The XC2S200-6FGG1231C is a high-density, commercial-grade Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a 1231-ball Fine-Pitch BGA package, this device delivers robust programmable logic performance at 2.5V — making it a proven solution for embedded systems, industrial control, telecommunications, and digital signal processing applications.

Whether you’re sourcing a replacement component, evaluating legacy system support, or comparing Spartan-II variants, this guide covers everything you need: full technical specifications, package details, configuration modes, I/O capabilities, and application use cases for the XC2S200-6FGG1231C.

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What Is the XC2S200-6FGG1231C? – Part Number Breakdown

Understanding the Xilinx part numbering system helps engineers quickly identify the right component:

Note: The “G” in FGG denotes a RoHS-compliant, Pb-free package, distinguishing it from the standard FG variant.

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XC2S200-6FGG1231C Key Specifications

Core Logic Resources

Electrical & Timing Characteristics

Package Information

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Spartan-II Family Comparison – Where Does XC2S200 Stand?

The XC2S200 is the largest device in the Spartan-II family, offering the maximum logic resources available within this product line.

The XC2S200 provides more than 12× the gate count of the entry-level XC2S15, making it the preferred choice for complex, resource-intensive designs within the Spartan-II generation.

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XC2S200-6FGG1231C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II CLB architecture provides the core programmable logic fabric. Each CLB contains four logic cells, and every logic cell includes:

• A 4-input Look-Up Table (LUT) for combinatorial logic
• A D-type flip-flop for sequential logic
• Carry and control logic for arithmetic operations
• Support for distributed RAM (each CLB can implement 16-bit RAM)

The 28×42 CLB array in the XC2S200 results in 1,176 total CLBs, delivering maximum design flexibility for complex state machines, DSP functions, bus interfaces, and glue logic.

Block RAM

The XC2S200 incorporates 7 block RAM modules, each 8K bits in size, totaling 56K bits of dedicated on-chip memory. Block RAM supports:

• True dual-port operation
• Configurable aspect ratios (e.g., 256×4, 512×2, 1024×1, 128×8)
• Synchronous read/write operations
• Independent port clocks

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops are placed at each corner of the die. The DLLs provide:

• Clock edge alignment (zero clock skew)
• Frequency synthesis (2×, 1.5×, divide by integers)
• Phase shifting for timing closure
• Reduced clock distribution jitter

Input/Output Blocks (IOBs)

The XC2S200’s 284 user I/O pins are managed through configurable IOBs that support:

• Multiple I/O standards: LVTTL, LVCMOS2, LVCMOS18, PCI, GTL, GTL+, SSTL2, SSTL3, HSTL, CTT, AGP
• Programmable drive strength (2 mA to 24 mA)
• Optional internal pull-up or pull-down resistors
• Slew-rate control (Fast/Slow) to manage EMI

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Configuration Modes

The XC2S200-6FGG1231C supports four standard Xilinx configuration modes, selected via the M0, M1, M2 mode pins:

The total configuration bitstream size for the XC2S200 is 1,335,840 bits. Configuration data can be stored in external Xilinx Platform Flash PROMs, third-party serial/parallel flash, or loaded by a host processor.

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XC2S200-6FGG1231C vs. Other XC2S200 Package Options

Xilinx offered the XC2S200 in multiple package variants. The FGG1231 is the highest pin-count package, ideal for designs requiring maximum I/O density or full signal access.

The -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C) and represents the fastest timing performance within the Spartan-II XC2S200 lineup.

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Key Features Summary

• ✅ 200,000 system gates — the largest Spartan-II device
• ✅ 5,292 logic cells in a 28×42 CLB array
• ✅ 284 maximum user I/Os supporting multi-standard I/O
• ✅ 56K bits block RAM (7 dual-port blocks)
• ✅ 75,264 bits distributed RAM
• ✅ 4 on-chip DLLs for clock management and zero-skew distribution
• ✅ -6 speed grade — fastest commercial Spartan-II
• ✅ 1231-ball FGG package — maximum I/O access in a fine-pitch BGA
• ✅ Pb-free / RoHS compliant (FGG suffix)
• ✅ 2.5V core operation, multi-voltage I/O (1.5V–3.3V)
• ✅ 0.18 µm CMOS process
• ✅ JTAG (IEEE 1149.1) Boundary-Scan support

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Typical Applications for the XC2S200-6FGG1231C

The XC2S200-6FGG1231C is well suited for a broad range of embedded and system-level applications:

 Digital Communications & Networking

• Gigabit Ethernet MAC/PHY interface logic
• Serial-to-parallel data conversion
• Protocol bridging (PCI, USB, I²C, SPI, UART)
• Line card logic in telecom switching equipment

 Industrial Automation & Control

• Motor control and encoder interface logic
• Sensor fusion and real-time data acquisition
• Safety-critical state machine implementation
• SCADA system interface controllers

 Video & Image Processing

• Pixel pipeline logic and frame buffers
• Synchronization and timing generation for displays
• Pattern recognition pre-processing
• Video format conversion logic

 Military & Aerospace (Legacy Systems)

• Radiation-tolerant design evaluation (consult Xilinx for hardened variants)
• Avionics bus interface (MIL-STD-1553, ARINC 429)
• Mission computer co-processing

 Medical Equipment

• Signal conditioning and filtering for biosensors
• Real-time patient monitoring system logic
• Equipment control state machines

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Design Tools & Software Support

The XC2S200-6FGG1231C is supported by Xilinx ISE Design Suite (the legacy toolchain for Spartan-II devices). Vivado does not support Spartan-II; ISE is required.

Important: Xilinx ISE 14.7 is the last version supporting legacy devices including Spartan-II. It runs on Windows 7/10 (with compatibility settings) and Linux.

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Ordering Information & Part Number Decoding

When sourcing the XC2S200-6FGG1231C, ensure the exact part number is matched — every field specifies a unique combination of density, speed, package, and compliance.

For a wider range of Xilinx programmable devices and verified compatible alternatives, visit our complete guide to Xilinx FPGA solutions.

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Frequently Asked Questions (FAQ)

Q: What is the difference between XC2S200-6FGG1231C and XC2S200-6FGG456C?

Both parts use the same XC2S200 die with identical logic resources and speed grade. The key difference is the package pin count: the FGG1231 offers 1,231 balls versus 456 in the FGG456, providing access to more signal pins — useful for designs requiring maximum I/O routing flexibility, even though the XC2S200 itself has only 284 user I/Os.

Q: Is the XC2S200-6FGG1231C still in production?

The Spartan-II family has been placed in Not Recommended for New Design (NRND) status by AMD/Xilinx. It is available primarily through authorized distributors’ existing stock and the secondary market. Engineers designing new systems are encouraged to evaluate newer Xilinx/AMD families.

 Q: What replaces the XC2S200-6FGG1231C in new designs?

AMD/Xilinx Artix-7 (XC7A) and Spartan-7 (XC7S) families offer significantly higher performance, lower power, and more resources. For a direct density step-up with Vivado support, consider the XC7S25 or XC7A25T as starting points.

Q: What configuration PROM is compatible with the XC2S200?

Xilinx XCF Platform Flash PROMs (e.g., XCF01S, XCF02S, XCF04S) are the recommended configuration storage devices. The 1,335,840-bit bitstream requires at least a 2Mbit PROM (XCF02S).

Q: Does the XC2S200-6FGG1231C support partial reconfiguration?

No. Partial reconfiguration is not supported in the Spartan-II architecture. Full device reconfiguration is required for any design updates.

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Summary

The XC2S200-6FGG1231C remains a capable and well-documented FPGA for legacy system maintenance and retrofit applications. With its 200K system gates, 284 user I/Os, 56K bits of block RAM, and four on-chip DLLs — all packaged in a Pb-free 1231-ball FGG BGA — it represents the peak of the Spartan-II product line. The -6 speed grade ensures maximum timing performance within the commercial temperature range, while full JTAG boundary-scan support simplifies board-level testing and in-system programming.

For engineers sourcing, qualifying, or designing with this component, ensure your supply chain provides fully traceable, authenticated parts from reputable distributors to mitigate counterfeit risk on legacy FPGA components.