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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1206C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

Meta Description: Buy the XC2S200-6FGG1206C – Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, speed grade -6, and a 1206-pin Pb-free BGA package. Full specs, pinout, and applications inside.


The XC2S200-6FGG1206C is a high-performance, cost-optimized Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for engineers who need powerful programmable logic without the high cost and long lead times of custom ASICs, the XC2S200-6FGG1206C delivers 200,000 system gates, 5,292 logic cells, and the fastest commercial speed grade (-6) — all housed in a 1206-pin Pb-free Fine-Pitch BGA package. Whether you are designing embedded systems, communications hardware, or digital signal processing (DSP) applications, this device offers a proven, field-upgradable solution.

For a broader look at the full Xilinx programmable logic portfolio, visit Xilinx FPGA.


What Is the XC2S200-6FGG1206C?

The XC2S200-6FGG1206C belongs to Xilinx’s Spartan-II FPGA family, one of the industry’s most widely adopted low-cost FPGA platforms. The device is manufactured on a 0.18µm process node and operates at a core voltage of 2.5V. It is the largest member of the Spartan-II family, offering 200,000 system gates — making it ideal for complex logic designs that still demand budget sensitivity.

Decoding the Part Number

Understanding the part number helps engineers quickly confirm they have the right component.

Part Number Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gate density
-6 Speed grade -6 (fastest available; Commercial range only)
FGG Fine-Pitch Ball Grid Array (BGA), Pb-free (lead-free) package
1206 1206 total package pins
C Commercial temperature range (0°C to +85°C)

XC2S200-6FGG1206C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
System Gates (Logic + RAM) 200,000
Logic Cells 5,292
CLB Array (Rows × Columns) 28 × 42
Total CLBs 1,176
Maximum User I/O Pins 284
Global Clock Inputs 4

Memory Resources

Memory Type Capacity
Total Distributed RAM 75,264 bits
Total Block RAM 56K bits (56,000 bits)
Configuration Bits 1,335,840

Electrical & Timing Characteristics

Parameter Value
Core Supply Voltage 2.5V
I/O Standard Voltage 2.5V (multi-standard IOBs)
Maximum System Clock Frequency Up to 200 MHz
Internal Speed (Logic-to-Logic) Up to 263 MHz
Process Node 0.18µm CMOS
Speed Grade -6 (fastest in Spartan-II family)
Operating Temperature 0°C to +85°C (Commercial)

Package Information

Parameter Value
Package Type FGG (Fine-Pitch BGA, Pb-free)
Total Pins 1,206
Lead-Free (RoHS Status) Pb-free (“G” suffix = lead-free solder balls)
Package Designation FGG1206

XC2S200-6FGG1206C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1206C organizes its logic in a 28×42 matrix of Configurable Logic Blocks (CLBs). Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs), two flip-flops, and fast carry logic. This architecture supports both combinational and registered logic, making the XC2S200-6FGG1206C suitable for state machines, arithmetic cores, and custom logic pipelines.

Input/Output Blocks (IOBs)

With 284 maximum user I/O pins, the XC2S200-6FGG1206C supports a wide range of I/O standards including LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL2, and SSTL3. Each IOB features:

  • Programmable input delay
  • Optional input/output registers
  • Slew rate control (FAST/SLOW)
  • Configurable pull-up, pull-down, or keeper resistors
  • Tri-state control per pin

Block RAM

The device includes 56K bits of dedicated on-chip block RAM organized in two columns on opposite sides of the die. Each block RAM can be independently configured as single-port or true dual-port memory. This makes the XC2S200-6FGG1206C well-suited for buffering, FIFOs, and lookup table implementations.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs), positioned at each corner of the die, provide:

  • Clock deskew to eliminate clock distribution delays
  • Clock multiplication and division
  • Phase shifting for fine-grained timing control
  • Jitter reduction for high-speed interfaces

XC2S200-6FGG1206C Configuration Modes

The XC2S200-6FGG1206C supports four configuration modes, enabling flexible system integration across different board designs.

Configuration Mode M[2:0] Pins CCLK Direction Data Width Serial DOUT
Master Serial 000 Output 1-bit Yes
Slave Serial 110 Input 1-bit Yes
Slave Parallel (SelectMAP) 010 Input 8-bit No
Boundary-Scan (JTAG) 100 N/A 1-bit No

Note: During configuration and power-on, all I/O drivers remain in a high-impedance state to prevent bus contention.


Spartan-II Family Comparison

The table below shows where the XC2S200 stands within the complete Spartan-II family. The XC2S200-6FGG1206C occupies the top tier for density.

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 8×12 96 86 6,144 bits 16K
XC2S30 972 30,000 12×18 216 92 13,824 bits 24K
XC2S50 1,728 50,000 16×24 384 176 24,576 bits 32K
XC2S100 2,700 100,000 20×30 600 176 38,400 bits 40K
XC2S150 3,888 150,000 24×36 864 260 55,296 bits 48K
XC2S200 5,292 200,000 28×42 1,176 284 75,264 bits 56K

Speed Grade Comparison for XC2S200

Xilinx offers the XC2S200 in multiple speed grades. The -6 speed grade on the XC2S200-6FGG1206C is the fastest available, exclusively offered in the Commercial temperature range.

Speed Grade Availability Temperature Range Typical Use Case
-5 Commercial & Industrial 0°C to +85°C / -40°C to +100°C General embedded, cost-sensitive designs
-6 Commercial only 0°C to +85°C High-speed signal processing, fast interfaces

Top Applications for the XC2S200-6FGG1206C

The XC2S200-6FGG1206C is engineered for demanding digital designs across multiple industries.

#### Embedded Processing & Control Systems

The large CLB array and abundant I/O make the XC2S200-6FGG1206C a popular choice for custom embedded processors, bus controllers, and peripheral management. Its 284 user I/Os allow wide data buses without external expanders.

#### Digital Signal Processing (DSP)

With distributed RAM and fast DLLs, the XC2S200-6FGG1206C supports FIR filters, FFT engines, and convolution pipelines. The -6 speed grade ensures that high-throughput DSP algorithms meet timing closure.

#### Communications & Networking

The multi-standard IOBs support PCI, HSTL, and SSTL2/3 interfaces, making the XC2S200-6FGG1206C suitable for line cards, network switches, and protocol bridging hardware.

#### Industrial Automation

The device excels in machine vision, motor control, and sensor fusion applications where real-time parallel processing and deterministic timing are critical.

#### Prototyping & ASIC Emulation

Because the XC2S200-6FGG1206C is fully reprogrammable, design teams use it to prototype ASIC designs before tape-out, eliminating costly NRE charges and shortening development cycles.


XC2S200-6FGG1206C vs. Competing Parts

Part Number Vendor Gates Package Speed Grade Voltage Key Differentiator
XC2S200-6FGG1206C Xilinx 200K 1206-pin BGA -6 2.5V Fastest Spartan-II, large pin count
XC2S200-5FGG1206I Xilinx 200K 1206-pin BGA -5 2.5V Industrial temp range
EP20K200EFC672-1 Altera (Intel) 200K 672-pin BGA -1 2.5V/1.8V APEX family, dual-voltage
XC3S200-4FT256C Xilinx 200K 256-pin BGA -4 1.2V Spartan-3, lower power

If you are starting a new design and can adopt a newer platform, consider the Spartan-3 or later Xilinx FPGA families for improved power efficiency. The XC2S200-6FGG1206C remains the optimal choice for existing Spartan-II board designs requiring the highest throughput.


Development Tools for the XC2S200-6FGG1206C

Supported EDA Software

Tool Version Notes
Xilinx ISE Design Suite 14.7 (final) Full support for all Spartan-II devices
ModelSim / QuestaSim Any RTL simulation with Xilinx simulation libraries
Synplify Pro Legacy Synthesis support for Spartan-II netlist flow
Mentor Precision Legacy Alternate synthesis option

Note: The Xilinx Vivado Design Suite does not support Spartan-II devices. Use ISE Design Suite 14.7 for all XC2S200-6FGG1206C implementation flows.

JTAG Programming & Debug

The XC2S200-6FGG1206C supports in-system programming via JTAG (IEEE 1149.1). Compatible programming hardware includes:

  • Xilinx Platform Cable USB II
  • Xilinx Parallel Cable IV
  • Third-party JTAG probes compatible with the SVF/XSVF format

Ordering Information & Part Number Structure

The full Spartan-II part number format follows this convention:

XC2S[Gates] - [Speed Grade] [Package Type] [Pin Count] [Temp Range]
  |               |              |               |           |
XC2S200    -    6          FGG           1206           C

Related XC2S200 Orderable Parts

Part Number Package Speed Grade Temperature Pb-Free
XC2S200-6FGG1206C 1206-pin BGA -6 Commercial Yes
XC2S200-5FGG1206C 1206-pin BGA -5 Commercial Yes
XC2S200-5FGG1206I 1206-pin BGA -5 Industrial Yes
XC2S200-6FG256C 256-pin BGA -6 Commercial No
XC2S200-6FGG456C 456-pin BGA -6 Commercial Yes
XC2S200-6PQ208C 208-pin PQFP -6 Commercial No

Frequently Asked Questions (FAQ)

What does the “G” in FGG1206 mean?

The double “G” (FGG) indicates a Pb-free (lead-free) package, in compliance with RoHS environmental regulations. The single “G” suffix in “FG” refers to the Fine-Pitch BGA package style, while the second “G” specifically denotes lead-free solder balls.

Is the XC2S200-6FGG1206C still in production?

The Spartan-II family, including the XC2S200-6FGG1206C, is not recommended for new designs (NRND) by AMD Xilinx. However, the device remains widely available through authorized distributors and component brokers for use in legacy board maintenance and long-lifecycle industrial applications.

What is the difference between XC2S200-6FGG1206C and XC2S200-5FGG1206C?

The only difference is the speed grade. The -6 variant is faster and exclusively available in the Commercial temperature range (0°C to +85°C). The -5 variant supports both Commercial and Industrial (-40°C to +100°C) temperature ranges.

Can I use Vivado to program the XC2S200-6FGG1206C?

No. AMD Xilinx’s Vivado Design Suite does not support Spartan-II devices. You must use ISE Design Suite 14.7 to synthesize, implement, and generate bitstreams for the XC2S200-6FGG1206C.

How many configuration bits does the XC2S200-6FGG1206C require?

The XC2S200 requires 1,335,840 configuration bits. This determines the size of the bitstream file (.bit) and informs the choice of external configuration memory (PROM or SPI flash).


Summary: Why Choose the XC2S200-6FGG1206C?

The XC2S200-6FGG1206C delivers a compelling combination of high logic density, fast speed grade, and a large 1206-pin Pb-free BGA package — all in a field-proven Spartan-II platform. Key reasons to select this part include:

  • 200,000 system gates and 5,292 logic cells for complex, large-scale designs
  • Speed grade -6, the fastest available in the Spartan-II family
  • 284 user I/O pins with multi-standard support across LVTTL, PCI, HSTL, and SSTL
  • 1206-pin Pb-free BGA package for high pin-count board integration
  • Four DLLs for precise clock management and deskew
  • 56K bits of block RAM for on-chip buffering and dual-port memory
  • Fully reprogrammable — eliminates ASIC NRE costs and enables field upgrades
  • ISE 14.7 compatible — mature, stable toolchain with extensive community support

For design engineers maintaining legacy systems or deploying proven Spartan-II solutions, the XC2S200-6FGG1206C remains a reliable, available, and technically sound choice.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.