Meta Description: Buy XC2S200-6FGG1183C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, 1183-ball FGG BGA package, 2.5V, commercial temp. Full specs, tables & datasheet.

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XC2S200-6FGG1183C: The Xilinx Spartan-II FPGA Built for High-Density Commercial Designs

The XC2S200-6FGG1183C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. This device combines 200,000 system gates, 5,292 logic cells, and the fastest commercial speed grade (-6) in a large-scale 1183-ball Fine-Pitch BGA (FGG) package. It operates on a 2.5V core supply and targets commercial-temperature applications where density, speed, and cost-effectiveness are top priorities.

Whether you are designing embedded systems, digital signal processing boards, or high-volume consumer electronics, the XC2S200-6FGG1183C delivers the programmable logic density and I/O flexibility your design demands. For a broader look at the complete product lineup, explore our full range of Xilinx FPGA solutions.

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What Is the XC2S200-6FGG1183C? Part Number Decoded

Understanding the part number helps engineers quickly identify the exact variant they need.

Note: The “-6” speed grade is exclusively available in the commercial temperature range, making the XC2S200-6FGG1183C ideal for non-industrial, high-speed commercial applications.

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XC2S200-6FGG1183C Key Specifications at a Glance

The table below summarizes the core electrical and physical specifications of the XC2S200-6FGG1183C.

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Core Architecture of the XC2S200-6FGG1183C

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1183C features a 28 × 42 CLB array, providing 1,176 total CLBs. Each CLB contains four logic cells (slices), and each slice includes two 4-input Look-Up Tables (LUTs) and two D flip-flops. This architecture enables rapid implementation of complex combinational and sequential logic with minimal routing delays.

Input/Output Blocks (IOBs)

This device supports up to 284 user-configurable I/O pins. Each IOB supports multiple I/O standards, including:

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1183C integrates four Delay-Locked Loops (DLLs), placed at each corner of the die. These DLLs enable:

• Zero-delay clock distribution across the device
• Clock frequency synthesis and multiplication
• Phase shifting for interface timing optimization
• Elimination of clock-distribution skew

Block RAM Architecture

Two dedicated block RAM columns run along opposite sides of the die, between the CLB core and the IOB columns. The XC2S200 device offers 56K bits of total block RAM, split across multiple 4K-bit dual-port RAM blocks. These are ideal for FIFO buffers, lookup tables, and on-chip data storage.

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XC2S200-6FGG1183C vs. Other Spartan-II Family Members

Placing the XC2S200-6FGG1183C in context within the full Spartan-II family helps engineers select the right device for their design requirements.

The XC2S200 is the largest and most feature-rich device in the Spartan-II family. The -6 speed grade and the FGG1183 package make the XC2S200-6FGG1183C the top-tier configuration available.

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Speed Grade Comparison: Why -6 Matters

Xilinx Spartan-II devices are available in multiple speed grades. The speed grade directly impacts propagation delay, setup/hold times, and maximum operating frequency.

The -6 speed grade is the fastest available for the XC2S200 and is exclusively offered in the commercial temperature range (0°C to +85°C). This makes the XC2S200-6FGG1183C the right choice for performance-critical, high-clock-rate designs.

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Configuration and Programming

Configuration Modes

The XC2S200-6FGG1183C supports multiple configuration modes that allow flexible integration into any system architecture:

Supported Design Tools

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Typical Applications of the XC2S200-6FGG1183C

The XC2S200-6FGG1183C is a versatile programmable logic device used across many industries and design domains.

#### Industrial & Embedded Control

• Motor control systems and servo drives
• Industrial automation and PLC replacement
• Real-time sensor data acquisition

#### Communications & Networking

• Protocol bridging (PCI, UART, SPI, I²C)
• Line-card logic and network switch fabric
• High-speed serial interface glue logic

#### Consumer Electronics & Computing

• Set-top boxes and digital TV decoders
• Printer and peripheral controller logic
• PC expansion card interfaces

#### Test & Measurement Equipment

• Logic analyzer front-ends
• Signal processing in oscilloscopes
• Hardware-accelerated bit-error-rate testers

#### Aerospace & Defense (Commercial Grade Use)

• Rapid prototyping for communications payloads
• Ground-based test equipment
• Software-defined radio front-end control

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Advantages of the XC2S200-6FGG1183C Over Mask-Programmed ASICs

One of the greatest strengths of the XC2S200-6FGG1183C is its programmability. Unlike mask-programmed ASICs, this FPGA offers several key advantages:

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Ordering Information & Package Options for XC2S200

Xilinx offered the XC2S200 device in several package configurations. The table below shows the available orderable variants.

The FGG1183C variant features Pb-free (“G” suffix) packaging with 1,183 balls and is optimized for commercial temperature environments.

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Absolute Maximum Ratings

Warning: Operating outside these absolute maximum ratings may cause permanent damage to the device.

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DC Electrical Characteristics

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Frequently Asked Questions (FAQ)

What does the “6” in XC2S200-6FGG1183C mean?

The “-6” designates the speed grade of the device. It is the fastest commercially available grade for the Spartan-II XC2S200. Higher speed grades provide lower propagation delays and support higher maximum clock frequencies. Importantly, the -6 speed grade is only offered in the commercial temperature range (0°C to +85°C).

What is the FGG1183 package?

The FGG1183 is a Fine-Pitch Ball Grid Array package with 1,183 solder balls arranged in a grid pattern on the bottom of the package. The “G” in “FGG” indicates a Pb-free (lead-free) construction, making it RoHS-compliant. This large ball count allows maximum routing flexibility on the PCB.

Is the XC2S200-6FGG1183C still in production?

The Xilinx Spartan-II family has reached end-of-life (EOL) status. However, the XC2S200-6FGG1183C remains widely available through authorized distributors and excess inventory channels for legacy system maintenance and production support.

What design tools support the XC2S200-6FGG1183C?

The recommended design tool is Xilinx ISE Design Suite, which supports VHDL and Verilog-based design entry, synthesis, place & route, and bitstream generation for Spartan-II devices.

Can the XC2S200-6FGG1183C be used in industrial temperature applications?

No. The “C” suffix indicates the commercial temperature range (0°C to +85°C). For industrial temperature range (-40°C to +85°C), you would need the “I” suffix variant. Note that the -6 speed grade is not available in the industrial temperature range.

What is a good substitute for the XC2S200-6FGG1183C?

For new designs, Xilinx recommends migrating to the Spartan-3 or Spartan-6 families, which offer more logic resources, lower power consumption, and continued tool support. The XC3S400 or XC3S1000 are common upgrade paths.

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Why Choose the XC2S200-6FGG1183C for Your Design?

The XC2S200-6FGG1183C stands out among Spartan-II variants for several practical reasons:

• Maximum density in the Spartan-II family with 200K gates and 5,292 logic cells
• Fastest speed grade (-6) for the most timing-critical commercial applications
• Pb-free FGG package for RoHS compliance in modern supply chains
• 1,183-ball BGA for high I/O-count PCB designs with dense routing requirements
• Four on-chip DLLs for clean, zero-skew clock distribution
• Versatile I/O standards supporting PCI, LVTTL, SSTL, HSTL, and more
• JTAG boundary scan for easy in-system testing and debugging

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Summary

The XC2S200-6FGG1183C is the largest, fastest, and most I/O-rich configuration in the Xilinx Spartan-II FPGA family. With 200,000 system gates, 5,292 logic cells, 284 user I/Os, 56K bits of block RAM, and four DLLs, it delivers the programmable logic horsepower needed for demanding commercial applications. The -6 speed grade pushes performance to the maximum possible level within the Spartan-II architecture, while the 1,183-ball Pb-free BGA package ensures compatibility with modern, lead-free PCB assembly processes.

For engineers sourcing Xilinx programmable logic devices, the XC2S200-6FGG1183C remains a trusted solution for legacy system support and cost-effective FPGA-based design.