Meta Description: The XC2S200-6FGG1218C is a high-performance Xilinx Spartan-II FPGA featuring 200,000 system gates, 5,292 logic cells, speed grade -6, and a 1218-ball Pb-free FGG BGA package. Learn full specs, features, and applications here.

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The XC2S200-6FGG1218C is a field-programmable gate array (FPGA) from the Xilinx Spartan-II family — one of the most widely adopted programmable logic platforms in embedded design history. Built on a cost-effective 0.18-micron process technology and operating at a core voltage of 2.5V, the XC2S200-6FGG1218C delivers 200,000 system gates, 5,292 logic cells, and comes in a 1218-ball Pb-free Fine-Pitch Ball Grid Array (FGG BGA) package. Designed for commercial-temperature applications, this device is ideal for engineers who need powerful, reconfigurable logic in a robust, industry-standard format.

Whether you are developing telecommunications systems, industrial controllers, or digital signal processing solutions, the XC2S200-6FGG1218C offers the density, speed, and I/O flexibility required to meet demanding design requirements. For a broader overview of compatible programmable devices, visit Xilinx FPGA.

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XC2S200-6FGG1218C Key Specifications at a Glance

The table below summarizes the core technical parameters of the XC2S200-6FGG1218C. These values are drawn directly from the official Xilinx Spartan-II datasheet (DS001).

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What Does the XC2S200-6FGG1218C Part Number Mean?

Understanding the part number helps engineers quickly identify the device’s key attributes. The XC2S200-6FGG1218C follows Xilinx’s standard naming convention for the Spartan-II series.

Part Number Breakdown

Note: The double “G” in “FGG” denotes a lead-free (Pb-free) package variant, in compliance with RoHS environmental standards. This distinguishes it from the standard FG designation.

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XC2S200-6FGG1218C Core Architecture and Features

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1218C contains 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two storage elements. These storage elements can be configured as either D-type flip-flops or level-sensitive latches, giving designers substantial flexibility in implementing sequential logic.

The CLB structure is derived directly from the Xilinx Virtex architecture, making the Spartan-II an excellent entry point for designers familiar with higher-density Xilinx devices. Furthermore, each LUT can also serve as a 16-bit distributed RAM element, enabling efficient on-chip storage close to the logic.

SelectRAM™ Hierarchical Memory

One of the most valuable features of the XC2S200-6FGG1218C is its hierarchical memory system, branded by Xilinx as SelectRAM™. This includes:

Block RAM in the Spartan-II is organized in 4K-bit configurable blocks, placed in two columns on opposite sides of the die. These blocks support synchronous read/write operations and can be configured as single-port or simple dual-port memories, making them well-suited for buffering, look-up tables, and data flow control.

Input/Output Blocks (IOBs) and I/O Standards

The XC2S200-6FGG1218C supports up to 284 user-configurable I/O pins and is compatible with 16 selectable I/O standards. Each Input/Output Block (IOB) includes three storage registers — one for data input, one for data output, and one for the output enable — all sharing a common clock and set/reset signal. This multi-register structure ensures clean, reliable interfacing with external devices.

Supported I/O Standards

This I/O versatility makes the XC2S200-6FGG1218C suitable for interfacing with a wide range of memory devices, processors, and communication peripherals.

Four Delay-Locked Loops (DLLs)

The XC2S200-6FGG1218C integrates four Delay-Locked Loops, one at each corner of the die. DLLs serve several critical functions in digital design:

• Clock deskew: Eliminate clock distribution delays between the input pin and internal clock networks
• Clock multiplication and division: Generate derivative clock frequencies without external PLLs
• Phase shifting: Shift clock phase by fixed increments for precise timing control

Each DLL can drive any of the four global clock networks, enabling the XC2S200-6FGG1218C to distribute clean, low-skew clocks across the entire device fabric.

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Speed Grade -6: Performance Specifications

The -6 speed grade is the fastest speed grade available in the Spartan-II family and is exclusively offered in the commercial temperature range. This makes the XC2S200-6FGG1218C the highest-performance variant of the XC2S200 device.

XC2S200 Speed Grade Comparison

The -6 designation ensures that the XC2S200-6FGG1218C meets tight timing budgets in clock-sensitive applications. System performance of up to 200 MHz is achievable, depending on design complexity and implementation.

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FGG1218 Package Details

The FGG1218 package is a 1218-ball Fine-Pitch Ball Grid Array (FBGA) with lead-free (Pb-free) solder balls. This large package format maximizes pin availability, which is particularly valuable for high-I/O applications where signal routing density is critical.

Package Specifications

The large ball count of the FGG1218 package accommodates the full 284-pin user I/O capacity of the XC2S200 die, plus power, ground, and configuration pins, with generous spacing for reliable PCB assembly.

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Configuration Modes

The XC2S200-6FGG1218C supports multiple configuration modes, enabling flexible system integration across a variety of production environments. Configuration data is loaded from an external source at power-up and stored in internal SRAM-based configuration cells.

Supported Configuration Modes

The configuration file size for the XC2S200-6FGG1218C is 1,335,840 bits. In Master Serial mode, the FPGA uses an internal oscillator to generate the configuration clock (CCLK), with selectable frequencies ranging from 4 MHz to 60 MHz.

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Typical Applications of the XC2S200-6FGG1218C

Thanks to its combination of density, speed, and I/O flexibility, the XC2S200-6FGG1218C is deployed across a wide range of industries and application types.

Industries and Use Cases

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Development Tools for XC2S200-6FGG1218C

The XC2S200-6FGG1218C is fully supported by the Xilinx ISE (Integrated Software Environment) design suite. ISE provides a complete FPGA design flow including:

• RTL Design Entry via VHDL or Verilog
• Synthesis and Optimization with XST (Xilinx Synthesis Technology)
• Automatic Place & Route for timing closure
• Simulation via ModelSim or ISim
• Bitstream Generation and Programming via iMPACT or JTAG

Important: Newer Xilinx design tools such as Vivado do not support the Spartan-II family. Engineers should use Xilinx ISE 14.7 — the final ISE release — which remains available for legacy Spartan-II development on Windows and Linux platforms.

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XC2S200-6FGG1218C vs. Other XC2S200 Package Variants

The XC2S200 die is available in multiple package configurations. The FGG1218 is the largest, offering the highest pin density for maximum I/O connectivity.

Package Comparison Table

The XC2S200-6FGG1218C provides the same 284-pin maximum user I/O as the 456-ball variant, but in a larger footprint that may offer mechanical or routing advantages on certain PCB designs.

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Why Choose the XC2S200-6FGG1218C?

The XC2S200-6FGG1218C stands out in the Spartan-II lineup for several reasons:

• Maximum speed: The -6 speed grade delivers the best timing performance available in the XC2S200 family
• Full I/O utilization: Up to 284 user I/Os enable complex multi-bus designs
• Pb-free compliance: The FGG package satisfies RoHS environmental requirements
• Hierarchical memory: SelectRAM™ architecture combines fast distributed RAM with bulk block RAM
• Robust clocking: Four DLLs provide clock deskew, multiplication, and phase shifting
• Proven platform: The Spartan-II architecture has been deployed in millions of units globally
• Unlimited reprogrammability: SRAM-based configuration allows iterative prototyping and field updates

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Frequently Asked Questions About XC2S200-6FGG1218C

What is the core voltage of the XC2S200-6FGG1218C?

The XC2S200-6FGG1218C operates with a core voltage of 2.5V. I/O voltage levels depend on the selected I/O standard, supporting a range from below 1.8V to 3.3V.

Is the XC2S200-6FGG1218C RoHS compliant?

Yes. The “FGG” designation in the part number confirms this is a lead-free (Pb-free) package, making it compliant with RoHS (Restriction of Hazardous Substances) directives.

What temperature range does the XC2S200-6FGG1218C support?

The suffix “C” indicates a commercial temperature range of 0°C to +85°C. Industrial-range (-40°C to +85°C) variants of the XC2S200 are designated with the suffix “I” but are not available in the -6 speed grade.

What configuration tool should I use for the XC2S200-6FGG1218C?

Use Xilinx ISE 14.7 for all design and configuration tasks. This is the last version of ISE and provides full support for the Spartan-II family. Configuration can be performed using Xilinx’s iMPACT programmer via JTAG or a serial PROM.

Can the XC2S200-6FGG1218C be used in automotive applications?

The commercial-temperature “C” suffix limits operation to 0°C to +85°C, which may not meet automotive qualification requirements. For automotive applications, consult the Xilinx automotive device catalog for appropriately qualified alternatives.

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Summary

The XC2S200-6FGG1218C is a high-performance, fully reconfigurable FPGA that combines the proven Spartan-II architecture with the maximum available speed grade and a large-format, Pb-free 1218-ball BGA package. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, hierarchical SelectRAM™ memory, and four Delay-Locked Loops, it delivers the logic density and performance required by demanding embedded, industrial, and communications designs. Supported by Xilinx ISE and fully compliant with RoHS environmental standards, the XC2S200-6FGG1218C remains a reliable choice for engineers working with legacy Spartan-II platforms or seeking a proven, cost-effective FPGA solution.