Meta Description: Buy the XC2S200-6FGG1208C – a Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, 263MHz speed, and 1208-ball Pb-free BGA package. Full specs, tables & datasheet inside.
Focus Keyword: XC2S200-6FGG1208C
Slug: xc2s200-6fgg1208c
The XC2S200-6FGG1208C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. It features 200,000 system gates, 5,292 logic cells, and a 1,208-ball Pb-free Fine-Pitch BGA (FGG) package. The device operates at a 2.5V core voltage and supports a maximum clock frequency of 263 MHz, making it a reliable choice for engineers building communication systems, industrial automation, and digital signal processing applications. For a broader selection of programmable logic devices, visit our Xilinx FPGA catalog.
What Is the XC2S200-6FGG1208C?
The XC2S200-6FGG1208C belongs to Xilinx’s Spartan-II family, a proven line of 2.5V FPGAs built on 0.18-micron process technology. This particular variant combines the largest device in the Spartan-II family (the XC2S200) with the fastest commercial speed grade (-6) and a 1,208-ball Fine-Pitch Ball Grid Array package in a Pb-free (RoHS-compliant) form.
Because Spartan-II FPGAs are a cost-effective alternative to mask-programmed ASICs, the XC2S200-6FGG1208C is widely used in high-volume applications. Furthermore, the device’s reprogrammability allows field upgrades without replacing hardware — a major advantage over traditional ASICs.
Part Number Breakdown
| Field |
Code |
Meaning |
| Device Family |
XC2S |
Spartan-II |
| Logic Gates |
200 |
200,000 system gates |
| Speed Grade |
-6 |
Fastest commercial grade |
| Package |
FGG |
Fine-Pitch BGA, Pb-free |
| Pin Count |
1208 |
1,208 solder balls |
| Temp Range |
C |
Commercial (0°C to +85°C) |
XC2S200-6FGG1208C Key Specifications
The table below summarizes the core technical specifications of the XC2S200-6FGG1208C.
General Electrical Specifications
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Series |
Spartan-II |
| Part Number |
XC2S200-6FGG1208C |
| Process Technology |
0.18 µm |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Supply Voltage (VCCO) |
1.5V – 3.3V (MultiVolt) |
| Maximum Operating Frequency |
263 MHz |
| Speed Grade |
-6 (fastest Spartan-II grade) |
| Temperature Range |
Commercial: 0°C to +85°C |
| RoHS Compliance |
Yes (Pb-free, “G” suffix) |
Logic Resources
| Resource |
XC2S200 Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Slices per CLB |
4 |
| Total Slices |
4,704 |
| 4-Input LUTs |
9,408 |
| Flip-Flops |
9,408 |
Memory Resources
| Memory Type |
Capacity |
| Distributed RAM (via LUTs) |
75,264 bits |
| Block RAM (dedicated) |
56,000 bits (56K) |
| Block RAM Columns |
2 |
| Total Block RAM Modules |
14 |
I/O and Clocking
| Feature |
Detail |
| Maximum User I/O Pins |
284 |
| Global Clock Inputs (dedicated) |
4 |
| Delay-Locked Loops (DLLs) |
4 (one at each die corner) |
| I/O Standards Supported |
LVTTL, LVCMOS 2.5/3.3, PCI, GTL, HSTL, SSTL |
Package Information
| Attribute |
Value |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Package Code |
FGG1208 |
| Pin Count |
1,208 |
| Lead-Free (Pb-free) |
Yes |
| Pitch |
1.0 mm |
XC2S200-6FGG1208C vs. Spartan-II Family Comparison
The table below compares the XC2S200 against other members of the Xilinx Spartan-II family, so you can confirm the right device for your design requirements.
| Device |
System Gates |
Logic Cells |
CLB Array |
Max I/O |
Dist. RAM |
Block RAM |
| XC2S15 |
15,000 |
432 |
8×12 |
86 |
6,144 bits |
16K |
| XC2S30 |
30,000 |
972 |
12×18 |
92 |
13,824 bits |
24K |
| XC2S50 |
50,000 |
1,728 |
16×24 |
176 |
24,576 bits |
32K |
| XC2S100 |
100,000 |
2,700 |
20×30 |
176 |
38,400 bits |
40K |
| XC2S150 |
150,000 |
3,888 |
24×36 |
260 |
55,296 bits |
48K |
| XC2S200 |
200,000 |
5,292 |
28×42 |
284 |
75,264 bits |
56K |
As you can see, the XC2S200 is the largest and most capable device in the Spartan-II lineup, offering the highest gate count, I/O density, and on-chip memory.
Top Features of the XC2S200-6FGG1208C
H3: Advanced Configurable Logic Blocks (CLBs)
Each CLB in the XC2S200-6FGG1208C contains four slices. Every slice includes two 4-input Look-Up Tables (LUTs), two D-type flip-flops, and dedicated carry logic. This architecture enables efficient implementation of arithmetic functions, state machines, and complex Boolean operations.
H3: MultiVolt I/O Interface
The XC2S200-6FGG1208C supports a MultiVolt I/O interface. Therefore, its I/O banks can operate at 1.5V, 2.5V, or 3.3V independently of the core voltage. As a result, it can interface directly with a wide variety of external components and system buses without external level-shifters.
H3: Four Delay-Locked Loops (DLLs)
The device integrates four on-chip DLLs, one positioned at each corner of the die. Consequently, these DLLs eliminate clock distribution delays and allow the designer to multiply, divide, or phase-shift clock signals. This is particularly valuable in high-speed synchronous designs.
H3: Dedicated Block RAM
Fourteen dedicated Block RAM modules provide 56K bits of on-chip memory. Each block RAM module operates as a true dual-port memory, meaning both ports can perform simultaneous read and write operations. This eliminates the need for external SRAM in many embedded applications.
H3: IEEE 1149.1 Boundary Scan (JTAG)
The XC2S200-6FGG1208C includes full JTAG Boundary Scan support per IEEE Standard 1149.1. This simplifies board-level testing and in-system programming, which greatly reduces production test costs.
H3: Pb-Free 1208-Ball BGA Package
The FGG1208 suffix confirms this is the Pb-free (RoHS-compliant) version of the 1208-ball BGA. The large pin count supports dense, high-I/O system designs. Additionally, the fine-pitch BGA footprint helps reduce overall PCB area compared to equivalent QFP packages.
Supported I/O Standards
The XC2S200-6FGG1208C is highly flexible when it comes to interfacing. Below are the I/O signaling standards it natively supports:
| I/O Standard |
Voltage |
Description |
| LVTTL |
3.3V |
Low-Voltage TTL |
| LVCMOS 3.3 |
3.3V |
Low-Voltage CMOS |
| LVCMOS 2.5 |
2.5V |
Low-Voltage CMOS |
| PCI |
3.3V |
Peripheral Component Interconnect |
| GTL / GTL+ |
1.2V / 1.5V |
Gunning Transistor Logic |
| HSTL Class I/II/III/IV |
1.5V |
High-Speed Transceiver Logic |
| SSTL2 Class I/II |
2.5V |
Stub-Series Terminated Logic |
| SSTL3 Class I/II |
3.3V |
Stub-Series Terminated Logic |
Common Applications
The XC2S200-6FGG1208C is designed for demanding applications where programmability, speed, and I/O flexibility matter. Common use cases include:
H3: Communications Equipment
Engineers use this FPGA in routers, switches, and protocol bridges. Its high-speed DLLs and large I/O count support multiple serial and parallel communication interfaces simultaneously.
H3: Industrial Control and Automation
The XC2S200-6FGG1208C is well-suited for motor control, process control, and real-time monitoring systems. Because the device is fully reprogrammable, system behavior can be updated in the field without hardware changes.
H3: Digital Signal Processing (DSP)
With over 9,400 LUTs and 9,400 flip-flops, the device can implement FIR filters, FFT engines, and other signal processing pipelines. Its 263 MHz operating frequency delivers the throughput needed for real-time DSP.
H3: Medical and Test Equipment
Diagnostic imaging systems, patient monitoring hardware, and test-and-measurement instruments all benefit from the FPGA’s flexibility. Furthermore, the device’s reprogrammability supports fast design iterations during product development.
H3: Automotive Electronics
Infotainment systems, driver assistance modules, and sensor fusion platforms are additional targets. The commercial temperature range (0°C to +85°C) suits in-cabin automotive electronics.
Configuration and Programming
The XC2S200-6FGG1208C is configured at power-up using one of several industry-standard modes:
| Mode |
Description |
| Master Serial |
FPGA auto-loads from a serial PROM |
| Slave Serial |
External controller pushes bitstream |
| Master Parallel (x8) |
Parallel PROM load |
| Slave Parallel (SelectMAP) |
High-speed byte-wide download |
| JTAG (Boundary Scan) |
IEEE 1149.1 in-system programming |
The configuration bitstream is stored externally (typically in a Xilinx Platform Flash PROM or compatible EPROM). The XC2S200-6FGG1208C reloads its configuration every time power is applied, since it uses volatile SRAM-based configuration cells.
Design Tool Support
The XC2S200-6FGG1208C is fully supported by Xilinx (AMD) design tools:
| Tool |
Notes |
| Xilinx ISE Design Suite |
Primary legacy tool for Spartan-II |
| Xilinx Vivado (limited) |
Some IP core support |
| ModelSim / XSIM |
Simulation and verification |
| IMPACT (programming) |
JTAG-based programming utility |
| ChipScope Pro |
In-system logic analysis |
Third-party synthesis tools such as Synopsys Synplify and Mentor Precision RTL also support the Spartan-II device family.
Ordering Information
When ordering the XC2S200-6FGG1208C, confirm the following part number fields match your project requirements:
| Code Position |
Value |
Meaning |
| Device |
XC2S200 |
200K-gate Spartan-II |
| Speed Grade |
-6 |
Fastest commercial speed grade |
| Package |
FGG |
Fine-Pitch BGA, Pb-free |
| Pin Count |
1208 |
1,208 solder balls |
| Temp Range |
C |
Commercial 0°C to +85°C |
Note: The -6 speed grade is exclusively available in the commercial temperature range. Industrial temperature range (-40°C to +85°C) devices use speed grade -5 or -4.
Frequently Asked Questions (FAQ)
H3: What does the “G” in FGG1208 mean?
The double “G” in FGG indicates a Pb-free (lead-free) package, which complies with RoHS environmental regulations. The single “G” version (FG) is the standard tin-lead package.
H3: Is the XC2S200-6FGG1208C still in production?
Xilinx (now AMD) has issued a Product Discontinuance Notice (PDN) for the Spartan-II family. However, authorized distributors continue to carry inventory. Always verify availability with your component supplier before designing the part into new products.
H3: What is the difference between XC2S200-6FGG1208C and XC2S200-6FG256C?
Both devices are XC2S200 Spartan-II FPGAs with -6 speed grade, but they differ in package. The FGG1208C has 1,208 BGA balls with more available I/O connections, while the FG256C has 256 BGA balls and is better suited for smaller designs. Choose FGG1208C for designs requiring the full 284 user I/O.
H3: What FPGA tool should I use for the XC2S200-6FGG1208C?
Use Xilinx ISE Design Suite (version 14.7 is the last release). ISE provides the full toolchain for synthesis, implementation, and bitstream generation for Spartan-II devices.
H3: Can the XC2S200-6FGG1208C replace an ASIC?
Yes. Spartan-II FPGAs are specifically designed as a cost-effective ASIC alternative. The XC2S200-6FGG1208C eliminates NRE (Non-Recurring Engineering) costs and enables in-field design updates — both major advantages over fixed ASICs in low-to-mid volume applications.
Summary
The XC2S200-6FGG1208C is the top-tier device in Xilinx’s Spartan-II family. It combines 200K system gates, 5,292 logic cells, four DLLs, 56K bits of block RAM, and 284 user I/O pins in a Pb-free 1208-ball BGA package running at up to 263 MHz. Whether you need it for communications, DSP, industrial automation, or prototype development, the XC2S200-6FGG1208C delivers robust performance at a competitive price point.
For a full range of Xilinx programmable logic solutions, explore our Xilinx FPGA product catalog.
