Meta Description: Buy XC2S200-6FGG1229C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, 2.5V, 1229-pin FGG BGA package. Explore full specs, pinout, applications, and pricing.

The XC2S200-6FGG1229C is a high-density field programmable gate array (FPGA) from Xilinx’s Spartan-II family, offering 200,000 system gates, 5,292 configurable logic cells, and a large 1229-pin Fine-Pitch BGA (FGG) package. Designed for commercial-grade applications operating at a –6 speed grade, this device delivers the flexibility, performance, and cost-efficiency that engineers demand for high-volume production designs.

Whether you are building telecommunications systems, embedded processing boards, or industrial control platforms, the XC2S200-6FGG1229C provides a proven, programmable alternative to mask-programmed ASICs — without the upfront tooling costs or rigid design constraints.

What Is the XC2S200-6FGG1229C? Understanding the Part Number

Before diving into specifications, it helps to decode the part number:

Note: The “G” in “FGG” indicates a Pb-free (lead-free) RoHS-compliant package, distinguishing it from the standard FG variant.

XC2S200-6FGG1229C Key Specifications at a Glance

Core Logic Resources

Electrical & Performance Specifications

Package Information

XC2S200-6FGG1229C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1229C is built around a regular, flexible grid of Configurable Logic Blocks (CLBs). Each CLB contains two slices, and each slice includes two 4-input look-up tables (LUTs), two flip-flops, and dedicated carry logic. This architecture enables efficient implementation of both combinational and sequential digital logic.

Input/Output Blocks (IOBs)

Surrounding the CLB core is a full perimeter of programmable Input/Output Blocks (IOBs). These support a wide range of single-ended and differential I/O standards, giving designers flexibility for board-level interfacing across mixed-voltage systems.

Block RAM

Two vertical columns of dedicated Block RAM sit between the CLBs and IOBs on opposite sides of the die. The XC2S200 provides 56K bits of total block RAM, suitable for FIFOs, lookup tables, and small memory arrays embedded directly within the FPGA fabric.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide clock management, phase shifting, and frequency synthesis. DLLs are essential for reducing clock skew across large designs and for matching clock edges to off-chip references.

Spartan-II Family Comparison: Where Does XC2S200 Fit?

The XC2S200 is the largest member of the Spartan-II family. The table below shows how it compares to its siblings:

The XC2S200-6FGG1229C’s 1229-pin BGA package provides the highest available I/O count, making it ideal for bus-intensive designs that need to connect to multiple external peripherals simultaneously.

Speed Grade Comparison for XC2S200

The –6 speed grade is the fastest commercial option for the XC2S200 and is exclusively available in the commercial temperature range:

Supported I/O Standards

The XC2S200-6FGG1229C supports a broad range of I/O voltage and signaling standards:

Typical Applications for XC2S200-6FGG1229C

The XC2S200-6FGG1229C is a versatile solution across multiple industries and use cases:

#### Telecommunications & Networking

• Line card logic and framing
• Protocol bridging (SONET, SDH)
• Packet processing pipelines

#### Industrial Automation

• Motor drive control logic
• Real-time sensor interfacing
• Machine vision front-end processing

#### Embedded Systems & SoC Prototyping

• Processor peripheral expansion
• Custom bus controllers
• Rapid ASIC prototyping before tape-out

#### Consumer Electronics

• Set-top box logic
• Digital display controllers
• Audio/video processing

#### Defense & Aerospace

• Signal processing front-ends
• Custom interface controllers
• Legacy system re-hosting

Configuration & Programming

The XC2S200-6FGG1229C supports SRAM-based configuration, meaning the device is programmed on every power-up via an external configuration source. Supported modes include:

• Master Serial – Uses an external Xilinx PROM
• Slave Serial – Daisy-chain multiple FPGAs
• Slave Parallel (SelectMAP) – High-speed byte-wide configuration
• JTAG – IEEE 1149.1 boundary scan and in-circuit configuration

Compatible configuration PROMs include the XCF family (Platform Flash) from Xilinx. The Xilinx ISE Design Suite (version 14.x) is the primary toolchain for synthesis, implementation, and bitstream generation targeting Spartan-II devices.

Why Choose XC2S200-6FGG1229C Over an ASIC?

For high-volume applications where production volumes justify the gate density and the –6 speed grade eliminates timing margins as a concern, the XC2S200-6FGG1229C remains a competitive, battle-tested solution.

Ordering Information & Part Marking

When ordering Spartan-II devices, understanding the naming convention helps ensure you receive the exact variant required:

XC2S200  -  6  -  FGG  -  1229  -  C
   |         |     |        |       |
Device    Speed  Pkg Type  Pins   Temp

• XC2S200 – 200K gate Spartan-II
• -6 – Speed grade 6 (commercial, fastest)
• FGG – Fine-Pitch BGA, Pb-Free
• 1229 – 1,229-pin count
• C – Commercial temperature (0°C to +85°C)

Frequently Asked Questions About XC2S200-6FGG1229C

What is the difference between FG and FGG packages?

The “FGG” package designation indicates a Pb-free (lead-free) BGA option, in compliance with RoHS regulations. The “FG” (without the second G) uses standard tin-lead solder balls. Both are functionally identical in terms of logic resources and pinout.

Is the XC2S200-6FGG1229C still in production?

The Spartan-II family has been classified as Not Recommended for New Design (NRND) by Xilinx (now AMD). However, it remains available through authorized distributors and component brokers for legacy system maintenance and long-lifecycle programs.

What design tools support the XC2S200?

The Xilinx ISE Design Suite 14.7 is the primary supported toolchain. HDL design entry in VHDL or Verilog, followed by synthesis with XST and implementation with the ISE place-and-route tools, is the standard workflow.

Can I replace XC2S200-6FGG1229C with a newer Xilinx device?

Migration paths exist to the Spartan-3 family (XC3S devices), which offer higher density, lower power, and a more modern process node. However, a re-design and re-routing effort is required due to package and architectural differences.

Where to Buy XC2S200-6FGG1229C

For sourcing genuine, quality-assured Xilinx FPGA components including the XC2S200-6FGG1229C, always purchase from reputable distributors or certified component specialists who can provide traceability documentation and anti-counterfeit verification.

When purchasing, request:

• Certificate of Conformance (CoC)
• Date code and lot traceability
• Anti-counterfeit test reports (especially for military/industrial applications)

Summary: XC2S200-6FGG1229C at a Glance

This product description is intended for engineers, procurement specialists, and electronics designers evaluating the XC2S200-6FGG1229C for new or legacy applications. Always verify specifications against the official Xilinx DS001 datasheet prior to design commitment.