The XC2S200-6FGG1202C is a high-density, 2.5V Field Programmable Gate Array from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications that demand programmable logic flexibility, this device delivers 200,000 system gates, 5,292 logic cells, and a maximum operating frequency of 263 MHz — all packaged in a fine-pitch 1202-ball BGA (Ball Grid Array) for high pin-count system designs. Whether you’re building communication infrastructure, industrial control systems, or embedded processing solutions, the XC2S200-6FGG1202C offers the performance and reprogrammability that modern designs require.

For a broader selection of programmable logic solutions, visit Xilinx FPGA to explore compatible devices and procurement options.

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What Is the XC2S200-6FGG1202C? – Part Number Breakdown

Understanding the part number is essential for sourcing and design planning:

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XC2S200-6FGG1202C Key Specifications at a Glance

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XC2S200-6FGG1202C Architecture and Internal Features

## Configurable Logic Blocks (CLBs)

The XC2S200 uses a 28 × 42 CLB array totaling 1,176 configurable logic blocks. Each CLB contains:

• Two 4-input Look-Up Tables (LUTs) per slice for implementing any combinatorial function
• Dedicated flip-flops for synchronous design support
• Fast carry logic for high-speed arithmetic
• Wide function multiplexers for efficient logic packing

With 5,292 total logic cells, the XC2S200-6FGG1202C is well-suited for mid-complexity FPGA designs including state machines, data path logic, and bus interface controllers.

## Memory Resources: Distributed RAM and Block RAM

The XC2S200 provides two distinct forms of on-chip memory:

Block RAM supports true dual-port operation, enabling simultaneous read/write from two independent ports — critical for high-throughput pipeline designs.

## Input/Output Blocks (IOBs)

The XC2S200-6FGG1202C supports up to 284 user I/O pins (plus 4 dedicated global clock/user input pins not included in this count). IOB features include:

• Programmable input delay for setup time optimization
• Selectable input/output slew rate control
• Optional pull-up, pull-down, and keeper circuits
• Support for multiple I/O standards (LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL)

## Delay-Locked Loops (DLLs)

Four Delay-Locked Loops are placed at the corners of the die. DLLs provide:

• Zero clock distribution delay (eliminate clock skew)
• Frequency synthesis (multiply or divide clock inputs)
• Phase shifting for timing margin optimization

DLLs are essential for high-speed synchronous designs requiring predictable clock behavior.

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Speed Grade -6: What Does It Mean for the XC2S200-6FGG1202C?

The -6 speed grade is the fastest commercially available speed grade in the Spartan-II family. It is exclusively available in the Commercial temperature range (0°C to +85°C), making it ideal for applications where maximum performance is critical and elevated industrial temperature support is not required.

For industrial environments (−40°C to +85°C), the -5 speed grade variant should be selected instead.

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FGG1202 Package: High Pin-Count BGA for Complex System Designs

The FGG1202 package is a Fine-Pitch Ball Grid Array with 1,202 solder balls on a fine pitch grid. This package is suited for system-level designs requiring:

• A large number of I/O connections to memory, peripherals, or high-speed buses
• Compact PCB footprint versus through-hole or leaded packages
• Lead-free (Pb-free) assembly in compliance with RoHS directives

The “G” in FGG indicates Pb-free packaging, an important compliance requirement for consumer electronics, medical devices, and products sold in the EU, China, and other RoHS-regulated markets.

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Configuration Modes Supported by the XC2S200-6FGG1202C

During power-on and throughout configuration, all I/O drivers remain in a high-impedance state, preventing bus conflicts in shared-bus system designs. Configuration data can be stored in Xilinx PROMs or third-party serial/parallel flash memories.

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Typical Applications for the XC2S200-6FGG1202C

The XC2S200-6FGG1202C is widely used across industries that demand reprogrammable digital logic at a cost-effective price point:

### Telecommunications & Networking

• Protocol bridging and conversion (UART, SPI, I²C, Ethernet MAC)
• Line card controllers and framer/mapper interfaces
• Network packet classification and filtering

### Industrial Automation & Control

• PLC (Programmable Logic Controller) expansion
• Motor encoder interface logic
• Real-time sensor data acquisition and processing

### Embedded Computing & Co-Processing

• Custom bus arbitration logic
• SDRAM/SRAM memory controller implementation
• Hardware-accelerated data encryption/decryption

### Test & Measurement Equipment

• Logic analyzer front-end capture and decoding
• Waveform generation and signal synthesis
• High-speed ADC/DAC interface controllers

### Aerospace & Defense (prototype/non-flight grade)

• FPGA-based prototyping of ASIC designs
• Signal processing for RADAR/communication system emulation
• Redundancy logic and fault detection systems

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XC2S200-6FGG1202C vs. Other XC2S200 Package Variants

The XC2S200 die is available across multiple packages. The FGG1202 is the largest package variant, offering the most I/O routing flexibility on the PCB:

Note: While all XC2S200 variants share the same silicon (5,292 logic cells, 200K gates), the FGG1202 package provides additional ball routing resources and PCB design flexibility, making it preferred for designs with complex multi-layer PCB routing requirements.

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Spartan-II Family Comparison: Where Does XC2S200 Fit?

The XC2S200 sits at the top of the Spartan-II family, offering the highest gate count, the most memory, and the most I/O pins available within this product line.

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Design Tools and Software Support

The XC2S200-6FGG1202C is supported by Xilinx’s legacy ISE Design Suite, which includes:

• XST (Xilinx Synthesis Technology) – HDL synthesis for VHDL and Verilog
• Implementation Tools – Map, place-and-route, and timing analysis
• ChipScope Pro – On-chip debug and logic analysis
• iMPACT – Device programming and configuration

Designers migrating to newer Xilinx/AMD devices may use Vivado Design Suite, though Vivado does not natively support Spartan-II. ISE 14.7 remains the recommended toolchain for XC2S200 development.

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Ordering and Procurement Information

Important Notice: The XC2S200-6FGG1202C carries an NRND (Not Recommended for New Designs) status. It remains available for legacy system maintenance, repair, and long-lifecycle industrial applications. For new design starts, Xilinx recommends migrating to the Spartan-6 or Spartan-7 FPGA families, which offer superior performance, lower power consumption, and active production support.

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Frequently Asked Questions (FAQ)

Q: What is the maximum operating frequency of the XC2S200-6FGG1202C?
A: The -6 speed grade supports a maximum internal frequency of 263 MHz, making it the fastest speed grade in the Spartan-II XC2S200 lineup.

Q: Is the XC2S200-6FGG1202C RoHS compliant?
A: Yes. The double “G” (FGG) designation in the part number confirms Pb-free (lead-free) packaging in compliance with RoHS environmental regulations.

Q: What temperature range does the XC2S200-6FGG1202C support?
A: The “C” suffix designates the Commercial temperature range: 0°C to +85°C. The -6 speed grade is only available in the commercial range. For industrial range (−40°C to +85°C), consider the -5 speed grade variants.

Q: Can the XC2S200-6FGG1202C be used in new product designs?
A: Xilinx has designated this part as Not Recommended for New Designs (NRND). It is best suited for maintaining existing designs or legacy system boards. For new designs, the Spartan-6 or Spartan-7 families are preferred.

Q: What programming software is needed for the XC2S200-6FGG1202C?
A: Xilinx ISE Design Suite (version 14.7 is the final release) is the recommended toolchain. The device can be programmed via JTAG using Xilinx iMPACT or compatible third-party programming tools.

Q: How many I/O pins are available for user signals?
A: The XC2S200 supports up to 284 user-configurable I/O pins. Note that the four global clock/user input pins are not included in this count.

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Summary: Why Choose the XC2S200-6FGG1202C?

The XC2S200-6FGG1202C delivers a compelling combination of logic density, memory resources, I/O flexibility, and clock management in a reprogrammable package. Key reasons engineers select this device include:

• Top of Spartan-II family — Maximum gate count (200K), CLBs (1,176), and I/O (284) within the family
• Fastest speed grade — -6 grade at 263 MHz for time-critical logic paths
• Dual memory architecture — Both distributed LUT-RAM and dedicated block RAM for flexible memory mapping
• Four onboard DLLs — Eliminate clock skew and enable clock multiplication/division without external PLLs
• High pin-count FGG1202 package — Designed for complex, multi-signal PCB routing scenarios
• RoHS compliant — Pb-free packaging meets international environmental directives
• Broad I/O standard support — LVTTL, LVCMOS, PCI, HSTL, SSTL, GTL and more

For legacy system maintenance, repair orders, or high-volume procurement of the XC2S200-6FGG1202C, consult with authorized Xilinx distributors to confirm current stock availability and lead times.