The XC2S200-6FGG1238C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and a robust 2.5V architecture — all housed in a 1238-ball Fine-Pitch Ball Grid Array (FBGA) package. Whether you are designing communications equipment, industrial controllers, or embedded processing systems, the XC2S200-6FGG1238C offers the flexibility and performance your project demands.

For a broader overview of Xilinx programmable logic solutions, visit Xilinx FPGA.

What Is the XC2S200-6FGG1238C? – Spartan-II FPGA Overview

The XC2S200-6FGG1238C belongs to Xilinx’s Spartan-II FPGA family, one of the most widely deployed low-cost FPGA series in the industry. The part number breaks down as follows:

The -6 speed grade is the fastest available for the Spartan-II family and is exclusively offered in the commercial temperature range, making this part optimized for high-speed consumer and industrial electronics applications.

XC2S200-6FGG1238C Key Features

• 200,000 system gates with 5,292 configurable logic cells
• 28 × 42 CLB array — 1,176 total Configurable Logic Blocks (CLBs)
• 284 maximum user I/O pins (not including 4 global clock inputs)
• 75,264 bits of distributed RAM
• 56K bits of block RAM (two dedicated block RAM columns)
• Four Delay-Locked Loops (DLLs) — one at each corner of the die
• 0.18µm process technology for low power and high speed
• 2.5V core voltage operation
• 263 MHz system clock performance
• Multiple configuration modes: Master Serial, Slave Serial, Slave Parallel, Boundary Scan (JTAG)
• IEEE 1149.1 JTAG boundary scan support
• Pb-free (RoHS-compliant) packaging indicated by the “G” suffix in FGG

XC2S200-6FGG1238C Complete Technical Specifications

Core Logic Resources

Electrical Characteristics

Package Information

Spartan-II Family Comparison – Where Does the XC2S200 Fit?

The XC2S200 is the largest device in the Spartan-II family, offering the most logic resources, I/O pins, and memory for demanding designs.

The XC2S200 is the clear choice when maximum logic capacity and I/O density are required within the Spartan-II family.

XC2S200-6FGG1238C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1238C is its array of 1,176 Configurable Logic Blocks (CLBs). Each CLB contains Look-Up Tables (LUTs), flip-flops, and multiplexers that can be configured to implement virtually any combinational or sequential logic function. The 28×42 grid layout ensures efficient routing and minimal propagation delays.

Input/Output Blocks (IOBs)

Surrounding the CLB array, the Input/Output Blocks (IOBs) support a wide range of I/O standards. With 284 available user I/O pins (plus 4 dedicated global clock inputs), the XC2S200-6FGG1238C supports high pin-count designs and complex external interfaces including buses, memory interfaces, and communication links.

Block RAM

Two dedicated columns of Block RAM sit on opposite sides of the CLB array, delivering 56,320 bits of on-chip memory. Block RAM supports true dual-port access, making it ideal for FIFOs, look-up tables, and co-processor data buffers. With a configuration bit count of 1,335,840 bits, the XC2S200 supports complex and data-intensive designs.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs), positioned one at each corner of the die, provide advanced clocking capabilities. DLLs eliminate clock distribution skew, multiply or divide clock frequencies, and enable zero-delay buffering — critical for high-speed synchronous designs running near the 263 MHz maximum clock frequency.

Routing Architecture

The CLBs, IOBs, and block RAM are interconnected by a hierarchical routing matrix featuring local, direct, long-line, and global routing resources. This multi-tiered interconnect minimizes routing delays and supports complex designs with thousands of signal nets.

Configuration Modes for XC2S200-6FGG1238C

The XC2S200-6FGG1238C supports four configuration modes, allowing it to be programmed in a variety of system architectures:

During configuration, all I/O drivers are held in a high-impedance state, ensuring no bus contention with other devices on the board. After configuration, unused I/O pins remain in high-impedance unless otherwise assigned.

Applications for the XC2S200-6FGG1238C

Communications & Networking

The XC2S200-6FGG1238C is widely used in high-speed communications equipment, including network routers, protocol bridging, and data framing. Its 284 I/O pins and 263 MHz operation enable complex, high-throughput data-path implementations.

Industrial Automation & Control

In industrial control systems, this FPGA delivers precise digital control for motor drives, PLCs, process automation, and real-time sensor interfaces — all within a reprogrammable platform that adapts to changing requirements.

Medical Imaging & Diagnostics

The combination of high logic density, on-chip memory, and reliable 2.5V operation makes the XC2S200-6FGG1238C suitable for medical imaging systems, patient monitoring equipment, and diagnostic device signal processing.

Embedded Processing

With 56K bits of block RAM and 75,264 bits of distributed RAM, the device can host embedded soft processor cores (such as PicoBlaze) alongside custom peripheral logic, creating flexible system-on-chip (SoC) solutions.

Security & Surveillance

Applications requiring hardware-accelerated data processing — such as video analytics, biometric processing, and cryptographic engines — benefit from the XC2S200’s logic density and reconfigurability.

XC2S200-6FGG1238C vs. Similar Variants – Choosing the Right Part

The XC2S200-6FGG1238C stands out for its exceptionally high pin count (1,238 balls), making it the preferred choice in high I/O density applications where more than 456 package pins are required.

Ordering Information & Part Number Decoder

Xilinx Spartan-II devices follow a structured ordering system:

XC2S200  -6  FGG  1238  C
   |      |   |    |    |
   |      |   |    |    └─ Temperature: C = Commercial (0°C to +85°C)
   |      |   |    └────── Pin count: 1238 balls
   |      |   └─────────── Package: FGG = Fine-Pitch BGA, Pb-free (G = Pb-free)
   |      └─────────────── Speed grade: -6 (fastest)
   └────────────────────── Device: Spartan-II, 200K gates

The “G” in FGG confirms this is a Pb-free (lead-free), RoHS-compliant package option, suitable for designs targeting global environmental compliance standards.

Design Tools & Software Support

The XC2S200-6FGG1238C is supported by Xilinx (now AMD) design tools:

Note: The Spartan-II family predates Vivado’s full device support. ISE Design Suite (version 14.7) is the recommended tool for XC2S200 design and implementation.

Frequently Asked Questions (FAQ)

What is the maximum clock frequency of the XC2S200-6FGG1238C?

The XC2S200-6FGG1238C operates at up to 263 MHz system clock frequency at the -6 speed grade, the fastest available in the Spartan-II family.

Is the XC2S200-6FGG1238C RoHS compliant?

Yes. The “G” in the FGG package designator confirms this is a Pb-free, RoHS-compliant part.

What temperature range does the XC2S200-6FGG1238C support?

The “C” suffix denotes the commercial temperature range: 0°C to +85°C. Industrial (-40°C to +100°C) variants are available under different part numbers.

How many I/O pins does the XC2S200-6FGG1238C have?

The XC2S200 supports up to 284 user I/O pins (plus 4 dedicated global clock/user input pins). The 1238-ball package provides the physical connections for these I/Os along with power, ground, and configuration pins.

Can the XC2S200-6FGG1238C be used for new designs?

Xilinx classifies the Spartan-II family as Not Recommended for New Designs (NRND). For new projects, Xilinx recommends migrating to newer families such as Spartan-6, Spartan-7, Artix-7, or later. However, the XC2S200-6FGG1238C remains available for legacy design support and production continuity.

What configuration memory is required for the XC2S200-6FGG1238C?

The XC2S200 requires approximately 1,335,840 configuration bits. Compatible Xilinx Platform Flash PROMs (e.g., XCF series) or third-party SPI/parallel Flash devices are typically used.

Summary – Why Choose the XC2S200-6FGG1238C?

The XC2S200-6FGG1238C is the flagship device of the Xilinx Spartan-II FPGA family, combining the largest logic capacity in the series with the highest available speed grade and a high pin-count 1238-ball Pb-free package. Key takeaways:

For engineers maintaining legacy systems or deploying proven Xilinx FPGA technology in production, the XC2S200-6FGG1238C remains a dependable and capable choice.