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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1213C: Xilinx Spartan-II FPGA — Full Specifications, Features & Applications

Product Details

The XC2S200-6FGG1213C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. This device offers 200,000 system gates, 5,292 logic cells, and a -6 speed grade — all housed in a 1,213-ball Fine-Pitch Ball Grid Array (FBGA) Pb-free package. Whether you are an engineer sourcing components or a designer evaluating FPGA solutions, the XC2S200-6FGG1213C delivers a compelling blend of logic density, speed, and I/O flexibility at a competitive price point.


What Is the XC2S200-6FGG1213C?

The XC2S200-6FGG1213C is a member of the Xilinx Spartan-II FPGA product family, manufactured on a 0.18-micron, six-layer metal CMOS process. Xilinx designed the Spartan-II series as a cost-optimized alternative to mask-programmed ASICs, giving designers the freedom to reprogram logic in the field without hardware replacement. The XC2S200-6FGG1213C sits at the top of the Spartan-II lineup with the largest gate count, making it the preferred choice for I/O-intensive and logic-heavy designs.

For a broader overview of the Spartan-II product line and related devices, visit the Xilinx FPGA resource page.


XC2S200-6FGG1213C Part Number Breakdown

Understanding the part number helps engineers quickly decode the device’s key attributes:

Code Segment Meaning
XC2S200 Spartan-II family, 200,000 system gates
-6 Speed grade (-6 is the fastest commercial grade)
FGG Fine-Pitch Ball Grid Array, Pb-free (lead-free) package
1213 1,213 total solder balls
C Commercial temperature range (0°C to +85°C)

Key Takeaway: The “G” suffix in “FGG” confirms this is a RoHS-compliant, lead-free package — a critical detail for compliance-driven industries.


XC2S200-6FGG1213C Key Specifications

General Device Parameters

Parameter Value
Manufacturer Xilinx (now AMD)
Family Spartan-II
Part Number XC2S200-6FGG1213C
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Process Technology 0.18 µm CMOS, 6-layer metal
Core Voltage (VCCINT) 2.5V
Speed Grade -6 (fastest available)
Temperature Range Commercial: 0°C to +85°C

Memory Resources

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56,000 bits (56K)
Configuration Bits 1,335,840 bits
Block RAM Columns 2 (one on each side of the die)

I/O and Clocking

Parameter Value
Maximum User I/O Pins 284
Global Clock Inputs 4 dedicated pins
Delay-Locked Loops (DLLs) 4 (one per corner)
Max System Performance Up to 200 MHz
Max Clock Frequency 263 MHz

Package Information

Parameter Value
Package Type Fine-Pitch Ball Grid Array (FBGA)
Package Code FGG1213
Total Ball Count 1,213
Lead-Free (Pb-free) Yes (RoHS Compliant)
Mounting Type Surface Mount

XC2S200-6FGG1213C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1213C contains 1,176 CLBs arranged in a 28-column by 42-row grid. Each CLB includes:

  • Four Look-Up Tables (LUTs) — each implementing any 4-input logic function
  • Four storage elements — usable as edge-triggered flip-flops or level-sensitive latches
  • Fast carry and arithmetic logic for high-speed addition and subtraction
  • Wide function multiplexers for combining logic signals efficiently

This architecture gives the XC2S200-6FGG1213C exceptional flexibility in implementing both combinatorial and sequential digital designs.

Block RAM

Two columns of Block RAM are placed on opposite sides of the die. Each Block RAM module can be configured as a 4K × 4-bit, 2K × 8-bit, or 1K × 16-bit synchronous RAM. Consequently, the XC2S200-6FGG1213C supports a total of 56K bits of on-chip block memory, ideal for FIFOs, dual-port buffers, and lookup tables.

Delay-Locked Loops (DLLs)

The four on-chip DLLs allow engineers to:

  • Eliminate clock distribution delay (zero-delay buffering)
  • Multiply or divide the clock frequency
  • Generate precisely phase-shifted clocks for high-speed interfaces

Input/Output Blocks (IOBs)

Each IOB supports a wide range of single-ended and differential I/O standards, including LVTTL, LVCMOS, PCI, SSTL, and GTL+. The 284 available user I/O pins on the XC2S200-6FGG1213C make it particularly well-suited for multi-bus or high-channel-count designs.


XC2S200-6FGG1213C Configuration Modes

The XC2S200-6FGG1213C supports four configuration modes, enabling integration with a range of external memory and controller devices:

Configuration Mode CCLK Direction Data Width DOUT
Master Serial Output 1-bit Yes
Slave Serial Input 1-bit Yes
Slave Parallel (SelectMAP) Input 8-bit No
Boundary-Scan (JTAG) N/A 1-bit No

Note: During power-on and throughout configuration, all I/O drivers remain in a high-impedance state. This protects connected logic from unintended transient signals.


Speed Grade Comparison: Why Choose the -6 Grade?

The -6 speed grade is exclusively available in the commercial temperature range and represents the highest performance tier within the Spartan-II XC2S200 family. Below is a comparison of available speed grades:

Speed Grade Relative Performance Temperature Range Typical Use Case
-6 Fastest Commercial (0°C to +85°C) High-frequency digital designs
-5 Standard Commercial & Industrial General-purpose FPGA designs
-4 Slowest Industrial (–40°C to +100°C) Ruggedized or harsh environment

For designs operating at system clock frequencies above 150 MHz, the XC2S200-6FGG1213C is the logical choice within the Spartan-II family.


Spartan-II Family Comparison: XC2S200 vs. Smaller Members

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8 × 12 86 16K
XC2S30 972 30,000 12 × 18 92 24K
XC2S50 1,728 50,000 16 × 24 176 32K
XC2S100 2,700 100,000 20 × 30 176 40K
XC2S150 3,888 150,000 24 × 36 260 48K
XC2S200 5,292 200,000 28 × 42 284 56K

The XC2S200-6FGG1213C is clearly the most capable device in the family, offering the highest logic density, I/O count, and memory resources.


XC2S200-6FGG1213C Applications

#### Communications & Networking

The XC2S200-6FGG1213C handles high-speed data processing and complex signal routing with ease. Engineers commonly deploy it in:

  • Network routers and switches
  • Communication protocol bridges (SPI, UART, I2C, PCIe)
  • Serial data transceivers and framers

#### Industrial Automation & Motor Control

In industrial environments, the XC2S200-6FGG1213C enables precise digital control for:

  • PLC (Programmable Logic Controller) logic replacement
  • Servo and stepper motor control systems
  • Real-time process monitoring and control

#### Medical Imaging & Diagnostics

The device’s reconfigurability and reliability make it attractive in regulated industries:

  • Ultrasound and CT scan signal processing
  • Patient monitoring equipment
  • Medical device firmware and interface control

#### Consumer Electronics & Computing

  • Embedded processors and co-processors
  • Display controllers and video pipelines
  • USB, SDRAM, and Flash memory interface logic

#### Security & Surveillance

  • Biometric processing engines
  • Cryptographic accelerators (AES, SHA)
  • Surveillance video preprocessing and compression

XC2S200-6FGG1213C Advantages Over ASICs

One of the primary reasons engineers choose the XC2S200-6FGG1213C over traditional ASICs is flexibility combined with cost efficiency:

Criteria XC2S200-6FGG1213C (FPGA) Mask-Programmed ASIC
Non-Recurring Engineering (NRE) Cost None High ($500K–$5M+)
Field Reprogrammability Yes No
Time-to-Market Days/Weeks Months/Years
Design Risk Low High
Minimum Order Quantity 1 unit Thousands
Prototype Iteration Unlimited Each iteration = full re-spin

Therefore, for low-to-medium volume productions and prototyping, the XC2S200-6FGG1213C delivers significant value.


Electrical Characteristics Summary

Parameter Min Typical Max Unit
Core Supply Voltage (VCCINT) 2.375 2.5 2.625 V
I/O Supply Voltage (VCCO) 1.14 3.465 V
Input High Voltage (VIH) 2.0 VCCO + 0.3 V
Input Low Voltage (VIL) –0.3 0.8 V
Operating Temperature 0 +85 °C
Static Current (ICCINT) 15 mA

Design Tool Support

The XC2S200-6FGG1213C is fully supported by Xilinx (AMD) design toolchains. Engineers can use:

  • ISE Design Suite — the primary legacy toolchain for Spartan-II devices
  • ModelSim / Vivado Simulator — for behavioral and timing simulation
  • ChipScope Pro — for in-system logic analysis and debugging
  • JTAG — for boundary-scan testing and configuration

Note: Since the Spartan-II is a mature device, Xilinx recommends using ISE 14.7 (the final ISE release) for synthesis, place-and-route, and bitstream generation.


Ordering Information

Part Number Speed Grade Package Temperature Pb-Free
XC2S200-6FGG1213C -6 FGG1213 (1213-ball FBGA) Commercial Yes
XC2S200-5FGG1213C -5 FGG1213 (1213-ball FBGA) Commercial Yes
XC2S200-5FG1213C -5 FG1213 (1213-ball FBGA) Commercial No

The “G” in FGG denotes RoHS-compliant lead-free (Pb-free) solder balls. Always specify “FGG” for compliance with EU RoHS, China RoHS, and REACH directives.


Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1213C used for?

The XC2S200-6FGG1213C is used in communications, industrial automation, medical imaging, consumer electronics, and security systems where reprogrammable digital logic at 200,000 system gates is required.

What does the -6 speed grade mean?

The -6 speed grade indicates the fastest performance tier in the Spartan-II commercial range. It supports system operating frequencies up to 200 MHz and clock frequencies up to 263 MHz.

Is the XC2S200-6FGG1213C RoHS compliant?

Yes. The “G” in the FGG1213 package designator confirms this part uses lead-free Pb-free solder balls, making it compliant with RoHS, REACH, and similar environmental regulations.

What is the difference between FG1213 and FGG1213?

The FGG1213 is the Pb-free (lead-free) version of the FG1213 package. Both have 1,213 solder balls in a Fine-Pitch BGA footprint, but FGG is environmentally compliant for modern production.

What tools are used to program the XC2S200-6FGG1213C?

The XC2S200-6FGG1213C is programmed using Xilinx ISE Design Suite. Configuration is loaded via JTAG, Master Serial, Slave Serial, or SelectMAP (Slave Parallel) mode.

Can the XC2S200-6FGG1213C replace an ASIC?

In many cases, yes. The XC2S200-6FGG1213C eliminates ASIC NRE costs and enables field updates, making it a practical and cost-effective replacement for small-to-medium volume ASIC applications.


Conclusion

The XC2S200-6FGG1213C is a proven, high-performance Xilinx Spartan-II FPGA that delivers 200,000 system gates, 5,292 logic cells, 284 user I/O pins, and a fast -6 speed grade in a modern, RoHS-compliant 1,213-ball FBGA package. Its flexibility, reprogrammability, and rich feature set make it an excellent choice across a wide range of industries — from communications and industrial automation to medical imaging and security.

If you are looking for a reliable, high-density FPGA solution with strong ecosystem support and proven field deployment history, the XC2S200-6FGG1213C deserves serious consideration for your next design.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.