Meta Description: The XC2S200-6FGG1211C is a Xilinx Spartan-II FPGA with 200,000 system gates, 5,292 logic cells, and a 1211-ball Fine-Pitch BGA package. Read the full specs, pinout, and application guide here.

What Is the XC2S200-6FGG1211C? A Complete Overview

The XC2S200-6FGG1211C is a high-performance, commercial-grade Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for engineers who demand both logic density and speed in a cost-optimized package, this device integrates 200,000 system gates, 5,292 logic cells, and ships in a 1,211-ball Fine-Pitch Ball Grid Array (FGG1211) package — one of the largest form-factor options in the XC2S200 lineup.

Built on Xilinx’s proven 0.18-micron, six-layer metal CMOS process and operating at a core supply voltage of 2.5V, the XC2S200-6FGG1211C targets demanding applications across telecommunications, industrial automation, data acquisition, and embedded computing. It is an ideal replacement for mask-programmed ASICs, offering full in-field reprogrammability with no hardware replacement required.

For engineers exploring the broader Xilinx portfolio, the Xilinx FPGA resource hub provides comprehensive guidance on part selection, design tools, and compatible development boards.

XC2S200-6FGG1211C Part Number Decoder

Understanding the part number is the first step to selecting the right variant for your design. The table below breaks down every segment of the XC2S200-6FGG1211C ordering code.

Key Insight: The -6 speed grade is the fastest available for the XC2S200 and is exclusively offered in the Commercial temperature range. If your application requires the Industrial range (−40°C to +100°C), select the -5I variant instead.

XC2S200-6FGG1211C Core Technical Specifications

## Logic and Memory Architecture

The XC2S200-6FGG1211C is built around Xilinx’s well-established Configurable Logic Block (CLB) matrix. Each CLB contains four slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops, enabling efficient synthesis of combinatorial and sequential logic alike.

## Electrical and Timing Characteristics

## Package Specifications

XC2S200-6FGG1211C Key Features & Capabilities

### Configurable Logic Blocks (CLBs)

The CLB is the primary logic resource of the XC2S200-6FGG1211C. With 1,176 CLBs arranged in a 28×42 matrix, the device offers exceptional flexibility for implementing custom digital logic. Each CLB contains:

• Four slices, each with two 4-input function generators (LUTs) that can implement any 4-input Boolean function
• Two dedicated storage elements (flip-flops) per slice
• Fast carry logic for efficient arithmetic
• Wide-function multiplexers for implementing wide combinatorial functions

### Block RAM (BRAM)

The XC2S200-6FGG1211C includes 56Kb of block RAM split across multiple dedicated RAM blocks positioned on either side of the CLB array. This on-chip RAM supports:

• True dual-port operation (simultaneous read and write)
• Configurable data width: ×1, ×2, ×4, ×8, ×16, ×18
• Synchronous or asynchronous read modes
• Optional output registers for pipelined access

### Distributed RAM

In addition to block RAM, the device provides 75,264 bits of distributed RAM by mapping LUTs into RAM cells. This is ideal for small, fast, local data storage directly within the logic fabric.

### Delay-Locked Loops (DLLs)

Four Delay-Locked Loops — one at each corner of the die — provide robust clock management:

• Clock deskewing (eliminates internal clock distribution delay)
• Frequency synthesis (2×, 4×, 8× multiplication)
• Phase shifting (0°, 90°, 180°, 270°)
• Duty-cycle correction

### Multi-Standard I/O Support

The Input/Output Blocks (IOBs) of the XC2S200-6FGG1211C support a wide range of I/O standards, enabling seamless integration with mixed-voltage systems:

XC2S200-6FGG1211C vs. Other XC2S200 Package Variants

The XC2S200 die is available in several packages. The table below helps design engineers compare the XC2S200-6FGG1211C against other key variants in the family.

Note: All XC2S200 variants share the same 5,292 logic cells and 200,000 system gates. The key differences are package size, available user I/O, and temperature rating. The FGG1211 provides the most routing freedom for high-density board designs.

XC2S200 Full Spartan-II Family Comparison

The table below places the XC2S200 in context within the complete Spartan-II family, helping you quickly evaluate whether a higher- or lower-density device meets your gate count requirements.

The XC2S200 is the largest and most capable device in the Spartan-II family, making the XC2S200-6FGG1211C the top choice when maximum logic resources are required alongside the highest speed grade.

XC2S200-6FGG1211C Configuration and Programming

### Supported Configuration Modes

The XC2S200-6FGG1211C supports multiple programming modes, offering integration flexibility across development and production environments:

• Master Serial Mode – Uses a serial PROM (e.g., XCF series) for standalone configuration at power-up
• Slave Serial Mode – Driven by an external microcontroller or processor
• SelectMAP (Parallel) Mode – High-speed byte-wide configuration for fast startup times
• JTAG (IEEE 1149.1) Mode – Industry-standard boundary scan and in-system programming

### Compatible Configuration PROMs

### Design Tools Support

The XC2S200-6FGG1211C is fully supported by Xilinx ISE Design Suite (the recommended toolchain for legacy Spartan-II devices). Key design tools include:

• XST (Xilinx Synthesis Technology) – RTL synthesis
• ISE Simulator (ISim) – Functional and timing simulation
• CORE Generator – Parameterized IP core generation
• iMPACT – Device programming and boundary-scan operations

Typical Applications for the XC2S200-6FGG1211C

The XC2S200-6FGG1211C serves a broad spectrum of application areas where programmable logic, in-field upgradeability, and high I/O count are critical:

XC2S200-6FGG1211C vs. Mask-Programmed ASICs: Why Choose an FPGA?

The XC2S200-6FGG1211C is a purpose-built alternative to fixed-function ASICs. The advantages are compelling, particularly for low-to-medium volume production and designs that evolve over time.

Ordering Information & Compliance

### Part Number Structure

XC2S200 - 6 - FGG - 1211 - C
   │       │    │     │     └── Temperature: C = Commercial (0°C to +85°C)
   │       │    │     └──────── Pin Count: 1211-ball BGA
   │       │    └────────────── Package: Fine-Pitch BGA, Pb-Free
   │       └─────────────────── Speed Grade: -6 (Fastest)
   └─────────────────────────── Device: Spartan-II, 200K Gates

### Compliance & Environmental

Frequently Asked Questions (FAQ)

#### What is the maximum operating frequency of the XC2S200-6FGG1211C?

The XC2S200-6FGG1211C operates at a maximum internal frequency of 263 MHz with system-level performance supported up to 200 MHz, depending on design implementation and logic depth.

#### Is the XC2S200-6FGG1211C lead-free (RoHS compliant)?

Yes. The double “G” in the package suffix (FGG) indicates a Pb-free, RoHS-compliant package. This distinguishes it from older FG (lead-containing) versions.

#### What is the difference between the -6 and -5 speed grades?

The -6 speed grade is the fastest in the XC2S200 family and is exclusively available in the Commercial temperature range (0°C to +85°C). The -5 speed grade is available in both Commercial and Industrial temperature ranges (−40°C to +100°C).

#### Can the XC2S200-6FGG1211C be reprogrammed in the field?

Absolutely. As a SRAM-based FPGA, the XC2S200-6FGG1211C is infinitely reprogrammable. Configuration data is loaded from an external PROM or processor at every power-up, or via JTAG at any time. This makes field firmware updates straightforward without hardware replacement.

#### What design tools are compatible with the XC2S200-6FGG1211C?

The device is supported by Xilinx ISE Design Suite, including the XST synthesis engine, ISim simulator, CORE Generator, and iMPACT programmer. Note that the newer Vivado Design Suite does not support Spartan-II devices; ISE is the required toolchain.

#### Is the XC2S200-6FGG1211C still recommended for new designs?

The XC2S200 family is a mature product line and is not recommended for new designs by Xilinx/AMD. For new projects, consider migrating to a newer family such as Spartan-6, Spartan-7, or Artix-7 for improved performance, lower power consumption, and extended tool support. However, the XC2S200-6FGG1211C remains widely available for legacy system maintenance, repair, and direct drop-in replacement applications.

Summary: XC2S200-6FGG1211C at a Glance