when LUTs are used in memory mode.

Block RAM

The XC2S200 includes 56K bits of dedicated block RAM, organized as two columns of 4Kbit synchronous dual-port memory blocks. Block RAM supports:

• True dual-port access (simultaneous read and write)
• Configurable data widths (1, 2, 4, 8, or 16 bits)
• Synchronous read and write operations

Input/Output Blocks (IOBs)

With 284 maximum user I/Os, the XC2S200-6FGG1240C supports a wide variety of single-ended and differential I/O standards, including:

Each IOB includes programmable slew rate control, optional output inversion, and configurable pull-up/pull-down resistors.

Delay-Locked Loops (DLLs)

The XC2S200 integrates four Delay-Locked Loops (DLLs), one at each corner of the die. DLLs provide:

• Zero-delay clock distribution
• Clock edge alignment for synchronous interfaces
• Clock multiplication and division
• Phase shifting for timing optimization

---

Configuration Modes for XC2S200-6FGG1240C

The XC2S200-6FGG1240C supports four industry-standard configuration modes, selectable via the M0/M1/M2 mode pins:

During power-on and throughout the configuration process, all I/O drivers remain in a high-impedance state, ensuring safe startup in multi-device systems.

---

Spartan-II Family Comparison: Where Does XC2S200 Fit?

The XC2S200 is the largest device in the Spartan-II family, offering the highest gate count, most CLBs, and maximum I/O capacity:

---

XC2S200-6FGG1240C vs. Other XC2S200 Package Variants

The XC2S200 die is available in multiple package options. The FGG1240 is the largest package, offering the most accessible I/O pins:

The 1240-ball package provides the maximum I/O accessibility for high pin-count board designs where routing density is a priority.

---

Typical Applications for XC2S200-6FGG1240C

The XC2S200-6FGG1240C is well-suited for a broad range of commercial and industrial applications:

#### Digital Signal Processing (DSP)

• FIR/IIR filter implementations
• FFT accelerators
• Real-time image and video processing pipelines

#### Communications & Networking

• Protocol bridging (UART, SPI, I2C, PCIe)
• Line rate data path processing
• Glue logic for ASIC/processor interfaces

#### Embedded Control Systems

• Custom state machine controllers
• Motor drive and servo control logic
• Real-time sensor fusion

#### Legacy System Maintenance & Repair

As an NRND component, the XC2S200-6FGG1240C is primarily sourced for board-level repairs, military/aerospace legacy system support, and industrial equipment upgrades where the original design cannot be changed.

#### ASIC Prototyping

The Spartan-II architecture’s ASIC-like structure made it a popular choice for early-stage ASIC prototyping and design validation before tapeout.

---

Advantages of the Spartan-II Architecture

The XC2S200-6FGG1240C delivers several architectural advantages that have sustained demand for this part:

• ASIC-like regular array structure – simplifies timing closure and predictable routing
• Low static power consumption – suitable for cost-sensitive, power-efficient designs
• SelectRAM+ memory – flexible distributed and block RAM configurations
• Boundary-scan (JTAG) support – enables in-system testing per IEEE 1149.1
• Pb-free packaging – RoHS compliant, supporting global environmental regulations
• Field reconfigurability – design updates without hardware replacement, unlike mask-programmed ASICs

---

Development Tools for XC2S200-6FGG1240C

The Spartan-II family is supported by Xilinx ISE Design Suite (legacy). Key tools include:

Note: Vivado Design Suite does not support Spartan-II devices. ISE 14.7 is the final version supporting this family and remains available from the AMD/Xilinx support archives.

---

Ordering Information & Part Number Decoder

Use the table below to decode or build any XC2S200 part number:

Full part number: XC2S200-6FGG1240C

• XC2S200 → 200K gates, Spartan-II
• -6 → Speed grade 6
• FGG → Fine Pitch BGA, Pb-free
• 1240 → 1240-ball count
• C → Commercial temperature

---

Frequently Asked Questions (FAQs)

Is the XC2S200-6FGG1240C still in production?

No. The XC2S200-6FGG1240C is classified as Not Recommended for New Designs (NRND) by AMD/Xilinx. It is available through authorized distributors and specialty component suppliers for legacy system support and maintenance.

What is the difference between FGG and FG packages?

The FGG suffix indicates a Pb-free (RoHS-compliant) version of the Fine Pitch BGA package. The FG suffix refers to the earlier SnPb (leaded) solder version of the same package footprint.

Can I replace XC2S200-6FGG1240C with a newer Xilinx FPGA?

In new designs, AMD/Xilinx recommends migrating to devices from the Spartan-6, Artix-7, or Spartan-7 families, which offer significantly greater logic density and modern I/O standards. However, pin-for-pin drop-in replacement is not possible due to architectural differences.

What programming software do I need for XC2S200-6FGG1240C?

Use Xilinx ISE Design Suite 14.7 for design entry, synthesis, and implementation. Configuration uses the iMPACT programmer tool via JTAG or a PROM-based master serial configuration setup.

What is the maximum operating frequency?

The XC2S200 can support internal clock frequencies up to 263 MHz depending on design complexity and timing constraints. The -6 speed grade offers the best timing performance in the Spartan-II family.

---

Summary: XC2S200-6FGG1240C at a Glance

---

The XC2S200-6FGG1240C remains a reliable choice for engineers maintaining legacy systems and field-deployed hardware. Its proven Spartan-II architecture, high I/O density in the FGG1240 package, and RoHS compliance make it a preferred part for sourcing in repair and sustaining engineering workflows.