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Buy the XC2S200-6FGG1216C — Xilinx Spartan-II FPGA with 200K gates, 1216-ball BGA, -6 speed grade. Full specs, pinout, and pricing guide inside.

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What Is the XC2S200-6FGG1216C?

The XC2S200-6FGG1216C is a high-performance Field-Programmable Gate Array (FPGA) manufactured by Xilinx, part of the well-established Spartan-II product family. This device delivers 200,000 system gates, 5,292 logic cells, and comes housed in a 1,216-ball Fine-Pitch Ball Grid Array (FBGA) package. The “-6” speed grade is the fastest available in the commercial temperature range, making the XC2S200-6FGG1216C an ideal choice for demanding digital logic applications.

Engineers and procurement specialists searching for a cost-effective, programmable alternative to mask-programmed ASICs consistently turn to the XC2S200-6FGG1216C. It supports in-field design upgrades without hardware replacement — a key advantage over traditional ASICs. Browse a wide selection of Xilinx FPGA devices to find the right part for your project.

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XC2S200-6FGG1216C Key Features at a Glance

• 200,000 System Gates with 5,292 configurable logic cells
• -6 Speed Grade — the fastest commercial-temperature option in the Spartan-II lineup
• 1,216-Ball Fine-Pitch BGA (FGG1216) package — optimized for high-density PCB designs
• 2.5V Core Voltage with 0.18 µm CMOS process technology
• 284 Maximum User I/O Pins for broad connectivity
• 75,264 bits of Distributed RAM and 56 Kb of Block RAM
• 4 Delay-Locked Loops (DLLs) for precise clock management
• Commercial temperature range (0°C to +85°C)
• RoHS-compliant (Pb-free) packaging available with “G” in the ordering code (FGG)

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XC2S200-6FGG1216C Full Technical Specifications

Core Logic Resources

Speed and Electrical Characteristics

Package Information

Ordering Code Breakdown

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XC2S200-6FGG1216C vs. Other Spartan-II Family Members

Understanding where the XC2S200-6FGG1216C sits within the Spartan-II family helps engineers make the right selection for their design.

The XC2S200-6FGG1216C is the largest and most capable device in the Spartan-II family. It offers the most logic cells, the highest I/O count, and the largest block RAM capacity.

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Why Choose the XC2S200-6FGG1216C?

Superior Programmability Over ASICs

The XC2S200-6FGG1216C eliminates the high NRE costs, long development cycles, and mask risk associated with traditional ASICs. Because the device is fully reprogrammable, design revisions can be deployed in the field without swapping hardware. This capability significantly reduces time-to-market for complex digital systems.

High-Density 1,216-Ball BGA Package

The FGG1216 package is specifically suited for system designs that demand a large pin count in a compact footprint. With 1,216 solder balls, this package supports routing-heavy board designs where many simultaneous I/O connections are required.

Fastest Commercial Speed Grade

The -6 speed grade delivers the highest performance within the Spartan-II commercial range. It supports system clock frequencies up to 263 MHz, making it suitable for high-throughput signal processing, communications interfaces, and real-time control systems.

Reliable Clock Management with 4 DLLs

The XC2S200-6FGG1216C includes four on-chip Delay-Locked Loops placed at the corners of the die. These DLLs enable zero-delay clock buffering, clock multiplication and division, and phase shifting — critical features for synchronous digital systems.

Wide I/O Standard Support

This device supports a broad range of I/O standards, including LVCMOS, LVTTL, PCI, GTL+, HSTL, and SSTL. This flexibility lets designers interface the XC2S200-6FGG1216C with a wide variety of external components and buses without level-shifting hardware.

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Typical Applications for the XC2S200-6FGG1216C

The XC2S200-6FGG1216C is well suited to a wide range of embedded and industrial applications:

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XC2S200-6FGG1216C I/O and Pin Configuration

I/O Block (IOB) Capabilities

Each I/O block in the XC2S200-6FGG1216C supports the following features:

• Programmable input delay to eliminate setup time requirements
• Individually programmable drive strength and slew rate
• Optional pull-up, pull-down, or keeper resistors
• Support for 3.3 V, 2.5 V, 1.8 V, and 1.5 V signaling standards

Global Clock Pins

The XC2S200-6FGG1216C provides four dedicated global clock/user input pins, separate from the 284 user I/O count. These pins feed the global routing network directly, ensuring low-skew clock distribution across the entire fabric.

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XC2S200-6FGG1216C Logic Architecture

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG1216C contains four logic cells, each with:

• A 4-input Look-Up Table (LUT) for combinatorial logic
• A D-type flip-flop for sequential logic
• Fast carry logic for efficient arithmetic

The 28 × 42 CLB array of the XC2S200 provides 1,176 total CLBs, yielding 5,292 logic cells — the maximum available in the Spartan-II family.

Block RAM

The XC2S200-6FGG1216C contains 56 Kb of dual-port block RAM organized in two columns on opposite sides of the die. Each block RAM can be configured as:

• 16K × 1 bit
• 8K × 2 bits
• 4K × 4 bits
• 2K × 8 bits (with parity)
• 1K × 16 bits (with parity)

This flexibility makes the on-chip memory useful for FIFOs, lookup tables, buffers, and small embedded memory arrays.

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Programming and Design Tools for the XC2S200-6FGG1216C

Supported EDA Tool Flows

The XC2S200-6FGG1216C is supported by the following Xilinx (now AMD) design environments:

Configuration Interfaces

The XC2S200-6FGG1216C supports multiple configuration modes:

• Master Serial (using Xilinx PROMs such as XCF01S)
• Slave Serial
• Master Parallel (SelectMAP)
• Slave Parallel (SelectMAP)
• JTAG (IEEE 1149.1) for boundary scan and in-circuit programming

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Power Consumption and Thermal Considerations

The XC2S200-6FGG1216C operates from a 2.5 V core supply. I/O banks support mixed voltages. Key power parameters to consider during thermal design:

For high-frequency designs using the -6 speed grade, ensure adequate PCB copper pours and consider thermal vias beneath the BGA package to manage junction temperature effectively.

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Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1216C?

The -6 speed grade indicates that this is the fastest performance tier available for the XC2S200 in the commercial temperature range. A lower number means faster timing — so -6 is faster than -5. The -6 grade is exclusively available for commercial-temperature devices (suffix “C”).

What is the FGG1216 package?

FGG1216 refers to a Fine-Pitch Ball Grid Array with 1,216 solder balls. The second “G” in “FGG” indicates the package is Pb-free (RoHS compliant). The 1216-ball count provides a significantly higher I/O capacity than smaller BGA options like FGG456 or FGG256.

Is the XC2S200-6FGG1216C still in production?

The Spartan-II family, including the XC2S200-6FGG1216C, is classified as Not Recommended for New Designs (NRND) by AMD/Xilinx. However, it remains available through authorized distributors and the secondary market to support legacy designs and ongoing production requirements.

Can I replace the XC2S200-6FGG1216C with a Spartan-3 device?

Migration to Spartan-3 or Spartan-6 is possible but requires design re-evaluation. The Spartan-3 family offers improved performance, lower power, and more resources. However, pin-for-pin drop-in replacement is not available due to different package footprints and logic architectures.

What configuration PROM is compatible with the XC2S200-6FGG1216C?

Xilinx XCF-series PROMs (e.g., XCF01S, XCF02S) are the recommended configuration storage devices for the Spartan-II family in Master Serial mode.

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Summary: XC2S200-6FGG1216C at a Glance

The XC2S200-6FGG1216C remains a trusted component for legacy system maintenance, industrial applications, and any design where proven Spartan-II architecture is required. Its combination of abundant logic resources, fast clock speeds, robust I/O flexibility, and a large-pin-count BGA package makes it one of the most capable members of the Spartan-II lineup.