Meta Description: The XC2S200-6FGG1220C is a high-performance Xilinx Spartan-II FPGA featuring 200,000 system gates, 5,292 logic cells, and a 1220-ball Pb-free BGA package. Learn full specs, features, and applications.
What Is the XC2S200-6FGG1220C?
The XC2S200-6FGG1220C is a field-programmable gate array (FPGA) manufactured by Xilinx, belonging to the Spartan-II family. This device delivers 200,000 system gates, 5,292 configurable logic cells, and is housed in a 1220-ball Fine-Pitch BGA (FGG1220) Pb-free package. It operates at a commercial temperature range and comes with a -6 speed grade — the fastest available in the Spartan-II lineup. Designers who need a cost-efficient yet powerful programmable logic device for mid-complexity applications will find the XC2S200-6FGG1220C to be a strong candidate.
For a broader selection of compatible devices, visit Xilinx FPGA to explore more options in this family.
XC2S200-6FGG1220C: Key Ordering Information Decoded
Understanding the part number helps you quickly confirm you have the right component.
| Part Number Segment |
Meaning |
| XC2S200 |
Xilinx Spartan-II, 200K system gates |
| -6 |
Speed grade -6 (fastest, commercial only) |
| FGG |
Fine-Pitch Ball Grid Array, Pb-free (lead-free) |
| 1220 |
1220 solder balls |
| C |
Commercial temperature range (0°C to +85°C) |
Note: The “G” in FGG denotes Pb-free (RoHS-compliant) packaging. This distinguishes it from earlier FG-marked variants.
XC2S200-6FGG1220C Full Technical Specifications
Core Logic Resources
| Parameter |
Value |
| Device Family |
Xilinx Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O Pins |
284 |
| Distributed RAM (bits) |
75,264 |
| Block RAM (bits) |
56K (56,000 bits) |
| Delay-Locked Loops (DLLs) |
4 |
Electrical & Performance Specifications
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Supply Voltage (VCCO) |
1.5V – 3.3V |
| Speed Grade |
-6 (fastest in family) |
| System Performance |
Up to 200 MHz |
| Technology Node |
0.18µm |
| Temperature Range |
Commercial: 0°C to +85°C |
Package Specifications
| Parameter |
Value |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Package Code |
FGG1220 |
| Total Ball Count |
1,220 |
| Pb-Free |
Yes (RoHS Compliant) |
| Marking |
XC2S200 FGG1220 -6C |
XC2S200-6FGG1220C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1220C uses a 28-column by 42-row CLB array, delivering 1,176 total CLBs. Each CLB contains four slices, and every slice includes two 4-input Look-Up Tables (LUTs) and two flip-flops. This structure enables flexible implementation of both combinational and sequential logic.
Block RAM
The device includes 56K bits of dual-port block RAM. This on-chip memory supports read and write operations simultaneously at full system clock speed. It is ideal for FIFOs, shift registers, and lookup tables in embedded applications.
Delay-Locked Loops (DLLs)
Four DLLs are placed at each corner of the die. These DLLs eliminate clock distribution delays and support clock multiplication and division. As a result, the XC2S200-6FGG1220C achieves precise timing across all logic paths.
Input/Output Blocks (IOBs)
The IOBs support multiple industry-standard I/O interfaces, including:
- LVTTL – Low-Voltage TTL
- LVCMOS2 – Low-Voltage CMOS (2.5V)
- LVCMOS18 – Low-Voltage CMOS (1.8V)
- GTL / GTL+ – Gunning Transceiver Logic
- HSTL – High-Speed Transceiver Logic
- SSTL2 / SSTL3 – Stub Series Terminated Logic
XC2S200-6FGG1220C vs. Other XC2S200 Package Variants
The XC2S200 die is available in multiple package options. The FGG1220 is the largest package offering the highest pin count, making it the best choice for designs requiring maximum I/O access.
| Part Number |
Package |
Ball/Pin Count |
I/O Pins |
Pb-Free |
| XC2S200-6PQ208C |
PQFP |
208 |
146 |
No |
| XC2S200-6FG256C |
FBGA |
256 |
178 |
No |
| XC2S200-6FGG256C |
FBGA |
256 |
178 |
Yes |
| XC2S200-6FG456C |
FBGA |
456 |
284 |
No |
| XC2S200-6FGG1220C |
FBGA |
1,220 |
284 |
Yes |
The XC2S200-6FGG1220C shares the same silicon as other XC2S200 variants. The larger 1220-ball footprint offers superior PCB routing flexibility and thermal dissipation.
Why Choose the XC2S200-6FGG1220C?
#### Speed Grade -6: The Highest Performance Option
The -6 speed grade is exclusively available in the commercial temperature range. It is the fastest speed grade in the Spartan-II family. Engineers who need to meet tight timing constraints in their digital systems should specifically target this variant.
#### Pb-Free Packaging for RoHS Compliance
The “G” suffix in FGG1220 confirms lead-free construction. This is increasingly important as global regulations mandate RoHS compliance in electronic manufacturing and export.
#### Large Pin Count for High-Density Designs
With 1,220 solder balls, the FGG1220 package provides maximum PCB connectivity. It suits complex system designs where routing flexibility and signal integrity are critical.
#### Cost-Effective Alternative to Custom ASICs
Like all Spartan-II devices, the XC2S200-6FGG1220C avoids the high NRE (Non-Recurring Engineering) costs associated with mask-programmed ASICs. Furthermore, in-field reprogrammability means design updates do not require hardware replacement.
Typical Applications of the XC2S200-6FGG1220C
The XC2S200-6FGG1220C is well-suited for a wide range of embedded and industrial applications:
| Application Area |
Use Case |
| Digital Signal Processing (DSP) |
FIR/IIR filters, FFT engines |
| Communications |
Protocol bridging, serializer/deserializer logic |
| Industrial Automation |
Motor control, PLC logic replacement |
| Test & Measurement |
Signal capture, pattern generation |
| Embedded Systems |
Custom coprocessors, glue logic |
| Aerospace & Defense |
Radiation-tolerant design prototyping |
Programming and Development Tools
#### Xilinx ISE Design Suite
The XC2S200-6FGG1220C is fully supported by the Xilinx ISE Design Suite, which includes synthesis, implementation, and simulation tools. ISE supports VHDL and Verilog HDL inputs.
#### Configuration Methods
The device supports several standard configuration modes:
- Master Serial – Using a Xilinx serial PROM
- Slave Serial – Driven by an external controller
- Slave Parallel (SelectMAP) – For faster configuration
- JTAG (Boundary Scan) – For debugging and in-system programming
#### JTAG Boundary Scan
IEEE 1149.1-compliant JTAG is built into every XC2S200-6FGG1220C device. This feature simplifies board-level testing and allows in-system verification of pin connectivity.
XC2S200-6FGG1220C: Frequently Asked Questions
#### What is the difference between FG1220 and FGG1220?
The extra “G” in FGG1220 indicates a Pb-free (lead-free) package. The FG1220 variant uses standard tin-lead solder balls, while FGG1220 is RoHS compliant with lead-free solder.
#### Is the -6 speed grade available in industrial temperature?
No. According to the official Spartan-II datasheet, the -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C). Industrial temperature variants are limited to -4 and -5 speed grades.
#### Can the XC2S200-6FGG1220C replace other XC2S200 package variants?
The XC2S200-6FGG1220C uses identical silicon to all other XC2S200 variants. Therefore, the same FPGA bitstream works across package types. However, PCB footprints are not interchangeable between packages.
#### What supply voltage does the XC2S200-6FGG1220C require?
The core logic (VCCINT) requires 2.5V. The I/O voltage (VCCO) is flexible and can range from 1.5V to 3.3V, depending on the I/O standard selected.
Summary: XC2S200-6FGG1220C at a Glance
| Feature |
Detail |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Max User I/O |
284 |
| Block RAM |
56K bits |
| Speed Grade |
-6 (fastest, commercial) |
| Package |
FGG1220 (1220-ball FBGA, Pb-free) |
| Core Voltage |
2.5V |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliant |
Yes |
The XC2S200-6FGG1220C is a proven, high-performance FPGA choice for designers who require the maximum speed grade, RoHS-compliant packaging, and a high pin-count BGA footprint in the Spartan-II family. Its combination of 200,000 system gates, flexible I/O, on-chip block RAM, and four DLLs makes it a versatile solution for both legacy system maintenance and new mid-complexity digital designs.
