The XC2S200-6FGG1237C is a high-performance field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates in a compact fine-pitch ball grid array (FBGA) package. Whether you’re working on embedded systems, telecommunications, industrial control, or digital signal processing, the XC2S200-6FGG1237C offers a powerful and flexible programmable logic solution.

For a broader selection of Xilinx programmable logic devices, visit Xilinx FPGA.

What Is the XC2S200-6FGG1237C? Overview & Part Number Breakdown

The XC2S200-6FGG1237C is part of Xilinx’s Spartan-II 2.5V FPGA family, which was engineered as a cost-effective alternative to mask-programmed ASICs. Understanding each segment of the part number helps engineers identify the exact device variant:

Note: The “-6” speed grade is exclusively available in the Commercial temperature range for Spartan-II devices.

XC2S200-6FGG1237C Key Technical Specifications

Core Logic Resources

XC2S200-6FGG1237C Architecture & Internal Design

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1237C features 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that can be configured to implement virtually any combinational or sequential logic function. This regular architecture enables efficient place-and-route and predictable timing performance.

Input/Output Blocks (IOBs) and I/O Flexibility

With up to 284 maximum user I/O pins, the device supports diverse interface standards, including LVCMOS, LVTTL, PCI, GTL, HSTL, and SSTL. Each IOB contains programmable input and output registers, pull-up/pull-down resistors, and optional slew-rate control — giving designers full flexibility in defining signal behavior.

Block RAM and Distributed RAM

The XC2S200-6FGG1237C provides:

• 75,264 bits of distributed RAM — implemented directly inside CLBs for fast, localized storage.
• 56K bits of dedicated block RAM — organized in two columns on opposite sides of the die, providing high-bandwidth data buffering for FIFOs, lookup tables, and data queues.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs), one at each corner of the die, allow the designer to eliminate clock distribution skew, multiply or divide clock frequencies, and phase-shift clocks. This is critical for synchronous designs demanding precise timing across large fan-out clock networks.

Spartan-II Family Comparison Table

The XC2S200 is the largest device in the Spartan-II family. The table below shows how it compares across the family:

The XC2S200-6FGG1237C is the top-tier member offering the most logic resources, I/O capacity, and embedded memory in the entire Spartan-II lineup.

Speed Grade Comparison for XC2S200

The XC2S200 is available in multiple speed grades. The -6 variant in the XC2S200-6FGG1237C is the fastest available:

The -6 speed grade is optimal for designs requiring the shortest propagation delays and highest clock frequencies within the Spartan-II family.

Package Information: FGG Fine-Pitch BGA

The FGG (Fine-Pitch Ball Grid Array) package of the XC2S200-6FGG1237C is a Pb-free, RoHS-compliant variant (denoted by the double “G” in the package code). Key package attributes:

The ball grid array configuration provides excellent electrical characteristics, superior thermal performance, and reliable solder connections — making it well-suited for high-density PCB designs.

Key Features of the XC2S200-6FGG1237C

#### High-Performance Programmable Logic

• 200K system gates with 5,292 logic cells for complex digital designs
• Operates at up to 263 MHz with -6 speed grade
• Four on-chip DLLs for zero-skew clock distribution and frequency synthesis

#### Abundant On-Chip Memory

• 75,264 bits of distributed RAM embedded within CLBs
• 56K bits of dedicated block RAM for high-bandwidth data buffering
• Ideal for implementing FIFOs, shift registers, and lookup tables

#### Flexible I/O Architecture

• Up to 284 user-configurable I/O pins
• Supports multiple I/O standards: LVCMOS, LVTTL, PCI, GTL, HSTL, SSTL
• Programmable slew rate, pull-up/pull-down, and drive strength on each I/O

#### JTAG Boundary Scan Support

• IEEE 1149.1-compliant JTAG interface for in-system programming and board-level testing
• Supports Boundary Scan Test (BST) for design verification and production test

#### ASIC Replacement Capability

• Field-upgradable logic — design changes deployed without hardware replacement
• Eliminates NRE (Non-Recurring Engineering) costs of custom ASICs
• Drastically shortens design cycles for time-to-market advantage

#### Pb-Free / RoHS-Compliant Packaging

• FGG package suffix indicates Pb-free solder balls
• Meets global environmental compliance standards (RoHS, WEEE)

XC2S200-6FGG1237C Applications

The XC2S200-6FGG1237C is deployed across a wide range of industries and applications:

Configuration and Programming

The XC2S200-6FGG1237C is a SRAM-based FPGA, meaning its configuration is stored in volatile SRAM cells and must be loaded on every power-up. Configuration methods include:

• Slave Parallel / Master Parallel — high-speed parallel configuration using an external memory device
• Slave Serial / Master Serial — simple serial bit-stream loading
• JTAG (Boundary Scan) — IEEE 1149.1-compliant in-system configuration via 4-wire JTAG interface
• SelectMAP — Xilinx proprietary high-speed parallel configuration interface

Configuration data is typically stored in an external Xilinx Platform Flash PROM (e.g., XCF series) or SPI/BPI flash memory device.

Design Tools & Software Support

The XC2S200-6FGG1237C is supported by Xilinx’s legacy design tool suite:

Note: Since the Spartan-II is a legacy family, the Xilinx ISE (not Vivado) is the appropriate toolchain. Ensure you are using ISE 14.7 or an equivalent archived version for compatibility.

Ordering Information & Part Number Structure

Spartan-II devices follow a structured ordering code:

XC2S200 - 6 - FGG - 1237 - C
   |      |    |      |     |
Device  Speed Pack  Pins  Temp
 Type   Grade Type  Count Range

• Device Type: XC2S200 (Spartan-II, 200K gates)
• Speed Grade: -6 (fastest commercial grade)
• Package: FGG (Fine-Pitch BGA, Pb-Free / RoHS)
• Pin Count: 1237
• Temperature: C (Commercial, 0°C to +85°C)

XC2S200-6FGG1237C vs. Alternative Devices

Frequently Asked Questions (FAQ)

Q: What is the XC2S200-6FGG1237C used for? It is used in digital logic design applications including telecommunications, industrial automation, embedded systems, and ASIC prototyping. Its high gate count and fast -6 speed grade make it suitable for timing-critical designs.

Q: Is the XC2S200-6FGG1237C still in production? The Spartan-II family has been declared end-of-life (EOL) by Xilinx/AMD. However, the part remains available through authorized distributors and component brokers for legacy design support and maintenance.

Q: What is the difference between FGG and FG packages? The double “G” suffix (FGG) indicates a Pb-free (lead-free) package variant that is RoHS compliant. The single “G” (FG) version uses standard tin-lead solder balls.

Q: What tools do I need to program the XC2S200-6FGG1237C? You will need Xilinx ISE Design Suite for design and implementation, and a JTAG-compatible programmer (e.g., Xilinx Platform Cable USB) along with iMPACT software for device configuration.

Q: Can the XC2S200-6FGG1237C be used in industrial temperature applications? No. The “C” suffix designates the Commercial temperature range (0°C to +85°C). For industrial temperature (-40°C to +85°C), the “I” suffix variant is required — note that the -6 speed grade is not available in the industrial range.

Summary

The XC2S200-6FGG1237C is the highest-capacity, fastest speed-grade member of the Xilinx Spartan-II FPGA family available in a Pb-free fine-pitch BGA package. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, 56K bits of block RAM, and four on-chip DLLs, it provides a robust programmable logic platform for complex digital designs. Its -6 speed grade enables operation at up to 263 MHz, making it ideal for high-performance commercial applications requiring fast, flexible, and reprogrammable logic.

Whether you are maintaining a legacy design or evaluating programmable alternatives to ASICs, the XC2S200-6FGG1237C remains a proven and capable device with extensive tooling and documentation support from Xilinx.