The XC2S200-6FGG1200C is a high-density, commercially graded Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates in a large 1200-ball Fine-Pitch BGA (FBGA) package, operating at 2.5V with a –6 speed grade. Whether you are replacing an ASIC, shortening your design cycle, or enabling field-upgradeable logic, the XC2S200-6FGG1200C is a proven and versatile solution.
For a broader look at compatible devices, visit Xilinx FPGA for product listings, cross-references, and sourcing support.
What Is the XC2S200-6FGG1200C? Part Number Decoded
Understanding the part number helps engineers confirm compatibility, speed grade, and packaging requirements at a glance.
| Code Segment |
Value |
Meaning |
| XC2S200 |
Device |
Xilinx Spartan-II, 200K system gates |
| -6 |
Speed Grade |
Fastest commercial speed grade (–6) |
| FGG |
Package Type |
Fine-Pitch Ball Grid Array (Pb-Free) |
| 1200 |
Pin Count |
1200-ball BGA package |
| C |
Temperature Range |
Commercial (0°C to +85°C) |
Note: The “G” suffix in “FGG” confirms this is a Pb-free (RoHS-compliant) package variant, as per Xilinx’s standard ordering convention.
XC2S200-6FGG1200C Key Specifications
Core Logic Resources
| Parameter |
XC2S200 Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Delay-Locked Loops (DLLs) |
4 |
Electrical & Timing Characteristics
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Supply Voltage (VCCO) |
1.5V – 3.3V |
| Speed Grade |
–6 (fastest available) |
| Maximum Frequency |
Up to 263 MHz |
| Process Technology |
0.18 µm CMOS |
| Temperature Range |
0°C to +85°C (Commercial) |
Package Information
| Parameter |
Value |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Package Code |
FGG1200 |
| Total Pins |
1,200 |
| Lead-Free (Pb-Free) |
Yes |
| RoHS Compliant |
Yes |
Spartan-II Family Comparison: Where XC2S200 Fits
The XC2S200 is the largest device in the Spartan-II family, offering the most logic resources for complex designs within this product line.
| Device |
Logic Cells |
System Gates |
CLB Array |
Max I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 × 12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12 × 18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28 × 42 |
284 |
56K |
The XC2S200 delivers the highest gate count, the largest CLB array, and the most I/O pins in its family — making the XC2S200-6FGG1200C the best Spartan-II choice for bandwidth-demanding and I/O-intensive designs.
XC2S200-6FGG1200C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200 features a regular, programmable array of 1,176 CLBs arranged in a 28-column by 42-row matrix. Each CLB contains look-up tables (LUTs), flip-flops, and carry logic, enabling efficient implementation of arithmetic functions, state machines, and combinational logic.
Input/Output Blocks (IOBs)
The device supports up to 284 user I/O pins, each implemented through a flexible IOB. The IOBs support multiple I/O standards including LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL, and CTT, giving designers broad flexibility for interfacing with external devices and buses.
Block RAM
The XC2S200 contains 56K bits of dedicated block RAM, organized in two columns on opposite sides of the CLB array. Each block RAM is a true dual-port memory, independently configurable in width and depth, suitable for FIFOs, data buffers, and lookup tables.
Delay-Locked Loops (DLLs)
Four on-chip Delay-Locked Loops, placed at each corner of the die, eliminate clock distribution skew and enable clock multiplication, division, and phase shifting — critical for high-speed synchronous designs.
Speed Grade –6: What It Means for Your Design
The –6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the Commercial temperature range. This makes the XC2S200-6FGG1200C ideal for performance-critical applications where maximum clock frequency and minimum propagation delay are required.
| Speed Grade |
Relative Performance |
Temperature Range Available |
| –4 |
Slowest |
Commercial, Industrial |
| –5 |
Mid-range |
Commercial, Industrial |
| –6 |
Fastest |
Commercial only |
Typical Applications for the XC2S200-6FGG1200C
The XC2S200-6FGG1200C is widely used across industries where programmable logic replaces or supplements traditional ASICs:
#### Digital Signal Processing (DSP)
High gate counts and block RAM make the XC2S200 suitable for FIR filters, FFT engines, and real-time signal conditioning pipelines.
#### Communications & Networking
With 284 I/O pins and support for multiple I/O standards, this FPGA handles parallel data interfaces, serializers/deserializers, and protocol bridging in telecom equipment.
#### Industrial Control Systems
The programmability of the XC2S200-6FGG1200C enables field-updatable control logic, motor drive controllers, and sensor fusion systems — with no need to respin silicon when requirements change.
#### Embedded Systems & SoC Prototyping
Engineers use the XC2S200 to prototype custom peripherals and accelerators before committing to hard silicon, reducing development risk and time-to-market.
#### Test & Measurement Equipment
The large I/O count and distributed RAM support logic analyzers, pattern generators, and mixed-signal interfaces in bench instrumentation.
XC2S200-6FGG1200C vs. Alternative Packages
The XC2S200 is available in multiple packages. The FGG1200 package maximizes I/O density in PCB-constrained designs.
| Part Number |
Package |
Pins |
Lead-Free |
Speed Grade |
| XC2S200-6PQ208C |
PQFP |
208 |
No |
–6 |
| XC2S200-6FG256C |
FBGA |
256 |
No |
–6 |
| XC2S200-6FGG256C |
FBGA |
256 |
Yes |
–6 |
| XC2S200-6FG456C |
FBGA |
456 |
No |
–6 |
| XC2S200-6FGG1200C |
FBGA |
1,200 |
Yes |
–6 |
The FGG1200 package offers the highest pin count, providing maximum flexibility for high-I/O designs and board-level integration.
Configuration and Programming
The XC2S200-6FGG1200C is a SRAM-based FPGA, meaning it must be configured at power-up. Xilinx supports several configuration modes:
| Configuration Mode |
Interface |
Description |
| Master Serial |
SPI-like |
FPGA reads bitstream from external PROM |
| Slave Serial |
Serial |
External host loads bitstream |
| Master Parallel (SelectMAP) |
Parallel |
Fast configuration via 8-bit parallel bus |
| Boundary Scan (JTAG) |
JTAG (IEEE 1149.1) |
In-system programming and debug |
The JTAG interface also enables in-system debugging using Xilinx’s ChipScope Pro, allowing real-time internal signal monitoring without extra hardware.
Design Tool Support
The XC2S200-6FGG1200C is supported by Xilinx’s legacy ISE Design Suite, which includes synthesis, place-and-route, timing analysis, and bitstream generation tools. Key software components include:
| Tool |
Function |
| Xilinx ISE |
Synthesis, implementation, bitstream generation |
| XST / Synplicity |
RTL synthesis |
| ModelSim / ISIM |
HDL simulation |
| iMPACT |
Device programming via JTAG |
| ChipScope Pro |
In-system logic analysis |
Ordering Information & Compliance
| Attribute |
Detail |
| Manufacturer |
Xilinx (now AMD Xilinx) |
| Part Number |
XC2S200-6FGG1200C |
| Family |
Spartan-II |
| RoHS Status |
Compliant (Pb-free “G” package) |
| Operating Temperature |
0°C to +85°C |
| ECCN (Export Control) |
Consult AMD/Xilinx export compliance documentation |
| Lifecycle Status |
Mature / End-of-Life — verify availability with authorized distributors |
Frequently Asked Questions (FAQ)
What does the “-6” in XC2S200-6FGG1200C mean?
The –6 denotes the speed grade of the device. It is the fastest speed grade in the Spartan-II family and is available only in the Commercial (0°C to +85°C) temperature range.
Is the XC2S200-6FGG1200C RoHS compliant?
Yes. The “G” in “FGG” confirms that this is a Pb-free, RoHS-compliant package variant per Xilinx’s ordering nomenclature.
What is the maximum user I/O available on the XC2S200?
The XC2S200 supports up to 284 user I/O pins (excluding the four dedicated global clock/user input pins).
Can the XC2S200-6FGG1200C be reprogrammed in the field?
Yes. As an SRAM-based FPGA, the XC2S200-6FGG1200C can be fully reprogrammed at any time via JTAG or configuration PROM, making it ideal for field-upgradeable systems.
What software is used to program the XC2S200-6FGG1200C?
The device is programmed using Xilinx ISE Design Suite with the iMPACT programmer for JTAG-based configuration.
Summary
The XC2S200-6FGG1200C is a mature, high-performance Spartan-II FPGA that combines 200,000 system gates, 5,292 logic cells, 284 I/O pins, and dedicated block RAM in a Pb-free 1200-ball BGA package. Its –6 speed grade delivers maximum performance for commercial-temperature applications, while its SRAM-based programmability ensures full in-field reconfigurability. From DSP pipelines to industrial controllers and communications systems, this device remains a capable solution for a wide range of embedded logic applications.
For sourcing, cross-references, and compatible Xilinx programmable devices, visit Xilinx FPGA.
