The XC2S200-6FGG1213C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. This device offers 200,000 system gates, 5,292 logic cells, and a -6 speed grade — all housed in a 1,213-ball Fine-Pitch Ball Grid Array (FBGA) Pb-free package. Whether you are an engineer sourcing components or a designer evaluating FPGA solutions, the XC2S200-6FGG1213C delivers a compelling blend of logic density, speed, and I/O flexibility at a competitive price point.
What Is the XC2S200-6FGG1213C?
The XC2S200-6FGG1213C is a member of the Xilinx Spartan-II FPGA product family, manufactured on a 0.18-micron, six-layer metal CMOS process. Xilinx designed the Spartan-II series as a cost-optimized alternative to mask-programmed ASICs, giving designers the freedom to reprogram logic in the field without hardware replacement. The XC2S200-6FGG1213C sits at the top of the Spartan-II lineup with the largest gate count, making it the preferred choice for I/O-intensive and logic-heavy designs.
For a broader overview of the Spartan-II product line and related devices, visit the Xilinx FPGA resource page.
XC2S200-6FGG1213C Part Number Breakdown
Understanding the part number helps engineers quickly decode the device’s key attributes:
| Code Segment |
Meaning |
| XC2S200 |
Spartan-II family, 200,000 system gates |
| -6 |
Speed grade (-6 is the fastest commercial grade) |
| FGG |
Fine-Pitch Ball Grid Array, Pb-free (lead-free) package |
| 1213 |
1,213 total solder balls |
| C |
Commercial temperature range (0°C to +85°C) |
Key Takeaway: The “G” suffix in “FGG” confirms this is a RoHS-compliant, lead-free package — a critical detail for compliance-driven industries.
XC2S200-6FGG1213C Key Specifications
General Device Parameters
| Parameter |
Value |
| Manufacturer |
Xilinx (now AMD) |
| Family |
Spartan-II |
| Part Number |
XC2S200-6FGG1213C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Process Technology |
0.18 µm CMOS, 6-layer metal |
| Core Voltage (VCCINT) |
2.5V |
| Speed Grade |
-6 (fastest available) |
| Temperature Range |
Commercial: 0°C to +85°C |
Memory Resources
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56,000 bits (56K) |
| Configuration Bits |
1,335,840 bits |
| Block RAM Columns |
2 (one on each side of the die) |
I/O and Clocking
| Parameter |
Value |
| Maximum User I/O Pins |
284 |
| Global Clock Inputs |
4 dedicated pins |
| Delay-Locked Loops (DLLs) |
4 (one per corner) |
| Max System Performance |
Up to 200 MHz |
| Max Clock Frequency |
263 MHz |
Package Information
| Parameter |
Value |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Package Code |
FGG1213 |
| Total Ball Count |
1,213 |
| Lead-Free (Pb-free) |
Yes (RoHS Compliant) |
| Mounting Type |
Surface Mount |
XC2S200-6FGG1213C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1213C contains 1,176 CLBs arranged in a 28-column by 42-row grid. Each CLB includes:
- Four Look-Up Tables (LUTs) — each implementing any 4-input logic function
- Four storage elements — usable as edge-triggered flip-flops or level-sensitive latches
- Fast carry and arithmetic logic for high-speed addition and subtraction
- Wide function multiplexers for combining logic signals efficiently
This architecture gives the XC2S200-6FGG1213C exceptional flexibility in implementing both combinatorial and sequential digital designs.
Block RAM
Two columns of Block RAM are placed on opposite sides of the die. Each Block RAM module can be configured as a 4K × 4-bit, 2K × 8-bit, or 1K × 16-bit synchronous RAM. Consequently, the XC2S200-6FGG1213C supports a total of 56K bits of on-chip block memory, ideal for FIFOs, dual-port buffers, and lookup tables.
Delay-Locked Loops (DLLs)
The four on-chip DLLs allow engineers to:
- Eliminate clock distribution delay (zero-delay buffering)
- Multiply or divide the clock frequency
- Generate precisely phase-shifted clocks for high-speed interfaces
Input/Output Blocks (IOBs)
Each IOB supports a wide range of single-ended and differential I/O standards, including LVTTL, LVCMOS, PCI, SSTL, and GTL+. The 284 available user I/O pins on the XC2S200-6FGG1213C make it particularly well-suited for multi-bus or high-channel-count designs.
XC2S200-6FGG1213C Configuration Modes
The XC2S200-6FGG1213C supports four configuration modes, enabling integration with a range of external memory and controller devices:
| Configuration Mode |
CCLK Direction |
Data Width |
DOUT |
| Master Serial |
Output |
1-bit |
Yes |
| Slave Serial |
Input |
1-bit |
Yes |
| Slave Parallel (SelectMAP) |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
No |
Note: During power-on and throughout configuration, all I/O drivers remain in a high-impedance state. This protects connected logic from unintended transient signals.
Speed Grade Comparison: Why Choose the -6 Grade?
The -6 speed grade is exclusively available in the commercial temperature range and represents the highest performance tier within the Spartan-II XC2S200 family. Below is a comparison of available speed grades:
| Speed Grade |
Relative Performance |
Temperature Range |
Typical Use Case |
| -6 |
Fastest |
Commercial (0°C to +85°C) |
High-frequency digital designs |
| -5 |
Standard |
Commercial & Industrial |
General-purpose FPGA designs |
| -4 |
Slowest |
Industrial (–40°C to +100°C) |
Ruggedized or harsh environment |
For designs operating at system clock frequencies above 150 MHz, the XC2S200-6FGG1213C is the logical choice within the Spartan-II family.
Spartan-II Family Comparison: XC2S200 vs. Smaller Members
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 × 12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12 × 18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28 × 42 |
284 |
56K |
The XC2S200-6FGG1213C is clearly the most capable device in the family, offering the highest logic density, I/O count, and memory resources.
XC2S200-6FGG1213C Applications
#### Communications & Networking
The XC2S200-6FGG1213C handles high-speed data processing and complex signal routing with ease. Engineers commonly deploy it in:
- Network routers and switches
- Communication protocol bridges (SPI, UART, I2C, PCIe)
- Serial data transceivers and framers
#### Industrial Automation & Motor Control
In industrial environments, the XC2S200-6FGG1213C enables precise digital control for:
- PLC (Programmable Logic Controller) logic replacement
- Servo and stepper motor control systems
- Real-time process monitoring and control
#### Medical Imaging & Diagnostics
The device’s reconfigurability and reliability make it attractive in regulated industries:
- Ultrasound and CT scan signal processing
- Patient monitoring equipment
- Medical device firmware and interface control
#### Consumer Electronics & Computing
- Embedded processors and co-processors
- Display controllers and video pipelines
- USB, SDRAM, and Flash memory interface logic
#### Security & Surveillance
- Biometric processing engines
- Cryptographic accelerators (AES, SHA)
- Surveillance video preprocessing and compression
XC2S200-6FGG1213C Advantages Over ASICs
One of the primary reasons engineers choose the XC2S200-6FGG1213C over traditional ASICs is flexibility combined with cost efficiency:
| Criteria |
XC2S200-6FGG1213C (FPGA) |
Mask-Programmed ASIC |
| Non-Recurring Engineering (NRE) Cost |
None |
High ($500K–$5M+) |
| Field Reprogrammability |
Yes |
No |
| Time-to-Market |
Days/Weeks |
Months/Years |
| Design Risk |
Low |
High |
| Minimum Order Quantity |
1 unit |
Thousands |
| Prototype Iteration |
Unlimited |
Each iteration = full re-spin |
Therefore, for low-to-medium volume productions and prototyping, the XC2S200-6FGG1213C delivers significant value.
Electrical Characteristics Summary
| Parameter |
Min |
Typical |
Max |
Unit |
| Core Supply Voltage (VCCINT) |
2.375 |
2.5 |
2.625 |
V |
| I/O Supply Voltage (VCCO) |
1.14 |
— |
3.465 |
V |
| Input High Voltage (VIH) |
2.0 |
— |
VCCO + 0.3 |
V |
| Input Low Voltage (VIL) |
–0.3 |
— |
0.8 |
V |
| Operating Temperature |
0 |
— |
+85 |
°C |
| Static Current (ICCINT) |
— |
— |
15 |
mA |
Design Tool Support
The XC2S200-6FGG1213C is fully supported by Xilinx (AMD) design toolchains. Engineers can use:
- ISE Design Suite — the primary legacy toolchain for Spartan-II devices
- ModelSim / Vivado Simulator — for behavioral and timing simulation
- ChipScope Pro — for in-system logic analysis and debugging
- JTAG — for boundary-scan testing and configuration
Note: Since the Spartan-II is a mature device, Xilinx recommends using ISE 14.7 (the final ISE release) for synthesis, place-and-route, and bitstream generation.
Ordering Information
| Part Number |
Speed Grade |
Package |
Temperature |
Pb-Free |
| XC2S200-6FGG1213C |
-6 |
FGG1213 (1213-ball FBGA) |
Commercial |
Yes |
| XC2S200-5FGG1213C |
-5 |
FGG1213 (1213-ball FBGA) |
Commercial |
Yes |
| XC2S200-5FG1213C |
-5 |
FG1213 (1213-ball FBGA) |
Commercial |
No |
The “G” in FGG denotes RoHS-compliant lead-free (Pb-free) solder balls. Always specify “FGG” for compliance with EU RoHS, China RoHS, and REACH directives.
Frequently Asked Questions (FAQ)
What is the XC2S200-6FGG1213C used for?
The XC2S200-6FGG1213C is used in communications, industrial automation, medical imaging, consumer electronics, and security systems where reprogrammable digital logic at 200,000 system gates is required.
What does the -6 speed grade mean?
The -6 speed grade indicates the fastest performance tier in the Spartan-II commercial range. It supports system operating frequencies up to 200 MHz and clock frequencies up to 263 MHz.
Is the XC2S200-6FGG1213C RoHS compliant?
Yes. The “G” in the FGG1213 package designator confirms this part uses lead-free Pb-free solder balls, making it compliant with RoHS, REACH, and similar environmental regulations.
What is the difference between FG1213 and FGG1213?
The FGG1213 is the Pb-free (lead-free) version of the FG1213 package. Both have 1,213 solder balls in a Fine-Pitch BGA footprint, but FGG is environmentally compliant for modern production.
What tools are used to program the XC2S200-6FGG1213C?
The XC2S200-6FGG1213C is programmed using Xilinx ISE Design Suite. Configuration is loaded via JTAG, Master Serial, Slave Serial, or SelectMAP (Slave Parallel) mode.
Can the XC2S200-6FGG1213C replace an ASIC?
In many cases, yes. The XC2S200-6FGG1213C eliminates ASIC NRE costs and enables field updates, making it a practical and cost-effective replacement for small-to-medium volume ASIC applications.
Conclusion
The XC2S200-6FGG1213C is a proven, high-performance Xilinx Spartan-II FPGA that delivers 200,000 system gates, 5,292 logic cells, 284 user I/O pins, and a fast -6 speed grade in a modern, RoHS-compliant 1,213-ball FBGA package. Its flexibility, reprogrammability, and rich feature set make it an excellent choice across a wide range of industries — from communications and industrial automation to medical imaging and security.
If you are looking for a reliable, high-density FPGA solution with strong ecosystem support and proven field deployment history, the XC2S200-6FGG1213C deserves serious consideration for your next design.