Meta Description: Buy XC2S200-6FGG1212C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, 1212-ball FBGA package, 2.5V, commercial temp. Full specs, tables & guide inside.

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The XC2S200-6FGG1212C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for engineers who need abundant logic resources at a low cost, the XC2S200-6FGG1212C delivers 200,000 system gates, 5,292 logic cells, and a maximum system performance of up to 263 MHz — all housed in a 1212-ball Fine-Pitch Ball Grid Array (FBGA) package. Whether you are developing telecommunications equipment, industrial automation controllers, or high-speed data processing systems, the XC2S200-6FGG1212C offers the flexibility, speed, and I/O density your design demands.

If you are sourcing or comparing Xilinx FPGA solutions for your next project, understanding every detail of this part number is essential. This comprehensive guide covers everything — from core logic specifications to package details, operating conditions, and application use cases.

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What Is the XC2S200-6FGG1212C? A Complete Overview

The XC2S200-6FGG1212C belongs to the Spartan-II FPGA family, Xilinx’s cost-optimized programmable logic platform built on advanced 0.18-micron process technology. The Spartan-II series was engineered as a superior alternative to mask-programmed ASICs, eliminating costly NRE charges and enabling in-field design updates that ASICs simply cannot support.

Breaking down the part number gives you instant insight into the device:

XC2S200-6FGG1212C Part Number Decoder

This makes the XC2S200-6FGG1212C the top-tier speed grade option in the XC2S200 lineup, optimized for commercial-temperature designs that require maximum clock performance.

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XC2S200-6FGG1212C Key Specifications at a Glance

The table below summarizes the most critical technical parameters of the XC2S200-6FGG1212C:

Core Logic Specifications

Electrical & Physical Specifications

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XC2S200-6FGG1212C Speed Grade: Why the -6 Matters

The -6 speed grade is the fastest and most performance-optimized variant in the entire XC2S200 lineup. However, there is one critical fact engineers must know: the -6 speed grade is exclusively available in the Commercial temperature range. It is not offered in the industrial (-40°C to +85°C) variant.

This makes the XC2S200-6FGG1212C the right choice when:

• Your operating environment is controlled and temperature-stable
• Maximum clock frequency and minimum propagation delay are the priority
• Your application demands tight setup-and-hold time margins
• High-speed bus interfaces or DSP pipelines are part of the design

For industrial-temperature requirements, you would need to select the -5 speed grade with an “I” suffix instead.

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FGG1212 Package: Pin Count, Form Factor & PCB Design Considerations

Understanding the FGG1212 Ball Grid Array Package

The FGG1212 package is one of the largest FBGA packages in the Spartan-II family, offering 1,212 solder balls arranged in a grid array. The “G” in FGG confirms that this is the Pb-free (lead-free) version, making it compliant with modern environmental standards including the EU RoHS Directive.

FGG1212 Package Highlights

PCB Layout Tips for the FGG1212 Package

Designing with the FGG1212 package requires careful attention to PCB layout. Consider the following best practices:

• Via fanout strategy: Use blind or buried vias for inner ball rows to maintain signal integrity on high-density boards.
• Decoupling capacitors: Place 100nF ceramic capacitors as close as possible to each VCC pin to suppress power supply noise.
• Thermal management: Ensure adequate copper pours and thermal vias under the die shadow for heat dissipation.
• Controlled impedance traces: Route high-speed I/O signals on controlled-impedance layers (50Ω single-ended, 100Ω differential).

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Spartan-II Family: Where the XC2S200 Fits in the Lineup

The XC2S200 is the largest and most capable device in the Spartan-II family. The table below places it in context among its sibling devices:

Spartan-II Family Member Comparison

As shown in the table, the XC2S200 tops the family in every category — logic cells, system gates, I/O count, and memory resources. The FGG1212 package maximizes this capability by providing the highest available pin count, making it the best choice for designs requiring dense I/O connectivity.

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Key Features of the XC2S200-6FGG1212C Spartan-II FPGA

Configurable Logic Blocks (CLBs) and LUT Architecture

Each CLB in the XC2S200-6FGG1212C contains four logic cells, and each logic cell includes a 4-input Look-Up Table (LUT), a programmable flip-flop, and fast carry logic. This architecture enables extremely efficient implementation of combinatorial and sequential logic, arithmetic functions, shift registers, and distributed memory.

Block RAM for Efficient On-Chip Data Storage

The XC2S200-6FGG1212C integrates 56K bits of block RAM distributed across two columns on the die, positioned between the CLB core and the I/O blocks on each side. Each block RAM operates as a fully synchronous, dual-port memory, supporting simple and true dual-port modes — perfect for FIFO buffers, lookup tables, and DSP coefficient storage.

Delay-Locked Loops (DLLs) for Clock Management

Four Delay-Locked Loops are embedded at the four corners of the die, enabling precise clock phase shifting, frequency synthesis, and clock deskewing. The DLLs can:

• Eliminate clock distribution delay across the device
• Generate multiple clock phases (0°, 90°, 180°, 270°)
• Divide or multiply input clock frequencies
• Support zero-delay clocking for system-level timing closure

Input/Output Blocks (IOBs) with Multi-Standard Support

The XC2S200-6FGG1212C supports a broad range of I/O standards through its programmable IOBs, including:

• LVCMOS 2.5V / 3.3V
• LVTTL
• PCI 3.3V / 5V
• GTL / GTL+
• HSTL Class I, II, III, IV
• SSTL2 Class I & II / SSTL3 Class I & II

This multi-standard support allows the XC2S200-6FGG1212C to interface directly with a wide variety of processors, memories, and peripheral devices without additional level-shifting hardware.

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XC2S200-6FGG1212C vs. Other XC2S200 Package Variants

Engineers often choose between different package options for the same XC2S200 die. Here is how the FGG1212 compares to other available packages:

XC2S200 Package Options Comparison

The FGG1212 package provides the highest I/O availability of all XC2S200 variants, making it ideal for complex, I/O-intensive designs. If your application uses most or all of the 284 available user I/O pins and requires Pb-free compliance, the XC2S200-6FGG1212C is the definitive choice.

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Applications: Where to Use the XC2S200-6FGG1212C

The XC2S200-6FGG1212C is well-suited for a broad range of industries and applications, including:

Telecommunications & Networking

• Line card logic in Ethernet switches and routers
• SONET/SDH framing and synchronization
• Protocol bridging and packet processing

Industrial Automation

• Programmable logic controller (PLC) expansion
• Motor drive interface and feedback processing
• Sensor data aggregation and real-time control loops

Embedded Computing & SoC Integration

• Glue logic between processors and peripherals
• Custom co-processor acceleration
• Bus bridges (PCI, SPI, I2C, UART)

Consumer Electronics & Multimedia

• Video processing pipelines
• Image sensor interfaces
• Display timing controllers

Test & Measurement Equipment

• Data acquisition front ends
• Signal generation and capture
• High-speed protocol analyzers

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Programming and Design Tools for the XC2S200-6FGG1212C

Supported Design Suites

The XC2S200-6FGG1212C is supported by Xilinx ISE Design Suite (the legacy toolchain for Spartan-II devices). Since Spartan-II predates the Vivado era, designers should use:

• ISE 14.7 – The final and most stable release of the ISE toolchain, supporting all Spartan-II devices.
• XST (Xilinx Synthesis Technology) – For RTL synthesis of VHDL and Verilog designs.
• IMPACT – For device configuration and JTAG boundary scan.

Configuration Modes

The XC2S200-6FGG1212C supports multiple configuration modes:

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Ordering Information and Part Number Clarification

When ordering the XC2S200-6FGG1212C, ensure you specify the complete part number to avoid substitution errors. The table below clarifies the ordering code structure:

XC2S200-6FGG1212C Ordering Code Summary

Important Note: The -6 speed grade is exclusively available in the Commercial temperature range. There is no industrial-grade (-I suffix) version of the -6 speed bin. Confirm temperature requirements before placing your order.

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Frequently Asked Questions About the XC2S200-6FGG1212C

What is the maximum operating frequency of the XC2S200-6FGG1212C?

The XC2S200-6FGG1212C supports system performance up to 263 MHz in the -6 speed grade, making it the fastest option in the XC2S200 lineup.

Is the XC2S200-6FGG1212C RoHS compliant?

Yes. The “G” in the FGG package designation confirms that the XC2S200-6FGG1212C uses Pb-free (lead-free) solder balls, meeting RoHS environmental compliance requirements.

Can the XC2S200-6FGG1212C be used in automotive or military designs?

The XC2S200-6FGG1212C with the “C” suffix is rated for the commercial temperature range (0°C to +85°C) only. It is not suitable for automotive (-40°C to +125°C) or military (-55°C to +125°C) environments without derating. Select an industrial-grade part (-I suffix) for extended-temperature designs.

What design software does the XC2S200-6FGG1212C support?

The XC2S200-6FGG1212C is supported by the Xilinx ISE Design Suite, specifically ISE 14.7. It is not compatible with the Vivado Design Suite.

What are common alternatives to the XC2S200-6FGG1212C?

If you need a higher logic density or a newer technology node, consider Xilinx Spartan-3 or Spartan-6 family FPGAs. For a pin-compatible or functionally similar substitute, consult with your distributor about approved cross-reference options.

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Why Choose the XC2S200-6FGG1212C for Your Design?

The XC2S200-6FGG1212C stands out for three primary reasons:

1. Maximum Logic Density in the Spartan-II Family – With 5,292 logic cells and 200K system gates, it covers the broadest range of design complexity within the Spartan-II lineup.
2. Highest Speed Grade Available – The -6 speed grade ensures minimum propagation delay, tight timing margins, and support for demanding high-frequency interfaces.
3. Richest I/O Connectivity – The 1212-ball FGG package delivers the most pins of any XC2S200 variant, enabling I/O-intensive designs that smaller packages cannot support.

Together, these attributes make the XC2S200-6FGG1212C a strong choice for complex, performance-critical FPGA designs that remain within the Spartan-II ecosystem.