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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1215C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

Meta Description: Buy XC2S200-6FGG1215C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, 1215-ball Pb-free FBGA package. Full specs, pinout, and applications inside.


The XC2S200-6FGG1215C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a robust 1215-ball Fine-Pitch Ball Grid Array (FBGA) Pb-free package, this component is engineered for demanding digital design applications. Whether you are working in telecommunications, industrial automation, or embedded systems, the XC2S200-6FGG1215C delivers exceptional logic density, flexible I/O support, and reliable commercial-grade performance — all backed by Xilinx’s proven 0.18µm process technology.

For a broader selection of compatible devices, explore the full range of Xilinx FPGA solutions available today.


What Is the XC2S200-6FGG1215C? A Complete Product Overview

The XC2S200-6FGG1215C belongs to the Xilinx Spartan-II FPGA family, a six-member product line spanning densities from 15,000 to 200,000 system gates. The XC2S200 sits at the top of this family, making it the most capable device in the series. The “-6” suffix indicates the fastest available commercial speed grade, while “FGG1215” identifies the 1215-ball Pb-free Fine-Pitch BGA package. The trailing “C” confirms its Commercial temperature range (0°C to +85°C).

As a programmable logic device, it offers engineers the flexibility to implement complex digital logic without the high non-recurring engineering (NRE) costs or long lead times associated with mask-programmed ASICs. Furthermore, its in-field reconfigurability makes it ideal for designs that require iterative updates post-deployment.


XC2S200-6FGG1215C Key Specifications at a Glance

General Device Specifications

Parameter Value
Manufacturer Xilinx (AMD)
Product Family Spartan-II
Part Number XC2S200-6FGG1215C
Number of Logic Cells 5,292
System Gates 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O Pins 284
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Delay-Locked Loops (DLLs) 4
Configuration Bits 1,335,840
Process Technology 0.18µm
Core Voltage 2.5V
Speed Grade -6 (Fastest Commercial)
Temperature Range Commercial (0°C to +85°C)
Package Type FGG1215 – 1215-Ball Pb-Free Fine-Pitch BGA
RoHS Compliance Pb-Free (Pb-Free “G” suffix)

XC2S200-6FGG1215C Memory Resources

Memory Type Capacity
Total Block RAM 56,000 bits (56K)
Total Distributed RAM 75,264 bits
Combined On-Chip RAM 131,264 bits

Spartan-II Family Comparison – Where XC2S200 Ranks

Device Logic Cells System Gates CLB Array Total CLBs Max I/O Dist. RAM (bits) Block RAM
XC2S15 432 15,000 8 × 12 96 86 6,144 16K
XC2S30 972 30,000 12 × 18 216 92 13,824 24K
XC2S50 1,728 50,000 16 × 24 384 176 24,576 32K
XC2S100 2,700 100,000 20 × 30 600 176 38,400 40K
XC2S150 3,888 150,000 24 × 36 864 260 55,296 48K
XC2S200 5,292 200,000 28 × 42 1,176 284 75,264 56K

The XC2S200-6FGG1215C clearly stands at the apex of the Spartan-II lineup, offering the highest logic density, the largest distributed and block RAM, and the most available user I/O pins in the family.


XC2S200-6FGG1215C Architecture and Internal Structure

Configurable Logic Blocks (CLBs)

The core of the XC2S200-6FGG1215C is its 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling highly flexible digital logic implementation. This structured CLB grid supports fast and predictable interconnect routing, ensuring that successive design iterations consistently meet timing requirements.

Block RAM and Distributed RAM

The XC2S200-6FGG1215C provides two complementary on-chip memory architectures:

  • Block RAM (56K bits): Dedicated dual-port memory blocks positioned in two vertical columns on opposite sides of the die. These are ideal for buffering, FIFOs, and lookup tables requiring high-bandwidth access.
  • Distributed RAM (75,264 bits): Implemented within the CLB fabric itself, this memory is ideal for small, fast data storage distributed throughout the logic array.

Delay-Locked Loops (DLLs)

Four dedicated Delay-Locked Loops (DLLs) — one at each corner of the die — eliminate clock skew and enable precise clock edge alignment. They also support clock frequency synthesis and phase shifting, which is critical for high-speed synchronous designs.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1215C supports up to 284 user I/O pins, each backed by a flexible IOB that supports 16 selectable I/O standards, including:

  • LVTTL
  • LVCMOS (1.8V, 2.5V, 3.3V)
  • PCI (3.3V, 66 MHz)
  • GTL / GTL+
  • HSTL (Class I, III, IV)
  • SSTL (2 and 3, Class I and II)

XC2S200-6FGG1215C Package Information – FGG1215 Explained

Decoding the Part Number

Code Meaning
XC Xilinx Commercial Device
2S200 Spartan-II, 200K Gates
-6 Speed Grade -6 (Fastest, Commercial Only)
FGG Fine-Pitch Ball Grid Array, Pb-Free
1215 1215 Solder Balls
C Commercial Temperature Range (0°C to +85°C)

Why the FGG1215 Package?

The 1215-ball Pb-free Fine-Pitch BGA package is the largest package available for the XC2S200. It offers maximum pin accessibility and is especially well-suited for applications where board-level integration requires extensive I/O routing and high pin density. The Pb-free “GG” designation confirms compliance with RoHS environmental standards, making it suitable for designs sold in the European Union and other regulated markets.


XC2S200-6FGG1215C Configuration Modes

The XC2S200-6FGG1215C supports four standard configuration modes, offering design flexibility for different system architectures.

Configuration Mode Pre-Config Pull-ups M[2:0] CCLK Direction Data Width Serial DOUT
Master Serial No 000 Output 1-bit Yes
Slave Parallel Yes 010 Input 8-bit No
Boundary-Scan (JTAG) Yes 100 N/A 1-bit No
Slave Serial Yes 110 Input 1-bit Yes

During power-on and throughout the configuration process, all I/O drivers enter a high-impedance state, protecting downstream circuitry until the FPGA is fully configured.


Top Applications for the XC2S200-6FGG1215C

The XC2S200-6FGG1215C is a versatile device suitable for a wide range of professional and industrial applications. Its high gate count, generous I/O, and commercial speed grade make it particularly effective in the following areas:

Telecommunications and Networking

The device handles high-speed data processing and complex signal manipulation with ease. It is commonly deployed in network routers, communication protocol implementation, and high-speed serial data links.

Industrial Automation and Motor Control

In factory automation environments, the XC2S200-6FGG1215C enables precise digital control of motor drives, PLCs, and process automation systems. Its deterministic timing and rugged design make it reliable for 24/7 industrial operation.

Embedded Systems and Digital Signal Processing

Engineers use the XC2S200-6FGG1215C to implement custom DSP pipelines, image processing engines, and embedded CPU cores using HDL designs or soft-processor IP cores.

Medical Imaging and Diagnostic Equipment

The combination of on-chip RAM, deterministic I/O timing, and reconfigurability makes this FPGA well-suited for medical imaging devices, patient monitoring systems, and diagnostic tools where accuracy is critical.

Security and Surveillance Systems

High data-throughput requirements in biometric identification, encryption engines, and surveillance video processing are well-matched to the XC2S200-6FGG1215C’s logic density and I/O capabilities.


XC2S200-6FGG1215C Advantages Over Mask-Programmed ASICs

One of the core value propositions of the XC2S200-6FGG1215C is its role as a cost-effective and flexible alternative to traditional ASICs. Key advantages include:

Feature XC2S200-6FGG1215C (FPGA) Traditional ASIC
NRE (Non-Recurring Engineering) Cost None Very High ($500K+)
Time to Market Days to Weeks Months to Years
In-Field Reconfigurability Yes No
Design Risk Low High
Minimum Order Quantity 1 Unit Often 10,000+
Prototype Iteration Speed Fast Slow

The XC2S200-6FGG1215C is therefore an excellent choice for low-volume production runs, prototyping, and any application requiring future design flexibility.


Development Tools and Software Support

Xilinx ISE Design Suite

The XC2S200-6FGG1215C is supported by the Xilinx ISE Design Suite, the primary development environment for Spartan-II devices. ISE provides:

  • HDL synthesis (VHDL, Verilog)
  • Place-and-Route (PAR)
  • Timing analysis and simulation
  • JTAG programming via iMPACT

Note: Because the XC2S200 is a legacy device, it is not supported by Vivado Design Suite. Designers should use ISE version 14.7, the final release that supports Spartan-II.

Supported Programming Languages

Language Support Level
VHDL Full
Verilog Full
ABEL Limited
Schematic Entry Supported via ISE

XC2S200-6FGG1215C vs. Common Alternatives

Part Number Gates Speed Grade Package Pb-Free I/O Pins
XC2S200-6FGG1215C 200K -6 FGG1215 Yes 284
XC2S200-6FGG456C 200K -6 FGG456 Yes 284
XC2S200-6FG256C 200K -6 FG256 No 176
XC2S200-5FGG456C 200K -5 FGG456 Yes 284
XC2S150-6FGG456C 150K -6 FGG456 Yes 260

The FGG1215 package uniquely provides the highest pin count and is the Pb-free variant of the largest available Spartan-II package, making the XC2S200-6FGG1215C the premium configuration within the XC2S200 lineup.


Frequently Asked Questions About the XC2S200-6FGG1215C

What does the “-6” speed grade mean?

The -6 speed grade is the fastest commercially available speed grade for the Spartan-II family. It is exclusively available in the Commercial temperature range (0°C to +85°C). A lower number in Xilinx speed grades indicates faster performance.

Is the XC2S200-6FGG1215C RoHS compliant?

Yes. The double-“G” suffix in “FGG1215” denotes a Pb-free (lead-free) package, meaning the device is RoHS compliant and suitable for environmentally regulated markets.

What is the core voltage of the XC2S200-6FGG1215C?

The device operates on a 2.5V core voltage, consistent across the entire Spartan-II family. I/O voltages are configurable per bank through selectable I/O standards.

Can the XC2S200-6FGG1215C be used for new designs today?

While Xilinx classifies the Spartan-II family as Not Recommended for New Designs (NRND), it remains widely available on the secondary market for maintenance, legacy system repair, and production continuity purposes.

What configuration interface does the XC2S200-6FGG1215C support?

It supports Master Serial, Slave Serial, Slave Parallel (SelectMAP), and JTAG (Boundary-Scan) configuration modes, offering broad compatibility with external configuration controllers and PROM devices.


Conclusion: Is the XC2S200-6FGG1215C Right for Your Project?

The XC2S200-6FGG1215C is a powerful, proven Xilinx Spartan-II FPGA that delivers the family’s maximum logic density, fastest commercial speed grade, and a large-ball-count Pb-free package. It excels in legacy system maintenance, high-I/O embedded applications, and any design that benefits from the extensive on-chip RAM and flexible I/O standards offered by the Spartan-II platform.

If you are sourcing this device or exploring compatible alternatives, be sure to verify specifications against Xilinx datasheet DS001 and confirm availability from a trusted distributor to ensure authentic, quality-guaranteed components.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.