The XC2S200-6FGG1235C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a 1,235-ball Fine-Pitch BGA (FGG) package, this device is engineered for high-volume commercial applications that demand programmable logic at a competitive price point. Whether you’re designing embedded systems, digital signal processing boards, or rapid prototypes, the XC2S200-6FGG1235C delivers reliable performance in a Pb-free, compact form factor.

For engineers sourcing programmable logic solutions, explore the full range of Xilinx FPGA options available.

---

What Is the XC2S200-6FGG1235C? – Part Number Decoded

Understanding the part number is essential before purchasing or designing with this device.

Note: The “-6” speed grade is exclusively available in the Commercial temperature range. This makes the XC2S200-6FGG1235C ideal for controlled-environment applications.

---

XC2S200-6FGG1235C Key Specifications at a Glance

---

Spartan-II Family Comparison – Where Does the XC2S200 Fit?

The XC2S200 is the largest device in the Spartan-II family, offering the highest gate count and I/O capacity in the lineup.

The XC2S200 offers 12× more logic cells than the entry-level XC2S15, making it the go-to choice for complex, feature-rich designs within the Spartan-II generation.

---

Architecture & Internal Features of the XC2S200-6FGG1235C

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 CLBs arranged in a 28×42 array. Each CLB includes look-up tables (LUTs), flip-flops, and fast carry logic, enabling efficient implementation of arithmetic, counters, state machines, and custom logic.

Input/Output Blocks (IOBs)

With up to 284 user-configurable I/O pins, the XC2S200-6FGG1235C supports a wide range of interface standards. Each IOB can be independently configured for input, output, or bidirectional operation and supports programmable slew rate control.

Block RAM

The device features 56K bits of dedicated block RAM organized in two columns on opposite sides of the die. Block RAM supports true dual-port operation, making it suitable for FIFOs, data buffers, and lookup tables.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide advanced clock management, including clock deskew, frequency synthesis (×2, ÷1.5, ÷2, ÷4, ÷8, ÷16), and phase shifting. This eliminates clock distribution skew across the device.

Routing Architecture

The Spartan-II uses a hierarchical, versatile routing network that connects CLBs, IOBs, and block RAMs efficiently — minimizing routing delays and supporting high-performance, timing-critical designs.

---

Configuration Modes Supported

The XC2S200-6FGG1235C supports multiple configuration modes to suit different system architectures.

During power-on and throughout configuration, all I/O drivers are held in a high-impedance state, protecting downstream circuitry.

---

FGG1235 Package Details – Why the 1235-Ball BGA?

The FGG1235 package is a Fine-Pitch Ball Grid Array specifically designed for maximum I/O density in a compact PCB footprint. Key package characteristics:

The FGG package is ideal for space-constrained board designs where high I/O count and signal integrity are both critical.

---

XC2S200-6FGG1235C vs. Other XC2S200 Package Variants

The XC2S200 core is available in multiple packages. Here’s how the FGG1235 compares:

The FGG1235 package maximizes available I/O, offering 284 user I/O pins — significantly more than smaller package variants — while remaining compliant with RoHS/Pb-free requirements.

---

Top Applications for the XC2S200-6FGG1235C

The XC2S200-6FGG1235C is a versatile device suited for a broad range of industries and use cases:

#### Embedded Systems & SoC Prototyping

The combination of 5,292 logic cells and 284 I/O pins makes the XC2S200 an excellent platform for embedded processor implementations (such as PicoBlaze or MicroBlaze) and SoC prototyping.

#### Digital Signal Processing (DSP)

With fast CLBs, dedicated carry logic, and DLLs enabling precise clock management, the XC2S200 supports DSP functions including FIR/IIR filters, FFT engines, and data path arithmetic at up to 263 MHz.

#### Industrial Control & Automation

The commercial-grade device operates reliably from 0°C to +85°C, covering most industrial and automation environments. Its programmability allows field updates without hardware replacement — a major advantage over mask-programmed ASICs.

#### High-Speed Interface Bridging

With 284 I/Os and multiple configuration modes including Slave Parallel (8-bit), the XC2S200-6FGG1235C efficiently bridges between different bus protocols (PCI, SPI, I²C, UART, etc.).

#### Telecom & Networking Line Cards

The large I/O count combined with block RAM FIFOs and DLL-driven clocking makes this device well-suited for line card designs in telecom infrastructure equipment.

---

Why Choose the XC2S200-6FGG1235C Over a Mask-Programmed ASIC?

The XC2S200-6FGG1235C delivers ASIC-like performance without the upfront investment, lengthy development cycles, or risk inherent to custom silicon — making it the superior choice for most commercial design programs.

---

Development Tools & Software Support

Designing with the XC2S200-6FGG1235C is supported by Xilinx’s established toolchain:

The XC2S200 is part of the legacy Spartan-II family and is best supported in Xilinx ISE (not Vivado). Ensure your design environment uses ISE 14.7 or earlier for full device support.

---

Ordering & Availability Information

How to Verify Authenticity

When sourcing the XC2S200-6FGG1235C, always purchase from authorized distributors or reputable component brokers. Verify:

• Date code markings on the package
• Lot code traceability
• Pb-free marking (FGG suffix confirms Pb-free; standard FG suffix is non-Pb-free)

Lifecycle Status

The Spartan-II family has been declared Not Recommended for New Designs (NRND) by Xilinx/AMD. It remains available for legacy system maintenance and production continuity. For new designs, Xilinx recommends migrating to more recent families such as Spartan-6, Artix-7, or Spartan-7.

---

Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean in XC2S200-6FGG1235C?

The -6 speed grade is the fastest available for the Spartan-II family, enabling the highest system clock frequencies (up to 263 MHz) and lowest propagation delays. It is exclusively offered in the Commercial temperature range (0°C to +85°C).

Is the XC2S200-6FGG1235C RoHS compliant?

Yes. The “G” in FGG indicates a Pb-free (lead-free) package, making this part RoHS compliant. The standard (non-G) variant FG1235 is not Pb-free.

What is the difference between FGG and FG packages?

Both are Fine-Pitch BGA packages with identical pin counts and functionality. The FGG variant uses Pb-free solder balls, while the FG variant uses standard tin-lead solder. The FGG is required for RoHS-compliant manufacturing.

Can I use Vivado for XC2S200 designs?

No. Vivado does not support legacy Spartan-II devices. Use Xilinx ISE Design Suite (version 14.7 is the final release) for all XC2S200-based designs.

What are good alternatives to the XC2S200-6FGG1235C for new designs?

For new designs, consider migrating to:

• Xilinx Spartan-6 XC6SLX45 — more logic, lower power, modern toolchain
• Xilinx Artix-7 XC7A50T — significantly higher performance and I/O
• Xilinx Spartan-7 XC7S50 — cost-optimized with modern features

---

Summary

The XC2S200-6FGG1235C is the flagship device of Xilinx’s Spartan-II FPGA family — delivering 200,000 system gates, 5,292 logic cells, 284 user I/Os, and 56K bits of block RAM in a 1,235-ball Pb-free Fine-Pitch BGA package. With its -6 speed grade enabling operation up to 263 MHz, four onboard DLLs for advanced clock management, and full support for multiple configuration modes, it remains a capable solution for legacy system maintenance, high-volume embedded applications, and rapid prototyping.

For a comprehensive selection of programmable logic devices, visit Xilinx FPGA to explore alternatives and complementary solutions for your next design.