The XC2S200-6FGG1219C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, the XC2S200-6FGG1219C delivers 200,000 system gates, 5,292 logic cells, and the fastest commercial speed grade (-6) — all housed in a lead-free 1219-ball Fine Pitch BGA (FBGA) package. Engineers seeking a reliable, reprogrammable alternative to mask-programmed ASICs will find this device an outstanding choice for digital systems requiring compact, dense I/O connectivity.

For a broader overview of Xilinx programmable logic solutions, visit Xilinx FPGA.

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What Is the XC2S200-6FGG1219C?

The XC2S200-6FGG1219C belongs to Xilinx’s Spartan-II product line — a family engineered with 0.18µm, eight-layer metal CMOS process technology. Operating from a 2.5V core supply, it is optimized for applications that demand a balance between logic density, speed, and cost efficiency. The “C” suffix confirms commercial temperature operation (0°C to +85°C), making it ideal for consumer, communications, and industrial control environments that do not require extended temperature ranges.

Decoding the XC2S200-6FGG1219C Part Number

Understanding the part number helps engineers select the right variant for their design:

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XC2S200-6FGG1219C Key Specifications

The following table summarizes the core electrical and logic specifications of the XC2S200-6FGG1219C:

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XC2S200-6FGG1219C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1219C is organized around a 28×42 array of Configurable Logic Blocks. Each CLB contains four logic cells, and every logic cell includes a 4-input function generator (LUT), a carry chain, and a storage element. This architecture delivers efficient logic utilization across a wide range of digital design applications, from finite state machines to DSP pipelines.

Block RAM and Distributed RAM

One of the defining strengths of the XC2S200-6FGG1219C is its dual-port memory infrastructure:

• Distributed RAM: 75,264 bits implemented across the CLB array, suitable for small FIFOs and lookup tables.
• Block RAM: 56K bits organized in dedicated memory blocks along the edges of the die, ideal for larger data buffers and packet storage.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1219C includes four on-chip Delay-Locked Loops — one at each corner of the die. DLLs eliminate clock distribution skew, enable clock domain crossing, and support clock multiplication and division, simplifying timing closure in high-speed designs.

I/O Block (IOB) Features

The device supports a multivolt I/O interface, enabling the XC2S200-6FGG1219C to interface seamlessly with 2.5V, 3.3V, and other logic families. Each IOB supports programmable slew rate control, optional pull-up/pull-down resistors, and input delay compensation.

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XC2S200-6FGG1219C Package: 1219-Ball Fine Pitch BGA

Why Choose the FGG1219 Package?

The FGG1219 package — a 1,219-ball Fine Pitch Ball Grid Array — is the largest and most I/O-dense package available for the XC2S200 die. It is the preferred choice for designs requiring:

• High pin density on compact PCB real estate
• Lead-free (Pb-free) compliance for RoHS-regulated markets
• Reliable solder joint integrity thanks to BGA mounting technology

FGG1219 Package Comparison vs. Other XC2S200 Packages

The FGG1219 package maximizes routing flexibility on complex, multilayer PCBs, while the Pb-free designation ensures compliance with modern environmental standards.

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Applications of the XC2S200-6FGG1219C

The XC2S200-6FGG1219C is a versatile solution deployed across numerous industries:

Communications & Networking

• Ethernet switches and routers
• Protocol bridging and packet processing
• Wireless base station control logic

Industrial Automation

• Motor drive control systems
• PLC coprocessor logic
• Sensor interface and data aggregation

Consumer Electronics

• Set-top box signal processing
• Display controller logic
• Audio/video protocol conversion

Medical & Test Equipment

• High-speed data acquisition
• Diagnostic instrument control
• Real-time signal conditioning

Automotive Electronics

• Infotainment system control
• ADAS sensor interface logic
• CAN/LIN bus protocol processing

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XC2S200-6FGG1219C vs. Other Spartan-II Devices

The XC2S200-6FGG1219C represents the highest density device in the Spartan-II family, giving designers the most resources within this proven architecture.

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Why Choose the XC2S200-6FGG1219C Over an ASIC?

• Zero NRE costs: No non-recurring engineering fees compared to custom ASIC tape-outs.
• Rapid time-to-market: Program and deploy in days rather than the months required for ASIC fabrication.
• Field upgradability: Update device functionality in-system without hardware replacement — impossible with fixed-function ASICs.
• Reduced design risk: Validate your design in real silicon before committing to production volumes.

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Programming and Design Tools for XC2S200-6FGG1219C

Xilinx’s ISE Design Suite (formerly the primary toolchain for Spartan-II devices) supports full synthesis, place-and-route, and bitstream generation for the XC2S200-6FGG1219C. Designers can also use VHDL or Verilog HDL for logic description, with JTAG-based in-circuit configuration supported via the onboard JTAG boundary-scan chain.

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Ordering and Availability

When sourcing the XC2S200-6FGG1219C, always verify:

1. Authenticity — Purchase from authorized or traceable distributors to avoid counterfeit ICs.
2. Pb-free compliance — The “G” in FGG1219 confirms RoHS-compliant, lead-free solder balls.
3. Speed grade — The -6 speed grade is exclusively available in the commercial temperature range; it is not offered in the industrial (-40°C to +100°C) variant.
4. Date code and lot traceability — Critical for production quality assurance.

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Frequently Asked Questions About XC2S200-6FGG1219C

Q: What is the core voltage of the XC2S200-6FGG1219C? A: The device operates from a 2.5V core supply (VCCINT). I/O banks (VCCO) support multiple voltages including 3.3V, 2.5V, and lower levels for mixed-voltage interfacing.

Q: Is the XC2S200-6FGG1219C RoHS compliant? A: Yes. The “G” character in the FGG package designator confirms that the XC2S200-6FGG1219C uses lead-free (Pb-free) solder balls, making it RoHS compliant.

Q: Can the XC2S200-6FGG1219C be reconfigured in the field? A: Yes. Like all Spartan-II FPGAs, the XC2S200-6FGG1219C is fully reconfigurable via JTAG or a configuration PROM, enabling firmware updates without hardware replacement.

Q: What is the maximum operating frequency of the XC2S200-6FGG1219C? A: The -6 speed grade supports internal clock frequencies up to 263 MHz with the on-chip DLL, making it among the fastest devices in the Spartan-II lineup.

Q: How does the FGG1219 package differ from the FGG456 package? A: Both packages are lead-free (Pb-free) BGA formats. The FGG1219 offers 1,219 solder balls vs. 456 on the FGG456, providing greater PCB routing flexibility and more ground/power planes for improved signal integrity on dense boards.