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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1198C: Xilinx Spartan-II FPGA – Full Specifications, Features & Datasheet Guide

Product Details

The XC2S200-6FGG1198C is a high-density Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and housed in a large 1198-pin Fine-Pitch Ball Grid Array (FGG1198) package, this device delivers robust programmable logic performance for demanding commercial-grade applications. Whether you are designing telecommunications equipment, industrial control systems, or high-speed digital signal processing solutions, the XC2S200-6FGG1198C offers the flexibility, density, and speed you need.

For a broader selection of compatible devices, explore our Xilinx FPGA catalog.


What Is the XC2S200-6FGG1198C? Overview and Part Number Breakdown

The part number XC2S200-6FGG1198C encodes essential product information:

Code Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gates
-6 Speed Grade 6 (fastest commercial grade)
FGG Fine-Pitch Ball Grid Array, Pb-free package
1198 1198 total package pins
C Commercial temperature range (0°C to +85°C)

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the commercial temperature range, making this part optimized for high-throughput, time-critical digital designs.


XC2S200-6FGG1198C Key Specifications at a Glance

The table below summarizes the core electrical and logical specifications for the XC2S200-6FGG1198C:

Parameter Value
Device Family Xilinx Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42 (1,176 CLBs)
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Core Voltage 2.5V
Speed Grade -6 (263 MHz)
Package Type FGG1198 Fine-Pitch BGA
Total Pins 1,198
Operating Temperature 0°C to +85°C (Commercial)
Process Technology 0.18 µm
RoHS Compliance Pb-free (G suffix)

XC2S200-6FGG1198C Architecture and Internal Logic Structure

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1198C is built around a 28×42 array of Configurable Logic Blocks (CLBs), totaling 1,176 CLBs. Each CLB contains:

  • Look-Up Tables (LUTs) for implementing arbitrary combinational logic functions
  • Flip-Flops for sequential logic and pipelining
  • Multiplexers for flexible signal routing

This architecture enables the implementation of complex digital designs ranging from state machines and arithmetic units to entire CPU cores.

SelectRAM Hierarchical Memory

The XC2S200 provides a two-tier memory system:

Memory Type Capacity Location
Distributed RAM 75,264 bits Inside CLBs (16 bits/LUT)
Block RAM 56K bits (56,000 bits) Dedicated columns, dual-port

The 4K-bit true dual-port Block RAM modules allow simultaneous read and write operations at different addresses, ideal for FIFO buffers, lookup tables, and data queues in high-speed designs.

Input/Output Blocks (IOBs) and I/O Standards

The XC2S200-6FGG1198C supports up to 284 user I/O pins, each configurable to multiple industry-standard interfaces:

Supported I/O Standard Description
LVTTL Low Voltage TTL
LVCMOS2 Low Voltage CMOS 2.5V
PCI 3.3V PCI bus compatible
GTL / GTL+ Gunning Transceiver Logic
HSTL High-Speed Transceiver Logic
SSTL2 / SSTL3 Stub Series Terminated Logic

Each IOB includes input/output registers, programmable slew rate control, and optional pull-up/pull-down resistors, providing maximum flexibility for board-level interfacing.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide:

  • Zero-delay clock distribution across the entire chip
  • Clock frequency synthesis and multiplication
  • Phase adjustment for timing-critical designs
  • Jitter reduction for high-speed clock networks

XC2S200-6FGG1198C Performance Specifications

Timing and Speed Grade Details

Performance Metric XC2S200 Speed Grade -6
Maximum System Frequency 263 MHz
Internal Clock-to-Output (Tcko) Fast, grade-dependent
Setup Time (Tsu) Grade-dependent
DLL Lock Time Typically < 1 ms

The -6 speed grade is the highest-performance variant in the Spartan-II family, delivering the shortest propagation delays and highest toggle frequencies for commercial applications.

Power Consumption

Supply Rail Voltage Purpose
VCCINT 2.5V Core logic power
VCCO 2.5V / 3.3V I/O bank supply
VREF Configurable Reference for differential standards

The Spartan-II family is engineered for low-power operation, with static and dynamic power consumption well-suited for cost-sensitive, high-volume applications.


FGG1198 Package Details and PCB Design Considerations

Package Overview

Package Attribute Detail
Package Type Fine-Pitch Ball Grid Array (FGG)
Total Pins 1,198
Ball Pitch Fine-pitch (standard BGA spacing)
Pb-Free Yes (G suffix in FGG)
Mounting Style Surface Mount (SMD)

The FGG1198 package is a large-format BGA that provides a high pin count for designs requiring extensive I/O connectivity. When designing PCBs for this package, engineers should consider:

  • Via-in-pad or dog-bone routing to escape BGA balls efficiently
  • Controlled impedance traces for high-speed I/O signals
  • Adequate decoupling capacitors placed close to VCCINT and VCCO pins
  • Thermal management using copper pours and vias under the device

XC2S200-6FGG1198C vs. Other Spartan-II Family Members

Understanding where the XC2S200 sits within the Spartan-II family helps engineers choose the right device:

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8×12 86 16K
XC2S30 972 30,000 12×18 92 24K
XC2S50 1,728 50,000 16×24 176 32K
XC2S100 2,700 100,000 20×30 176 40K
XC2S150 3,888 150,000 24×36 260 48K
XC2S200 5,292 200,000 28×42 284 56K

The XC2S200 is the largest and highest-density member of the Spartan-II family, offering the maximum logic resources, I/O count, and memory capacity available in this series.


Configuration and Programming the XC2S200-6FGG1198C

Supported Configuration Modes

The XC2S200-6FGG1198C can be configured through several industry-standard methods:

Configuration Mode Description
Master Serial From external serial PROM (e.g., XCF series)
Slave Serial Driven by an external microcontroller
Master Parallel (SelectMAP) High-speed byte-wide configuration
Slave Parallel (SelectMAP) Byte-wide controlled by a host processor
JTAG (Boundary Scan) IEEE 1149.1 compliant; supports in-system programming

JTAG configuration is especially useful for production testing and in-field firmware updates without physical hardware changes.

Recommended Design Tools

Tool Purpose
Xilinx ISE Design Suite Synthesis, implementation, and bitstream generation
ModelSim / ISIM HDL simulation and functional verification
IMPACT / iMPACT Device programming and configuration
ChipScope Pro In-system logic analysis and debugging

Applications for the XC2S200-6FGG1198C FPGA

The XC2S200-6FGG1198C’s combination of high gate density, abundant I/O, and fast -6 speed grade makes it suitable for a wide range of industries:

#### Telecommunications and Networking

  • High-speed protocol bridging (Ethernet, SONET, ATM)
  • Network packet classification and routing logic
  • Line card control and management planes

#### Industrial Automation and Motor Control

  • Precision motor drive control algorithms
  • Multi-axis CNC machine control
  • Real-time sensor data acquisition and processing

#### Digital Signal Processing (DSP)

  • FIR/IIR digital filter implementations
  • FFT accelerators for spectrum analysis
  • Software-defined radio (SDR) front-end processing

#### Medical and Scientific Instrumentation

  • Ultrasound and medical imaging front-end control
  • Data acquisition for diagnostic equipment
  • Patient monitoring signal processing pipelines

#### Aerospace and Defense

  • Radiation-tolerant logic emulation (non-rad-hard variant)
  • Embedded control and I/O expansion
  • Secure data processing and encryption engines

XC2S200-6FGG1198C Ordering Information and Availability

When ordering the XC2S200-6FGG1198C, verify the following from authorized distributors:

Field Detail
Manufacturer Xilinx (now AMD Xilinx)
Part Number XC2S200-6FGG1198C
Speed Grade -6 (Commercial, fastest)
Temperature Range 0°C to +85°C
Package FGG1198 (Pb-free Fine-Pitch BGA)
RoHS Status Compliant (Pb-free)
Lifecycle Status Not Recommended for New Designs (NRND)

Note: As with all Spartan-II series devices, the XC2S200-6FGG1198C carries an NRND (Not Recommended for New Designs) designation. It remains available for legacy maintenance, spares, and existing production lines. Engineers starting new projects should evaluate the Spartan-6, Artix-7, or Kintex-7 families as modern alternatives.


Frequently Asked Questions (FAQ) About the XC2S200-6FGG1198C

Q: What does the “-6” in XC2S200-6FGG1198C mean? The -6 is the speed grade, indicating this is the fastest commercial variant of the XC2S200. It supports a maximum system frequency of up to 263 MHz and is only available in the commercial temperature range (0°C to +85°C).

Q: How many user I/O pins does the XC2S200-6FGG1198C have? The XC2S200 supports up to 284 user I/O pins. Note that the four global clock/user input pins are separate from this count.

Q: Is the XC2S200-6FGG1198C Pb-free (RoHS compliant)? Yes. The “G” in the FGG package designation indicates it is the Pb-free, RoHS-compliant variant.

Q: What programming tools are compatible with the XC2S200-6FGG1198C? This device is supported by the Xilinx ISE Design Suite (the legacy toolchain for pre-7-series devices) using VHDL or Verilog HDL. Programming is performed via iMPACT software over JTAG or through a configuration PROM.

Q: What is a suitable modern alternative to the XC2S200-6FGG1198C? For new designs, AMD Xilinx recommends devices from the Spartan-6 or Artix-7 families, which offer significantly higher performance, lower power consumption, and modern toolchain support via Vivado Design Suite.


Summary: Why Choose the XC2S200-6FGG1198C for Legacy and Maintenance Designs

The XC2S200-6FGG1198C remains one of the most capable devices in the Spartan-II lineup, providing:

  • The maximum logic density available in the Spartan-II family (200K gates, 5,292 cells)
  • The fastest commercial speed grade (-6) at up to 263 MHz
  • 284 user I/O pins with support for 19 selectable I/O standards
  • 75,264 bits distributed RAM plus 56K bits block RAM
  • Four DLLs for zero-skew, phase-aligned clock distribution
  • A Pb-free FGG1198 BGA package for reliable, lead-free assembly

For engineers maintaining existing Spartan-II based platforms or sourcing end-of-life spares, the XC2S200-6FGG1198C delivers proven, well-documented performance backed by Xilinx’s extensive application note library.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.