Meta Description: Buy XC2S200-6FGG1205C – Xilinx Spartan-II FPGA with 200K gates, 1205-pin FGG BGA, -6 speed grade, 2.5V. Full specs, pinout, applications & datasheet guide.

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The XC2S200-6FGG1205C is a high-density Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. It delivers 200,000 system gates in a 1205-pin Fine-Pitch Ball Grid Array (FGG BGA) package, with a -6 speed grade optimized for commercial-temperature applications. Whether you are designing for telecommunications, industrial automation, or high-speed digital signal processing, this component delivers reliable, reprogrammable logic at a cost-effective price point. For a broader look at the full product lineup, visit Xilinx FPGA.

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What Is the XC2S200-6FGG1205C?

The XC2S200-6FGG1205C is a member of the Xilinx Spartan-II FPGA family, manufactured using 0.18-micron process technology and operating at a core voltage of 2.5V. It is the highest-gate-count device in the Spartan-II series, making it the go-to choice for designs that require maximum logic capacity within the Spartan-II generation.

Decoding the Part Number

Understanding the part number helps you quickly confirm you have the correct component:

Note: The “G” in “FGG” denotes a Pb-free (lead-free) package, compliant with RoHS environmental requirements. This distinguishes it from the earlier “FG” standard-tin packages.

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XC2S200-6FGG1205C Key Specifications

Core Logic Resources

Electrical & Physical Characteristics

Package Dimensions

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XC2S200-6FGG1205C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1205C contains 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB includes:

• Four logic cells, each with a 4-input Look-Up Table (LUT) for combinational logic
• Dedicated D flip-flops for sequential logic
• Fast carry logic for arithmetic operations
• Wide function multiplexers for combining CLB outputs

This structure enables engineers to implement complex digital functions, state machines, arithmetic circuits, and custom processors entirely within reconfigurable fabric.

Block RAM

The device integrates 56K bits of on-chip Block RAM, distributed across two columns of dedicated memory blocks on either side of the CLB array. Each block supports:

• Synchronous read and write operations
• True dual-port configuration
• Configurable widths: ×1, ×2, ×4, ×8, ×16

Block RAM is ideal for implementing FIFOs, data buffers, lookup tables, and small embedded memory arrays without consuming CLB resources.

Distributed RAM

Beyond Block RAM, the Spartan-II architecture also supports 75,264 bits of distributed RAM, formed within the CLB LUT structures. This gives designers flexible, fine-grained memory options that can be placed close to logic resources for minimal routing delays.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1205C provides 284 maximum user I/O pins, each backed by a programmable IOB that supports:

• Multiple I/O standards: LVCMOS, LVTTL, SSTL, GTL, PCI, HSTL, and more
• Programmable drive strength
• Optional internal pull-up, pull-down, and keeper circuits
• Fast slew-rate control for EMI management
• Input delay for setup-time optimization

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops are positioned at the four corners of the die. Each DLL enables:

• Zero-delay clock buffering
• Clock edge alignment
• Clock frequency multiplication and division
• Phase shifting for advanced clocking topologies

DLLs are critical for high-speed synchronous designs that require precise, skew-free clock distribution across the FPGA fabric.

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XC2S200-6FGG1205C vs. Other Spartan-II Family Members

The table below shows how the XC2S200 compares to the rest of the Spartan-II family, helping you select the right density for your design:

The XC2S200 is the largest and most capable device in the Spartan-II family, providing the most logic cells, the most I/O, and the largest on-chip memory.

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Speed Grades Explained: Why Choose -6?

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the Commercial temperature range. It is not available in industrial (-40°C to +85°C) configurations.

If your design demands maximum timing margin, minimum propagation delay, and the highest achievable operating frequency, the -6 grade is the correct choice — provided your operating environment stays within the commercial temperature window.

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Typical Applications for the XC2S200-6FGG1205C

The XC2S200-6FGG1205C is widely used across multiple industries due to its flexible architecture and large I/O count. Common application areas include:

Telecommunications & Networking

• Line card processing and packet classification
• Protocol bridging between SONET/SDH and Ethernet
• Multi-channel serial data processing and framing

Industrial Automation & Motor Control

• Multi-axis motor control and encoder interfaces
• PLC co-processor offloading
• Real-time sensor data aggregation and processing

 Medical Electronics

• High-speed diagnostic imaging pipelines
• ECG/EEG signal acquisition and preprocessing
• Patient monitoring device control logic

Test & Measurement Equipment

• Logic analyzers and protocol decoders
• Arbitrary waveform generators
• Instrument bus interface controllers (GPIB, USB, PCI)

 Consumer & Multimedia

• Video format conversion and scaling
• Audio DSP pipelines
• Set-top box and display controller logic

Defense & Aerospace (Legacy Programs)

• Ruggedized FPGA replacement in legacy systems
• Custom bus interface controllers
• Encrypted communications subsystems

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Design Tools & Support for XC2S200-6FGG1205C

Xilinx ISE Design Suite

The XC2S200-6FGG1205C is supported by the Xilinx ISE Design Suite (ISE 14.7 is the final version for legacy Spartan-II devices). ISE provides:

• Schematic capture and HDL (VHDL/Verilog) synthesis
• Place & Route with timing-driven optimization
• Bitstream generation for JTAG or PROM-based configuration
• iMPACT programmer for device configuration

Important: The XC2S200-6FGG1205C is not supported in Vivado Design Suite, which targets 7-series and newer device families.

Configuration Methods

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Ordering Information & Part Number Variants

When sourcing the XC2S200 in various packages and speed grades, use the table below to identify the correct part number:

The XC2S200-6FGG1205C stands out as the only variant combining the fastest speed grade with the highest pin count in a lead-free package, making it the premium choice for high-I/O commercial designs.

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Frequently Asked Questions (FAQ)

What does the “C” at the end of XC2S200-6FGG1205C mean?

The “C” denotes the Commercial temperature range: 0°C to +85°C (ambient). Industrial-grade variants use “I” and operate from -40°C to +85°C, though the -6 speed grade is not available in the industrial range.

Is XC2S200-6FGG1205C RoHS compliant?

Yes. The “FGG” designation (double “G”) confirms that this component uses a Pb-free (lead-free) BGA package, in compliance with RoHS and WEEE environmental regulations.

What is the difference between XC2S200-6FGG1205C and XC2S200-6FGG456C?

Both are the same die with the same speed grade and Pb-free package. The key difference is pin count: the FGG1205 offers 1205 solder balls for designs that need more PCB routing flexibility, power/ground plane distribution, or signal integrity improvements over the 456-ball variant.

Can I replace XC2S200-6FGG1205C with a newer Xilinx FPGA?

Yes. For new designs, Xilinx/AMD recommends migrating to the Spartan-6 or Artix-7 families, which provide better performance, lower power, and continued tool support in Vivado. However, for legacy system maintenance, the XC2S200-6FGG1205C remains a viable and available option.

What programming software do I need?

You need Xilinx ISE Design Suite 14.7 for synthesis, implementation, and bitstream generation. For programming the device, iMPACT (included with ISE) supports JTAG and parallel configuration methods.

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Summary: Why Choose the XC2S200-6FGG1205C?

The XC2S200-6FGG1205C combines the maximum logic density of the Spartan-II family with the fastest available speed grade and a large-pin-count, lead-free package. It is the optimal choice for:

• Designs with a high user I/O requirement (up to 284 I/Os)
• Applications demanding the highest Spartan-II clock performance (-6 speed)
• PCB layouts that benefit from a finer ball-pitch distribution across a 1205-pin footprint
• Commercial-temperature systems that need proven, battle-tested FPGA technology

For comprehensive information about compatible Xilinx products, current-generation alternatives, and sourcing assistance, explore the full range at Xilinx FPGA.