Meta Description: The XC2S200-6FGG1214C is a high-performance Xilinx Spartan-II FPGA with 200,000 system gates, 5,292 logic cells, and a 1,214-ball Pb-free FBGA package. Get full specs, pinout, and pricing here.

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The XC2S200-6FGG1214C is a field-programmable gate array (FPGA) from Xilinx’s (now AMD) Spartan-II family. It delivers 200,000 system gates, 5,292 configurable logic cells, and comes in a robust 1,214-ball Fine-Pitch Ball Grid Array (FBGA) Pb-free package — making it one of the most capable members of the Spartan-II series. Whether you are designing for telecommunications, industrial automation, or consumer electronics, the XC2S200-6FGG1214C provides exceptional performance at a competitive price point.

Looking for compatible Xilinx FPGA components and PCB solutions? Visit PCBSync for expert resources.

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What Is the XC2S200-6FGG1214C?

The XC2S200-6FGG1214C is a member of the Xilinx Spartan-II FPGA family, manufactured using advanced 0.18 µm process technology. It operates on a 2.5V core voltage and is rated for commercial temperature range (0°C to +85°C). The “-6” speed grade denotes the fastest available speed grade in the Spartan-II commercial lineup, while the “FGG1214” suffix identifies the 1,214-ball Fine-Pitch BGA package with the double “G” confirming it is RoHS-compliant (Pb-free).

This device is ideal for engineers who need dense I/O capability, embedded memory, and high-speed clock management in a single, cost-effective FPGA.

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XC2S200-6FGG1214C Key Specifications at a Glance

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XC2S200-6FGG1214C: Detailed Technical Overview

Logic Architecture and CLB Structure

The XC2S200-6FGG1214C features a 28 × 42 Configurable Logic Block (CLB) array, totalling 1,176 CLBs. Each CLB contains four logic cells, which include Look-Up Tables (LUTs), flip-flops, and carry logic. This architecture gives designers the flexibility to implement both combinatorial and registered logic efficiently.

The 5,292 logic cells allow complex designs — including DSP pipelines, state machines, and multi-channel serial interfaces — to be fully realized on a single chip. This is a key advantage over smaller Spartan-II variants and makes the XC2S200-6FGG1214C the largest device in the Spartan-II family.

On-Chip Memory Resources

The XC2S200-6FGG1214C provides two distinct types of embedded memory:

Block RAM is organized into independent, synchronous dual-port modules positioned on opposite sides of the die. These are ideal for FIFO buffers, look-up tables, and data-path memory in high-speed designs.

I/O Capabilities and Supported Standards

The XC2S200-6FGG1214C supports up to 284 user I/O pins (excluding the four global clock/user input pins). Its I/O blocks (IOBs) support a wide range of single-ended and differential I/O standards, including:

This broad I/O compatibility makes the XC2S200-6FGG1214C an excellent interface bridge between mixed-voltage systems.

Clock Management: Delay-Locked Loops (DLLs)

The XC2S200-6FGG1214C integrates four Delay-Locked Loops (DLLs), one at each corner of the die. These DLLs offer:

• Zero-delay clock buffering for board-level clock distribution
• Clock frequency synthesis (multiply/divide)
• Phase shifting for timing margin optimization
• Duty-cycle correction

This robust clock management system is critical for designs that require tight timing closure, such as DDR interfaces, high-speed serial links, and synchronous multi-board systems.

Configuration Modes

The XC2S200-6FGG1214C supports multiple industry-standard configuration modes, allowing flexible deployment options:

Configuration can be performed using standard Xilinx Platform Flash PROMs, SPI Flash memories, or via JTAG for in-system programming — a key advantage for field upgrades.

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FGG1214 Package Details: Why It Matters

The FGG1214 package suffix in XC2S200-6FGG1214C breaks down as follows:

The large 1,214-ball package provides the highest pin count available for the XC2S200 device, enabling access to the full complement of 284 user I/O pins plus power, ground, and configuration pins. This makes it the preferred package choice for high pin-count system designs that demand maximum connectivity.

The Pb-free (RoHS) construction also ensures compliance with European Union WEEE/RoHS directives and is suitable for modern PCB assembly processes using lead-free solder alloys.

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XC2S200-6FGG1214C vs. Other XC2S200 Package Variants

The XC2S200-6FGG1214C clearly stands out with the largest ball count, maximizing I/O availability for complex, high-density board designs.

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Spartan-II Family Comparison: Where the XC2S200 Sits

As the table shows, the XC2S200 is the top-tier device in the Spartan-II family, offering the most logic resources, the highest I/O count, and the greatest memory capacity across the entire lineup.

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Typical Applications of the XC2S200-6FGG1214C

The XC2S200-6FGG1214C excels in a broad range of application domains. Its combination of dense logic, embedded memory, DLLs, and extensive I/O support makes it a natural fit for the following use cases:

Telecommunications & Networking

• Packet processing and protocol bridging
• Multi-channel serial interfaces (UART, SPI, I2C)
• Line card and switching fabric implementations

Industrial Automation

• Motor control and PID feedback loops
• PLC replacement with custom logic
• Sensor data aggregation and processing

Digital Signal Processing (DSP)

• FIR/IIR filter implementations
• FFT pipelines
• Image and video pre-processing

Embedded Systems & SoC Design

• Custom processor pipelines (e.g., MicroBlaze soft-core implementations)
• Co-processing with host CPUs
• Interface bridging (PCI, DDR)

Test & Measurement Equipment

• Pattern generation and logic analysis
• High-speed data capture
• Protocol emulation

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Why Choose the XC2S200-6FGG1214C Over an ASIC?

The XC2S200-6FGG1214C offers compelling advantages over fixed-function ASICs:

For low-to-medium volume production and designs requiring iterative updates, the XC2S200-6FGG1214C is clearly the superior choice.

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Design Tools & Software Support

The XC2S200-6FGG1214C is supported by the following Xilinx/AMD design tools:

Xilinx ISE Design Suite

The ISE (Integrated Software Environment) is the primary toolchain for Spartan-II devices. It provides:

• HDL synthesis (VHDL, Verilog)
• Implementation (map, place, and route)
• Timing analysis and simulation
• Bitstream generation and JTAG programming

Third-Party EDA Tools

The XC2S200-6FGG1214C is also compatible with major third-party synthesis tools, including Synopsys Synplify and Mentor Graphics Precision RTL.

Note: The XC2S200-6FGG1214C is not supported in Xilinx Vivado, which targets newer 7-Series and beyond devices. Always use ISE 14.7 for Spartan-II development.

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Ordering Information: Decoding the XC2S200-6FGG1214C Part Number

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Absolute Maximum Ratings

⚠️ Operating beyond these limits may cause permanent damage to the device.

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1214C used for?

The XC2S200-6FGG1214C is used in telecommunications, industrial automation, digital signal processing, and embedded systems design. Its large I/O count and dense logic make it suitable for complex, high-bandwidth applications.

Is the XC2S200-6FGG1214C RoHS compliant?

Yes. The double “GG” in the part number confirms that the XC2S200-6FGG1214C is packaged in a Pb-free (lead-free), RoHS-compliant FBGA package.

What is the maximum operating frequency of the XC2S200-6FGG1214C?

The XC2S200-6FGG1214C supports system performance up to 263 MHz with the -6 speed grade, which is the fastest commercial speed grade in the Spartan-II series.

Can I program the XC2S200-6FGG1214C in the field?

Yes. The device supports JTAG in-system programming and can be reconfigured via Master Serial, Slave Serial, or Slave Parallel modes — enabling field updates without hardware replacement.

What design software should I use for the XC2S200-6FGG1214C?

Use Xilinx ISE Design Suite (version 14.7) for Spartan-II device support. Vivado does not support the Spartan-II family.

What is the difference between FGG1214C and FGG456C?

The main difference is the package size and ball count. The FGG1214C has 1,214 solder balls, providing more routing and power/ground connections. Both are Pb-free and commercial temperature grade. The FGG1214C is preferred for designs requiring maximum I/O density.

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Summary: Is the XC2S200-6FGG1214C Right for Your Design?

The XC2S200-6FGG1214C represents the pinnacle of the Xilinx Spartan-II family. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, embedded block RAM, and four on-chip DLLs — all in a Pb-free 1,214-ball FBGA package — it delivers a compelling combination of performance, density, and compliance for a wide range of applications.

Its -6 speed grade guarantees operation up to 263 MHz, making it one of the fastest options in the Spartan-II lineup. Furthermore, its RoHS-compliant packaging ensures it meets modern environmental standards for global markets.

If you are sourcing the XC2S200-6FGG1214C or exploring compatible Xilinx FPGA solutions, ensure you verify the full part number — including the “GG” Pb-free suffix — to guarantee compliance with your BOM and manufacturing requirements.