Meta Description: Buy the XC2S200-6FGG1206C – Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, speed grade -6, and a 1206-pin Pb-free BGA package. Full specs, pinout, and applications inside.
The XC2S200-6FGG1206C is a high-performance, cost-optimized Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for engineers who need powerful programmable logic without the high cost and long lead times of custom ASICs, the XC2S200-6FGG1206C delivers 200,000 system gates, 5,292 logic cells, and the fastest commercial speed grade (-6) — all housed in a 1206-pin Pb-free Fine-Pitch BGA package. Whether you are designing embedded systems, communications hardware, or digital signal processing (DSP) applications, this device offers a proven, field-upgradable solution.
For a broader look at the full Xilinx programmable logic portfolio, visit Xilinx FPGA.
What Is the XC2S200-6FGG1206C?
The XC2S200-6FGG1206C belongs to Xilinx’s Spartan-II FPGA family, one of the industry’s most widely adopted low-cost FPGA platforms. The device is manufactured on a 0.18µm process node and operates at a core voltage of 2.5V. It is the largest member of the Spartan-II family, offering 200,000 system gates — making it ideal for complex logic designs that still demand budget sensitivity.
Decoding the Part Number
Understanding the part number helps engineers quickly confirm they have the right component.
| Part Number Segment |
Meaning |
| XC2S200 |
Xilinx Spartan-II, 200K system gate density |
| -6 |
Speed grade -6 (fastest available; Commercial range only) |
| FGG |
Fine-Pitch Ball Grid Array (BGA), Pb-free (lead-free) package |
| 1206 |
1206 total package pins |
| C |
Commercial temperature range (0°C to +85°C) |
XC2S200-6FGG1206C Key Specifications
Core Logic Resources
| Parameter |
XC2S200 Value |
| System Gates (Logic + RAM) |
200,000 |
| Logic Cells |
5,292 |
| CLB Array (Rows × Columns) |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O Pins |
284 |
| Global Clock Inputs |
4 |
Memory Resources
| Memory Type |
Capacity |
| Total Distributed RAM |
75,264 bits |
| Total Block RAM |
56K bits (56,000 bits) |
| Configuration Bits |
1,335,840 |
Electrical & Timing Characteristics
| Parameter |
Value |
| Core Supply Voltage |
2.5V |
| I/O Standard Voltage |
2.5V (multi-standard IOBs) |
| Maximum System Clock Frequency |
Up to 200 MHz |
| Internal Speed (Logic-to-Logic) |
Up to 263 MHz |
| Process Node |
0.18µm CMOS |
| Speed Grade |
-6 (fastest in Spartan-II family) |
| Operating Temperature |
0°C to +85°C (Commercial) |
Package Information
| Parameter |
Value |
| Package Type |
FGG (Fine-Pitch BGA, Pb-free) |
| Total Pins |
1,206 |
| Lead-Free (RoHS Status) |
Pb-free (“G” suffix = lead-free solder balls) |
| Package Designation |
FGG1206 |
XC2S200-6FGG1206C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1206C organizes its logic in a 28×42 matrix of Configurable Logic Blocks (CLBs). Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs), two flip-flops, and fast carry logic. This architecture supports both combinational and registered logic, making the XC2S200-6FGG1206C suitable for state machines, arithmetic cores, and custom logic pipelines.
Input/Output Blocks (IOBs)
With 284 maximum user I/O pins, the XC2S200-6FGG1206C supports a wide range of I/O standards including LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL2, and SSTL3. Each IOB features:
- Programmable input delay
- Optional input/output registers
- Slew rate control (FAST/SLOW)
- Configurable pull-up, pull-down, or keeper resistors
- Tri-state control per pin
Block RAM
The device includes 56K bits of dedicated on-chip block RAM organized in two columns on opposite sides of the die. Each block RAM can be independently configured as single-port or true dual-port memory. This makes the XC2S200-6FGG1206C well-suited for buffering, FIFOs, and lookup table implementations.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs), positioned at each corner of the die, provide:
- Clock deskew to eliminate clock distribution delays
- Clock multiplication and division
- Phase shifting for fine-grained timing control
- Jitter reduction for high-speed interfaces
XC2S200-6FGG1206C Configuration Modes
The XC2S200-6FGG1206C supports four configuration modes, enabling flexible system integration across different board designs.
| Configuration Mode |
M[2:0] Pins |
CCLK Direction |
Data Width |
Serial DOUT |
| Master Serial |
000 |
Output |
1-bit |
Yes |
| Slave Serial |
110 |
Input |
1-bit |
Yes |
| Slave Parallel (SelectMAP) |
010 |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
100 |
N/A |
1-bit |
No |
Note: During configuration and power-on, all I/O drivers remain in a high-impedance state to prevent bus contention.
Spartan-II Family Comparison
The table below shows where the XC2S200 stands within the complete Spartan-II family. The XC2S200-6FGG1206C occupies the top tier for density.
| Device |
Logic Cells |
System Gates |
CLB Array |
Total CLBs |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
96 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
216 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
384 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
600 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
864 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
1,176 |
284 |
75,264 bits |
56K |
Speed Grade Comparison for XC2S200
Xilinx offers the XC2S200 in multiple speed grades. The -6 speed grade on the XC2S200-6FGG1206C is the fastest available, exclusively offered in the Commercial temperature range.
| Speed Grade |
Availability |
Temperature Range |
Typical Use Case |
| -5 |
Commercial & Industrial |
0°C to +85°C / -40°C to +100°C |
General embedded, cost-sensitive designs |
| -6 |
Commercial only |
0°C to +85°C |
High-speed signal processing, fast interfaces |
Top Applications for the XC2S200-6FGG1206C
The XC2S200-6FGG1206C is engineered for demanding digital designs across multiple industries.
#### Embedded Processing & Control Systems
The large CLB array and abundant I/O make the XC2S200-6FGG1206C a popular choice for custom embedded processors, bus controllers, and peripheral management. Its 284 user I/Os allow wide data buses without external expanders.
#### Digital Signal Processing (DSP)
With distributed RAM and fast DLLs, the XC2S200-6FGG1206C supports FIR filters, FFT engines, and convolution pipelines. The -6 speed grade ensures that high-throughput DSP algorithms meet timing closure.
#### Communications & Networking
The multi-standard IOBs support PCI, HSTL, and SSTL2/3 interfaces, making the XC2S200-6FGG1206C suitable for line cards, network switches, and protocol bridging hardware.
#### Industrial Automation
The device excels in machine vision, motor control, and sensor fusion applications where real-time parallel processing and deterministic timing are critical.
#### Prototyping & ASIC Emulation
Because the XC2S200-6FGG1206C is fully reprogrammable, design teams use it to prototype ASIC designs before tape-out, eliminating costly NRE charges and shortening development cycles.
XC2S200-6FGG1206C vs. Competing Parts
| Part Number |
Vendor |
Gates |
Package |
Speed Grade |
Voltage |
Key Differentiator |
| XC2S200-6FGG1206C |
Xilinx |
200K |
1206-pin BGA |
-6 |
2.5V |
Fastest Spartan-II, large pin count |
| XC2S200-5FGG1206I |
Xilinx |
200K |
1206-pin BGA |
-5 |
2.5V |
Industrial temp range |
| EP20K200EFC672-1 |
Altera (Intel) |
200K |
672-pin BGA |
-1 |
2.5V/1.8V |
APEX family, dual-voltage |
| XC3S200-4FT256C |
Xilinx |
200K |
256-pin BGA |
-4 |
1.2V |
Spartan-3, lower power |
If you are starting a new design and can adopt a newer platform, consider the Spartan-3 or later Xilinx FPGA families for improved power efficiency. The XC2S200-6FGG1206C remains the optimal choice for existing Spartan-II board designs requiring the highest throughput.
Development Tools for the XC2S200-6FGG1206C
Supported EDA Software
| Tool |
Version |
Notes |
| Xilinx ISE Design Suite |
14.7 (final) |
Full support for all Spartan-II devices |
| ModelSim / QuestaSim |
Any |
RTL simulation with Xilinx simulation libraries |
| Synplify Pro |
Legacy |
Synthesis support for Spartan-II netlist flow |
| Mentor Precision |
Legacy |
Alternate synthesis option |
Note: The Xilinx Vivado Design Suite does not support Spartan-II devices. Use ISE Design Suite 14.7 for all XC2S200-6FGG1206C implementation flows.
JTAG Programming & Debug
The XC2S200-6FGG1206C supports in-system programming via JTAG (IEEE 1149.1). Compatible programming hardware includes:
- Xilinx Platform Cable USB II
- Xilinx Parallel Cable IV
- Third-party JTAG probes compatible with the SVF/XSVF format
Ordering Information & Part Number Structure
The full Spartan-II part number format follows this convention:
XC2S[Gates] - [Speed Grade] [Package Type] [Pin Count] [Temp Range]
| | | | |
XC2S200 - 6 FGG 1206 C
Related XC2S200 Orderable Parts
| Part Number |
Package |
Speed Grade |
Temperature |
Pb-Free |
| XC2S200-6FGG1206C |
1206-pin BGA |
-6 |
Commercial |
Yes |
| XC2S200-5FGG1206C |
1206-pin BGA |
-5 |
Commercial |
Yes |
| XC2S200-5FGG1206I |
1206-pin BGA |
-5 |
Industrial |
Yes |
| XC2S200-6FG256C |
256-pin BGA |
-6 |
Commercial |
No |
| XC2S200-6FGG456C |
456-pin BGA |
-6 |
Commercial |
Yes |
| XC2S200-6PQ208C |
208-pin PQFP |
-6 |
Commercial |
No |
Frequently Asked Questions (FAQ)
What does the “G” in FGG1206 mean?
The double “G” (FGG) indicates a Pb-free (lead-free) package, in compliance with RoHS environmental regulations. The single “G” suffix in “FG” refers to the Fine-Pitch BGA package style, while the second “G” specifically denotes lead-free solder balls.
Is the XC2S200-6FGG1206C still in production?
The Spartan-II family, including the XC2S200-6FGG1206C, is not recommended for new designs (NRND) by AMD Xilinx. However, the device remains widely available through authorized distributors and component brokers for use in legacy board maintenance and long-lifecycle industrial applications.
What is the difference between XC2S200-6FGG1206C and XC2S200-5FGG1206C?
The only difference is the speed grade. The -6 variant is faster and exclusively available in the Commercial temperature range (0°C to +85°C). The -5 variant supports both Commercial and Industrial (-40°C to +100°C) temperature ranges.
Can I use Vivado to program the XC2S200-6FGG1206C?
No. AMD Xilinx’s Vivado Design Suite does not support Spartan-II devices. You must use ISE Design Suite 14.7 to synthesize, implement, and generate bitstreams for the XC2S200-6FGG1206C.
How many configuration bits does the XC2S200-6FGG1206C require?
The XC2S200 requires 1,335,840 configuration bits. This determines the size of the bitstream file (.bit) and informs the choice of external configuration memory (PROM or SPI flash).
Summary: Why Choose the XC2S200-6FGG1206C?
The XC2S200-6FGG1206C delivers a compelling combination of high logic density, fast speed grade, and a large 1206-pin Pb-free BGA package — all in a field-proven Spartan-II platform. Key reasons to select this part include:
- 200,000 system gates and 5,292 logic cells for complex, large-scale designs
- Speed grade -6, the fastest available in the Spartan-II family
- 284 user I/O pins with multi-standard support across LVTTL, PCI, HSTL, and SSTL
- 1206-pin Pb-free BGA package for high pin-count board integration
- Four DLLs for precise clock management and deskew
- 56K bits of block RAM for on-chip buffering and dual-port memory
- Fully reprogrammable — eliminates ASIC NRE costs and enables field upgrades
- ISE 14.7 compatible — mature, stable toolchain with extensive community support
For design engineers maintaining legacy systems or deploying proven Spartan-II solutions, the XC2S200-6FGG1206C remains a reliable, available, and technically sound choice.