Meta Description: The XC2S200-6FGG1210C is a Xilinx Spartan-II FPGA featuring 200K system gates, 5,292 logic cells, speed grade -6, and a 1210-pin FGG BGA package. Read full specs, features, and applications here.

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What Is the XC2S200-6FGG1210C?

The XC2S200-6FGG1210C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. It combines 200,000 system gates, 5,292 logic cells, and a large 1210-pin Fine-Pitch Ball Grid Array (FGG BGA) package — making it one of the most I/O-capable devices in its class. Whether you are designing embedded systems, industrial controllers, or communication hardware, the XC2S200-6FGG1210C delivers reliable reprogrammable logic at a competitive cost point.

As part of the broader Xilinx FPGA product line, this device offers an excellent balance between logic density, operating speed, and pin availability for complex multi-interface designs.

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XC2S200-6FGG1210C Key Specifications at a Glance

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Understanding the XC2S200-6FGG1210C Part Number

Breaking down the XC2S200-6FGG1210C part number helps identify its exact capabilities at a glance.

Part Number Decode Table

The -6 speed grade is the highest-performance grade in the Spartan-II family, offering the shortest propagation delays and the highest operational frequencies. This makes the XC2S200-6FGG1210C ideal for timing-critical digital designs.

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XC2S200-6FGG1210C Architecture & Internal Structure

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1210C features 1,176 CLBs arranged in a 28 × 42 array. Each CLB contains four logic cells, and each logic cell includes a 4-input Look-Up Table (LUT), dedicated carry logic, and a D-type flip-flop. This architecture enables highly parallel logic implementation across a wide variety of digital functions.

Block RAM Resources

With 57,344 bits (56 Kbits) of dedicated on-chip Block RAM split across multiple 4K-bit dual-port memory modules, the XC2S200-6FGG1210C supports high-speed buffering, FIFO queues, and dual-port memory operations — all without consuming valuable CLB resources.

Distributed RAM

An additional 75,264 bits of distributed RAM is available through the LUT-based memory capability built into each CLB. This fast, single-cycle-access memory is ideal for small lookup tables and register files embedded within the logic fabric.

I/O Blocks (IOBs) and Pin Resources

XC2S200-6FGG1210C I/O Summary

Each IOB supports programmable drive strength, slew-rate control, and optional pull-up/pull-down resistors. This flexibility makes the device compatible with a wide range of external peripherals and interface standards.

Clock Management

The Spartan-II XC2S200-6FGG1210C includes four dedicated global clock buffers plus delay-locked loop (DLL) resources for clock distribution and phase alignment. This ensures clean, low-skew clock signals across the entire device for robust synchronous designs.

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XC2S200-6FGG1210C Configuration Modes

The XC2S200-6FGG1210C supports multiple configuration modes, enabling flexible system integration.

Configuration data is stored externally (typically in a serial PROM or system microcontroller) and loaded into the FPGA at power-up. The JTAG boundary-scan interface is particularly useful for in-system programming and debugging.

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Absolute Maximum Ratings

⚠️ Caution: Exceeding absolute maximum ratings may permanently damage the device. Always implement proper decoupling capacitors on all power supply pins.

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DC Operating Conditions

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XC2S200-6FGG1210C vs Other XC2S200 Package Variants

The core silicon of the XC2S200 is the same across all packages. The main differentiators are pin count and physical footprint.

The XC2S200-6FGG1210C is the preferred choice for designs requiring maximum PCB routing flexibility and signal integrity at high frequencies, where the fine-pitch BGA package offers superior electrical characteristics compared to leaded alternatives.

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Top Applications for the XC2S200-6FGG1210C

#### Communications & Networking

The XC2S200-6FGG1210C excels in implementing custom communication protocols, serial interfaces, and packet processing engines. Its high user I/O count and fast -6 speed grade enable the simultaneous management of multiple high-speed data streams.

#### Industrial Automation & Motor Control

With precise timing resources and abundant logic cells, the device supports real-time motor control algorithms, PLC functions, and safety-critical industrial I/O processing.

#### Medical Electronics & Imaging

The reliable 0.18 µm CMOS process and reprogrammable architecture make the XC2S200-6FGG1210C suitable for diagnostic imaging, patient monitoring, and portable medical instruments where design updates may be required post-deployment.

#### Signal Processing & DSP

The combination of Block RAM, distributed memory, and CLBs supports implementation of filters, FFTs, correlators, and other DSP functions — without the licensing costs associated with fixed-function DSP ASICs.

#### Prototyping & ASIC Replacement

The Spartan-II architecture was designed as a cost-effective ASIC alternative. The XC2S200-6FGG1210C eliminates NRE (Non-Recurring Engineering) costs and allows field upgrades, making it ideal for low-to-mid volume production and rapid prototyping environments.

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Development Tools & Software Support

The XC2S200-6FGG1210C is supported by the following design tools:

Both VHDL and Verilog HDL languages are supported for design entry. The ISE Design Suite provides a complete flow from RTL entry through timing-driven place and route to final bitstream generation.

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Frequently Asked Questions (FAQ)

What is the maximum operating frequency of the XC2S200-6FGG1210C?

The XC2S200-6FGG1210C can achieve a maximum system clock frequency of up to 263 MHz under recommended operating conditions when using the -6 speed grade.

How many user I/O pins does the XC2S200-6FGG1210C have?

Despite its 1210-pin package, the device provides 284 user-programmable I/O pins, with the remaining pins allocated to power, ground, and configuration signals.

Is the XC2S200-6FGG1210C RoHS compliant?

No — the XC2S200-6FGG1210C is not RoHS compliant. Engineers requiring a lead-free, RoHS-compliant alternative should consult the Xilinx/AMD product selector for equivalent Spartan-3 or Spartan-6 variants.

What voltage does the XC2S200-6FGG1210C require?

The core voltage (V_CCINT) is 2.5 V. The I/O supply (V_CCO) can vary depending on the selected I/O standard, supporting 2.5 V, 3.3 V (LVTTL), and other interface voltage levels.

Can the XC2S200-6FGG1210C be reprogrammed in the field?

Yes. The XC2S200-6FGG1210C is a SRAM-based FPGA, meaning it loads its configuration from external non-volatile memory at each power cycle. This allows unlimited in-field reconfiguration without hardware replacement.

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Summary

The XC2S200-6FGG1210C is a proven, high-I/O-density Xilinx Spartan-II FPGA that delivers 200,000 system gates, 263 MHz maximum frequency, and 57,344 bits of block RAM in a large 1210-pin FGG BGA package. Its -6 speed grade ensures top-tier timing performance within the Spartan-II family. From communications and industrial control to medical imaging and rapid prototyping, this device remains a versatile and cost-effective programmable logic solution for engineers requiring maximum flexibility and signal routing capability.